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KMPC8245LVV266D

Description
IC mpu 32bit 266mhz 352-tbga
Categorysemiconductor    The embedded processor and controller   
File Size425KB,68 Pages
ManufacturerFREESCALE (NXP)
Environmental Compliance  
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KMPC8245LVV266D Overview

IC mpu 32bit 266mhz 352-tbga

KMPC8245LVV266D Parametric

Parameter NameAttribute value
Datasheets
MPC8245
Product Photos
MPC8245 SERIES
Standard Package2
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microprocessors
PackagingTray
Core ProcessPowerPC 603e
Number of Cores/Bus Width1 Core, 32-Bi
Speed266MHz
Co-Processors/DSP-
RAM ControllersSDRAM
Graphics AcceleratiN
Display & Interface Controllers-
Etherne-
SATA-
USB-
Voltage - I/O3.3V
Operating Temperature0°C ~ 105°C
Security Features-
Package / Case352-LBGA
Supplier Device Package352-TBGA (35x35)
Additional InterfacesI²C, I²O, PCI, UART
Freescale Semiconductor
Technical Data
MPC8245EC
Rev. 10, 08/2007
MPC8245 Integrated Processor
Hardware Specifications
The MPC8245 combines a PowerPC™ MPC603e processor
core built on Power Architecture™ technology with a PCI
bridge so that system designers can rapidly design systems
using peripherals designed for PCI and the other standard
interfaces. Also, a high-performance memory controller
supports various types of ROM and SDRAM. The MPC8245
is the second of a family of products that provide
system-level support for industry-standard interfaces with an
MPC603e processor core.
This hardware specification describes pertinent electrical
and physical characteristics of the MPC8245. For functional
characteristics of the processor, refer to the
MPC8245
Integrated Processor Reference Manual
(MPC8245UM).
For published errata or updates to this document, visit the
website listed on the back cover of the document.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical and Thermal Characteristics . . . . . . . . . . . . 5
Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 31
PLL Configurations . . . . . . . . . . . . . . . . . . . . . . . . . 39
System Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Document Revision History . . . . . . . . . . . . . . . . . . . 56
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 62
1
Overview
The MPC8245 integrated processor is composed of a
peripheral logic block and a 32-bit superscalar MPC603e
core, as shown in
Figure 1.
© Freescale Semiconductor, Inc., 2001–2007. All rights reserved.

KMPC8245LVV266D Related Products

KMPC8245LVV266D KMPC8245ARVV400D KMPC8245ARZU400D KMPC8245LZU300D KMPC8245LZU333D KMPC8245TZU333D KMPC8245LZU350D KMPC8245TVV333D KMPC8245LVV333D KMPC8245LZU266D
Description IC mpu 32bit 266mhz 352-tbga IC mpu 32bit 400mhz 352-tbga IC,MICROPROCESSOR,32-BIT,CMOS,BGA,352PIN,PLASTIC IC,MICROPROCESSOR,32-BIT,CMOS,BGA,352PIN,PLASTIC IC,MICROPROCESSOR,32-BIT,CMOS,BGA,352PIN,PLASTIC 32-BIT, 333MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352 IC,MICROPROCESSOR,32-BIT,CMOS,BGA,352PIN,PLASTIC IC mpu 32bit 333mhz 352-tbga IC mpu 32bit 333mhz 352-tbga 32-BIT, 266MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
Is it Rohs certified? - - incompatible incompatible incompatible incompatible incompatible - - incompatible
Objectid - - 108262069 2020912462 2020912465 2020912477 2020912468 - - 2020912459
Reach Compliance Code - - not_compliant not_compliant not_compliant not_compliant not_compliant - - not_compliant
bit size - - 32 32 32 32 32 - - 32
JESD-30 code - - S-PBGA-B352 S-PBGA-B352 S-PBGA-B352 S-PBGA-B352 S-PBGA-B352 - - S-PBGA-B352
Humidity sensitivity level - - 3 3 3 3 3 - - 3
Number of terminals - - 352 352 352 352 352 - - 352
Package body material - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY
encapsulated code - - BGA LBGA LBGA LBGA LBGA - - LBGA
Encapsulate equivalent code - - BGA352,26X26,50 BGA352,26X26,50 BGA352,26X26,50 BGA352,26X26,50 BGA352,26X26,50 - - BGA352,26X26,50
Package shape - - SQUARE SQUARE SQUARE SQUARE SQUARE - - SQUARE
Package form - - GRID ARRAY GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE - - GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) - - 220 220 220 220 220 - - 220
Certification status - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - - Not Qualified
speed - - 400 MHz 300 MHz 333 MHz 333 MHz 350 MHz - - 266 MHz
surface mount - - YES YES YES YES YES - - YES
technology - - CMOS CMOS CMOS CMOS CMOS - - CMOS
Terminal form - - BALL BALL BALL BALL BALL - - BALL
Terminal pitch - - 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm - - 1.27 mm
Terminal location - - BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM - - BOTTOM
Maximum time at peak reflow temperature - - 30 30 30 30 30 - - 30
uPs/uCs/peripheral integrated circuit type - - MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC - - MICROPROCESSOR, RISC

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