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LE57D122BTC

Description
IC slic 2ch 63db 44tqfp
CategoryWireless rf/communication    Telecom circuit   
File Size371KB,24 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
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LE57D122BTC Overview

IC slic 2ch 63db 44tqfp

LE57D122BTC Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
Parts packaging codeQFP
package instructionHTQFP,
Contacts44
Reach Compliance Codecompli
JESD-30 codeS-PQFP-G44
JESD-609 codee3
length10 mm
Number of functions1
Number of terminals44
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHTQFP
Package shapeSQUARE
Package formFLATPACK, HEAT SINK/SLUG, THIN PROFILE
Certification statusNot Qualified
Maximum seat height1.2 mm
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesSLIC
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
width10 mm
Dual Subscriber Line Interface Circuit
VE580 Series
APPLICATIONS
Ideal for low-cost, high performance line card
applications (CO, DLC)
Meets requirements for countries such as: India,
China, Korea, Japan, Taiwan, and Australia
Meets requirements for North America DLC
applications (TR-57-CORE)
Le5712
DESCRIPTION
The innovative Le5712 dual-channel SLIC device is designed
for high-density POTS applications requiring a small-footprint,
low-power SLIC device. By combining a fully featured line
interface of two channels into one SLIC device, the Le5712
device enables the design of a low-cost, high performance, and
fully programmable line interface for multiple country
applications worldwide, including Ground Start and metering
capability. The on-chip Thermal Management (TMG) feature
allows for significantly reduced power dissipation on the
device. Optional dual battery operation to reduce total power
consumption is also available. The device is offered in a
thermally efficient, space-saving 44-pin eTQFP package. The
12 x 12 mm footprint allows designers to make a dramatic
increase in the density of lines on a board. The Le5712 device
is also designed to significantly reduce the number of external
components required for line card design.
Zarlink offers a range of compatible SLAC™ devices that
perform the codec function in a line card. In particular, the
Zarlink
Quad and Octal SLAC devices combined with the
Le5712 device provides a programmable line circuit that can
be configured for varying requirements.
FEATURES
Dual-Channel SLIC device with small footprint
Loop start and Ground start support
+5 V and battery supply required
Optional dual battery operation
–39 to –60 V battery operation
Supplies more than 20 mA into 2000
from –48 V
Programmable current limit
On-chip Thermal Management (TMG) feature in all
Active states
Low standby power (24 mW per channel)
Supports 2.0 Vrms metering applications
Control states: Active and Active Metering (Normal and
Reverse Polarity), Standby, Tip Open and Disconnect
3.3-V compatible to logic control inputs
Power up in Disconnect state
On-hook transmission in Active states
Per-channel fault detection and indication
Per-channel thermal shutdown
Programmable Off Hook and Ground Start thresholds.
Programmable ring-trip detect threshold
Footprint compatible with
Zarlink’s
Le5711 Dual SLIC
RELATED LITERATURE
081110 Thermal Management for the Le5711 and
Le5712 SLIC Devices Application Note
080900 Le5711 and Le5712 Comparison Brief
Application Note
080753 Le58QL02/021/031 QLSLAC
Data Sheet
080754 Le58QL061/063 QLSLAC
Data Sheet
080921 Le58083 Octal SLAC
Data Sheet
080676 Le5711 Dual SLIC Data Sheet
BLOCK DIAGRAM
DET
2
DET
1
FLT
2
IREF
Device
Le57D121BTC
Le57D122BTC
1.
Package Type
1
44-pin eTQFP (Green),
–53 dB, Reverse Polarity
44-pin eTQFP (Green),
–63 dB, Reverse Polarity
Packing
2
CH2
Fault
Detector
CH1
Fault
Detector
Tray
TMG
2
AD
2
HP
2
BD
2
The green package meets RoHS Directive 2002/95/EC of the
European Council to minimize the environmental impact of
electrical equipment.
For delivery using a tape and reel packing system, add a "T" suffix
to the OPN (Ordering Part Number) when placing an order.
CH2
2-W
Interface
CH2
Input
Decoder
and Control
Common
Bias
CH1
Input
Decoder
and Control
FLT
1
CAS
C2
2
C3
2
C1
2
C1
1
C2
1
C3
1
RD
ORDERING INFORMATION
TMG
1
CH1
2-W
Interface
AD
1
HP
1
BD
1
2.
CH2
CH2
CH2
CH2
CH1
CH1
CH1
CH1
Signal
Transmission
Off-Hook &
Ground Start
Detector
Off-Hook &
Ground Start
Detector
Signal
Transmission
Power Feed
Controller
Power Feed
Controller
VTX
2
VTX
1
Ring Trip
Detector
Ring Trip
Detector
RSN
2
RSN
1
BGND
1
BGND
2
CDC
2
VBREF
VBAT
CDC
1
DB
2
DAC
DB
1
VCC
AGND/
DGND
120402
Document ID#
081047
Date:
Rev:
G
Version:
Distribution:
Public Document
Sep 18, 2007
2

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Description IC slic 2ch 63db 44tqfp IC slic 2ch 53db 44tqfp IC slic 2ch 53db 44tqfp IC slic 2ch 63db 44tqfp
Is it Rohs certified? conform to conform to conform to conform to
Maker Microsemi Microsemi Microsemi Microsemi
Parts packaging code QFP QFP QFP QFP
package instruction HTQFP, HTQFP, HTQFP, HTQFP,
Contacts 44 44 44 44
Reach Compliance Code compli compli compli compli
JESD-30 code S-PQFP-G44 S-PQFP-G44 S-PQFP-G44 S-PQFP-G44
JESD-609 code e3 e3 e3 e3
length 10 mm 10 mm 10 mm 10 mm
Number of functions 1 1 1 1
Number of terminals 44 44 44 44
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HTQFP HTQFP HTQFP HTQFP
Package shape SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, HEAT SINK/SLUG, THIN PROFILE FLATPACK, HEAT SINK/SLUG, THIN PROFILE FLATPACK, HEAT SINK/SLUG, THIN PROFILE FLATPACK, HEAT SINK/SLUG, THIN PROFILE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount YES YES YES YES
Telecom integrated circuit types SLIC SLIC SLIC SLIC
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location QUAD QUAD QUAD QUAD
width 10 mm 10 mm 10 mm 10 mm

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