are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to
“Absolute Maximum Ratings”
conditions for
extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability, use for input of the same package only.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential (GND) on the PCB.
ψ
JB
uses
4-layer
θ
JA
in still-air measurment, unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. Includes current through internal 50Ω pull-ups.
7. V
IH
(min) not lower than 1.2V.
M9999-082807
hbwhelp@micrel.com or (408) 955-1690
3
Micrel, Inc.
Precision Edge
®
SY58017U
CML OUTPUT DC ELECTRICAL CHARACTERISTICS
(8)
V
CC
= 2.5V
±5%
or 3.3V
±10%;
T
A
= –40°C to 85°C; R
L
= 100Ω across each output pair, or equivalent, unless otherwise stated.
Symbol
V
OH
V
OUT
V
DIFF_OUT
R
OUT
Parameter
Output HIGH Voltage
Output Voltage Swing
Differential Output Voltage Swing
Output Source Impedance
See Figure 1a
See Figure 1b
Condition
Min
V
CC
–0.020
325
650
40
400
800
50
60
Typ
Max
V
CC
Units
V
mV
mV
Ω
LVTTL/CMOS DC ELECTRICAL CHARACTERISTICS
(8)
V
CC
= 2.5V
±5%
or 3.3V
±10%;
T
A
= -40°C to 85°C, unless otherwise stated.
Symbol
V
IH
V
IL
I
IH
I
IL
Note:
8. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
Parameter
Input HIGH Voltage
Input LOW Voltage
Input HIGH Current
Input LOW Current
Condition
Min
2.0
Typ
Max
Units
V
0.8
40
–300
V
µA
µA
M9999-082807
hbwhelp@micrel.com or (408) 955-1690
4
Micrel, Inc.
Precision Edge
®
SY58017U
AC ELECTRICAL CHARACTERISTICS
(9)
V
CC
= 2.5V
±5%
or 3.3V
±10%;
T
A
= –40°C to 85°C, R
L
= 100Ω across each output pair, or equivalent, unless otherwise stated.
Symbol
f
MAX
t
pd
t
pd
Tempco
t
SKEW
t
JITTER
Data
Clock
Parameter
Maximum Operating Frequency
V
OUT
≥
200mV
Differential Propagation Delay
Condition
NRZ Data
Clock
IN-to-Q
SEL-to-Q
Differential Propagation Delay
Temperature Coefficient
Input-to-Input Skew
Part-to-Part Skew
Random Jitter
Deterministic Jitter
Cycle-to-Cycle Jitter
Total Jitter
Crosstalk-Induced Jitter
Note 16
t
r
, t
f
Notes:
9. High-frequency AC parameters are guaranteed by design and characterization.
10. Input-to-input skew is the difference in time from and input-to-output in comparison to any other input-to-output. In addition, the input-input skew does
not include the output skew.
11. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the
respective inputs.
12. RJ is measured with a K28.7 comma detect character pattern, measured at 2.5Gbps/3.2Gbps.
13. DJ is measured at 2.5Gbps/3.2Gbps, with both K28.5 and 2
23
–1 PRBS pattern.
14. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, T
n
–T
n–1
where T is the time between rising edges of the output
signal.
15. Total jitter definition: with an ideal clock input of frequency
≤
f
MAX
, no more than one output edge in 10
12
output edges will deviate by more than the
specified peak-to-peak jitter value.
16. Crosstalk is measured at the output while applying two similar frequencies that are asynchronous with respect to each other at the inputs.
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Embedded System
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