7208L25P datasheet, PDF - EEWORLD Datasheet

7208L25P: DescriptionFIFO, 64KX9, 25ns, Asynchronous, CMOS, PDIP28, PLASTIC, DIP-28; Categorystorage storage; File Size966KB，13 Pages; ManufacturerIDT (Integrated Device Technology)

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7208L25P Overview

FIFO, 64KX9, 25ns, Asynchronous, CMOS, PDIP28, PLASTIC, DIP-28

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	PLASTIC, DIP-28
Contacts	28
Reach Compliance Code	_compli
ECCN code	EAR99
Maximum access time	25 ns
Other features	RETRANSMIT
Maximum clock frequency (fCLK)	28.5 MHz
period time	35 ns
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	36.576 mm
memory density	589824 bi
Memory IC Type	OTHER FIFO
memory width	9
Humidity sensitivity level	1
Number of functions	1
Number of terminals	28
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64KX9
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.699 mm
Maximum standby current	0.008 A
Maximum slew rate	0.12 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	15.24 mm
Base Number Matches	1

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