ZL30415GGF datasheet, PDF - EEWORLD Datasheet

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ZL30415GGF: DescriptionIC pll sonet/sdh clk mult 64cbga; CategoryWireless rf/communication Telecom circuit; File Size372KB，23 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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ZL30415GGF Overview

IC pll sonet/sdh clk mult 64cbga

ZL30415GGF Parametric

Parameter Name	Attribute value
Maker	Microsemi
Objectid	1846164684
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	64
Reach Compliance Code	compli
compound_id	6929331
JESD-30 code	S-PBGA-B64
JESD-609 code	e0
length	8 mm
Number of functions	1
Number of terminals	64
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Certification status	Not Qualified
Maximum seat height	1.41 mm
Nominal supply voltage	3.3 V
surface mount	YES
Telecom integrated circuit types	ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	8 mm

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ZL30415

SONET/SDH Clock Multiplier PLL

Data Sheet

Features

•

Meets jitter requirements of Telcordia GR-253-

CORE for OC-12, OC-3, and OC-1 rates

Meets jitter requirements of ITU-T G.813 for STM-

4, and STM-1 rates

Provides one differential LVPECL output clock

selectable to 19.44 MHz, 38.88 MHz, 77.76 MHz,

155.52 MHz, or 622.08 MHz

Provides a single-ended CMOS output clock at

19.44 MHz

Accepts a single-ended CMOS reference at

19.44 MHz or a differential LVDS, LVPECL, or

CML reference at 19.44 MHz or 77.76 MHz

Provides a LOCK indication

3.3 V supply

Ordering Information

ZL30415GGC

ZL30415GGF

Trays

Tape & Reel,

Bake & Drypack

ZL30415GGG2 64 Ball CABGA** Trays, Bake & Drypack

ZL30415GGF2 64 Ball CABGA** Tape & Reel,

Bake & Drypack

**Pb Free Tin/Silver/Copper

-40°C to +85°C

64 Ball CABGA

September 2006

•

Description

The ZL30415 is an analog phase-locked loop (APLL)

designed to provide jitter attenuation and rate

conversion for SDH (Synchronous Digital Hierarchy)

and SONET (Synchronous Optical Network)

networking equipment. The ZL30415 generates low

jitter output clocks that meet the jitter requirements of

Telcordia GR-253-CORE OC-12, OC-3, OC-1 rates

and ITU-T G.813 STM-4 and STM-1 rates.

The ZL30415 accepts a CMOS compatible reference

at 19.44 MHz or a differential LVDS, LVPECL, or CML

reference at 19.44 MHz or 77.76 MHz and generates a

differential LVPECL output clock selectable to

19.44 MHz, 38.88 MHz, 77.76 MHz, 155.52 MHz, or

622.08 MHz, and a single-ended CMOS clock at

19.44 MHz. The ZL30415 provides a lock indication.

•

Applications

•

SONET/SDH line cards

REF_SEL

LPF

FS3

FS2 FS1

C19o, C38o, C77o,

C155o, C622o,

LVPECL output

C19i

Reference

Selection

MUX

Frequency

& Phase

Detector

Loop

Filter

VCO

REFinP/N

19.44 MHz and 77.76 MHz

State

Machine

Reference

and

Bias Circuit

Frequency

Dividers

and

Clock

Drivers

OC-CLKoP/N

C19o

C19i or C77i

CML, LVDS,

LVPECL input

REF_FREQ

LOCK

BIAS

VCC

GND

VDD

C19oEN

Figure 1 - Functional Block Diagram

Zarlink Semiconductor Inc.

Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.

ZL30415GGF Related Products

	ZL30415GGF	ZL30415GGC	ZL30415GGG2	ZL30415GGF2
Description	IC pll sonet/sdh clk mult 64cbga	IC pll sonet/sdh clk mult 64cbga	IC pll sonet/sdh clk mult 64cbga	Support Circuit, 1-Func, PBGA64, 8 X 8 MM, 0.80 MM PITCH, LEAD FREE, CABGA-64
Maker	Microsemi	Microsemi	Microsemi	Microsemi
package instruction	LFBGA,	8 X 8 MM, 0.80 MM PITCH, CABGA-64	LFBGA,	LFBGA,
Reach Compliance Code	compli	unknow	compli	compliant
JESD-30 code	S-PBGA-B64	S-PBGA-B64	S-PBGA-B64	S-PBGA-B64
length	8 mm	8 mm	8 mm	8 mm
Number of functions	1	1	1	1
Number of terminals	64	64	64	64
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFBGA	LFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.41 mm	1.41 mm	1.41 mm	1.41 mm
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES
Telecom integrated circuit types	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	8 mm	8 mm	8 mm	8 mm
Parts packaging code	BGA	BGA	-	BGA
Contacts	64	64	-	64
JESD-609 code	e0	e0	-	e1
Terminal surface	TIN LEAD	TIN LEAD	-	TIN SILVER COPPER
Is it Rohs certified?	-	incompatible	conform to	conform to

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