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KMPC8379ECVRALG

Description
IC mpu powerquicc II 689-pbga
Categorysemiconductor    The embedded processor and controller   
File Size2MB,117 Pages
ManufacturerFREESCALE (NXP)
Environmental Compliance  
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IC mpu powerquicc II 689-pbga

KMPC8379ECVRALG Parametric

Parameter NameAttribute value
Datasheets
MPC8379E
Product Photos
689-BBGA
Standard Package2
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microprocessors
PackagingTray
Core ProcessPowerPC e300c4s
Number of Cores/Bus Width1 Core, 32-Bi
Speed667MHz
Co-Processors/DSPSecurity
SEC 3.0
RAM ControllersDDR, DDR2
Graphics AcceleratiN
Display & Interface Controllers-
Etherne10/100/1000 Mbps (2)
SATASATA 3Gbps (4)
USBUSB 2.0 + PHY (1)
Voltage - I/O1.8V, 2.5V, 3.3V
Operating Temperature-40°C ~ 125°C
Security FeaturesCryptography, Random Number Gene
Package / Case689-BBGA Exposed Pad
Supplier Device Package689-TEPBGA II (31x31)
Additional InterfacesDUART, I²C, MMC/SD, PCI, SPI
Freescale Semiconductor
Technical Data
Document Number: MPC8379EEC
Rev. 8, 05/2012
MPC8379E
PowerQUICC II Pro Processor
Hardware Specifications
This document provides an overview of the MPC8379E
PowerQUICC II Pro processor features, including a block
diagram showing the major functional components. This
chip is a cost-effective, low-power, highly integrated host
processor that addresses the requirements of several
printing and imaging, consumer, and industrial
applications, including main CPUs and I/O processors in
printing systems, networking switches and line cards,
wireless LANs (WLANs), network access servers (NAS),
VPN routers, intelligent NIC, and industrial controllers.
This chip extends the PowerQUICC family, adding higher
CPU performance, additional functionality, and faster
interfaces while addressing the requirements related to
time-to-market, price, power consumption, and package
size.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 10
Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . 13
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . 15
DDR1 and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . 16
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Ethernet: Enhanced Three-Speed Ethernet (eTSEC) 23
USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Enhanced Secure Digital Host Controller (eSDHC) 43
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
I
2
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Serial ATA (SATA) . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 68
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 78
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
System Design Information . . . . . . . . . . . . . . . . . . 110
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 112
Document Revision History . . . . . . . . . . . . . . . . . . 114
1
Overview
This chip incorporates the e300c4s core, which includes
32 KB of L1 instruction and data caches and on-chip
memory management units (MMUs). The device offers
two enhanced three-speed 10, 100, 1000 Mbps Ethernet
interfaces, a DDR1/DDR2 SDRAM memory controller, a
flexible, a 32-bit local bus controller, a 32-bit PCI
controller, an optional dedicated security engine, a USB
2.0 dual-role controller, a programmable interrupt
Freescale reserves the right to change the detail specifications as may be required
to permit improvements in the design of its products.
© 2008-2012 Freescale Semiconductor, Inc. All rights reserved.

KMPC8379ECVRALG Related Products

KMPC8379ECVRALG KMPC8379CVRALG KMPC8379EVRALG KMPC8379VRALG
Description IC mpu powerquicc II 689-pbga IC mpu powerquicc II 689-pbga IC mpu powerquicc II 689-pbga IC mpu powerquicc II 689-pbga
Standard Package 2 2 2 2
Category Integrated Circuits (ICs) Integrated Circuits (ICs) Integrated Circuits (ICs) Integrated Circuits (ICs)
Family Embedded - Microprocessors Embedded - Microprocessors Embedded - Microprocessors Embedded - Microprocessors
Packaging Tray Tray Tray Tray
Core Process PowerPC e300c4s PowerPC e300c4s PowerPC e300c4s PowerPC e300c4s
Number of Cores/Bus Width 1 Core, 32-Bi 1 Core, 32-Bi 1 Core, 32-Bi 1 Core, 32-Bi
Speed 667MHz 667MHz 667MHz 667MHz
RAM Controllers DDR, DDR2 DDR, DDR2 DDR, DDR2 DDR, DDR2
Graphics Accelerati N N N N
Etherne 10/100/1000 Mbps (2) 10/100/1000 Mbps (2) 10/100/1000 Mbps (2) 10/100/1000 Mbps (2)
SATA SATA 3Gbps (4) SATA 3Gbps (4) SATA 3Gbps (4) SATA 3Gbps (4)
USB USB 2.0 + PHY (1) USB 2.0 + PHY (1) USB 2.0 + PHY (1) USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 2.5V, 3.3V 1.8V, 2.5V, 3.3V 1.8V, 2.5V, 3.3V 1.8V, 2.5V, 3.3V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C 0°C ~ 125°C 0°C ~ 125°C
Package / Case 689-BBGA Exposed Pad 689-BBGA Exposed Pad 689-BBGA Exposed Pad 689-BBGA Exposed Pad
Supplier Device Package 689-TEPBGA II (31x31) 689-TEPBGA II (31x31) 689-TEPBGA II (31x31) 689-TEPBGA II (31x31)
Additional Interfaces DUART, I²C, MMC/SD, PCI, SPI DUART, I²C, MMC/SD, PCI, SPI DUART, I²C, MMC/SD, PCI, SPI DUART, I²C, MMC/SD, PCI, SPI

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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