MT46V16M8TG-75:D TR datasheet, PDF

Datasheet> All Categories > storage> MT46V16M8TG-75:D TR

MT46V16M8TG-75:D TR: DescriptionIC ddr sdram 128m 7.5ns 66tsop; Categorystorage; File Size6MB，81 Pages; ManufacturerMicron; Websitehttp://www.micron.com/

Download Datasheet Parametric View All

MT46V16M8TG-75:D TR Overview

IC ddr sdram 128m 7.5ns 66tsop

MT46V16M8TG-75:D TR Parametric

Parameter Name	Attribute value
Datasheets
MT46V8M16, MT46V16M8, MT46V32M4
Product Photos
66 TSOP Package
Standard Package	1,000
Category	Integrated Circuits (ICs)
Family	Memory
Packaging	Tape & Reel (TR)
Format - Memory	RAM
Memory Type	DDR SDRAM
Memory Size	128M (16M x 8)
Speed	7.5ns
Interface	Parallel
Voltage - Supply	2.3 V ~ 2.7 V
Operating Temperature	0°C ~ 70°C
Package / Case	66-TSSOP (0.400", 10.16mm Width)
Supplier Device Package	66-TSOP

Preview

Download Datasheet

View All

128Mb: x4, x8, x16 DDR SDRAM

Features

Double Data Rate (DDR) SDRAM

MT46V32M4 – 8 Meg x 4 x 4 Banks

MT46V16M8 – 4 Meg x 8 x 4 Banks

MT46V8M16 – 2 Meg x 16 x 4 Banks

Features

• V

= +2.5V ±0.2V, V

Q = +2.5V ±0.2V

• V

= +2.6V ±0.1V, V

Q = +2.6V ±0.1V (DDR400)

• Bidirectional data strobe (DQS) transmitted/

received with data, i.e., source-synchronous data

capture (x16 has two – one per byte)

• Internal, pipelined double-data-rate (DDR)

architecture; two data accesses per clock cycle

• Differential clock inputs (CK and CK#)

• Commands entered on each positive CK edge

• DQS edge-aligned with data for READs; center-

aligned with data for WRITEs

• DLL to align DQ and DQS transitions with CK

• Four internal banks for concurrent operation

• Data mask (DM) for masking write data

(x16 has two – one per byte)

• Programmable burst lengths: 2, 4, or 8

• Auto refresh and self refresh modes

• Longer lead TSOP for improved reliability (OCPL)

• 2.5V I/O (SSTL_2 compatible)

• Concurrent auto precharge option is supported

•

RAS lockout supported (

RAP =

RCD)

Options

• Configuration

–

32 Meg x 4 (8 Meg x 4 x 4 banks)

–

16 Meg x 8 (4 Meg x 8 x 4 banks)

–

8 Meg x 16 (2 Meg x 16 x 4 banks)

• Plastic package – OCPL

–

66-pin TSOP

–

66-pin TSOP (Pb-free)

• Timing – cycle time

–

5ns @ CL = 3 (DDR400)

–

6ns @ CL = 2.5 (DDR333)

(TSOP only)

–

7.5ns @ CL = 2 (DDR266)

–

7.5ns @ CL = 2 (DDR266A)

–

7.5ns @ CL = 2.5 (DDR266B)

• Self refresh

–

Standard

–

Low-power self refresh

• Temperature rating

–

Commercial (0°C to 70°C)

–

Industrial (–40°C to +85°C)

• Revision

Marking

32M4

16M8

8M16

-5B

-6T

-75E

-75Z

-75

None

Notes: 1. Not recommended for new designs

Table 1:

Key Timing Parameters

CL = CAS (READ) latency; MIN clock rate with 50% duty cycle at CL = 2 (-75E, -75Z), CL = 2.5 (-6, -6T, -75), and

CL = 3 (-5B)

Clock Rate (MHz)

Speed Grade

-5B

-6T

-75E/-75Z

-75

CL = 2

133

100

CL = 2.5

167

133

CL = 3

200

n/a

Data Out

Window

1.6ns

2.0ns

2.5ns

Access

Window

±0.70ns

±0.75ns

DQS–DQ

Skew

+0.40ns

+0.45ns

+0.50ns

PDF: 09005aef816fd013/Source: 09005aef82a95a3a

128Mb_DDR_x4x8x16_D1.fm - 128Mb DDR: Rev. F; Core DDR: Rev. A 4/07 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

128Mb: x4, x8, x16 DDR SDRAM

Table of Contents

State Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

General Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Functional Block Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

Pin Assignments and Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Electrical Specifications – I

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Electrical Specifications – DC and AC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

DESELECT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38

NO OPERATION (NOP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38

LOAD MODE REGISTER (LMR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38

ACTIVE (ACT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40

PRECHARGE (PRE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41

BURST TERMINATE (BST) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41

AUTO REFRESH (AR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41

SELF REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41

Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

INITIALIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

REGISTER DEFINITION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45

ACTIVE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62

PRECHARGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75

AUTO REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77

SELF REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78

POWER-DOWN (CKE Not Active). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80

PDF: 09005aef816fd013/Source: 09005aef82a95a3a

128Mb_DDRTOC.fm - 128Mb DDR: Rev. F; Core DDR: Rev. A 4/07 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

128Mb: x4, x8, x16 DDR SDRAM

Functional Description

The DDR SDRAM uses a double data rate architecture to achieve high-speed operation.

The double data rate architecture is essentially a 2n-prefetch architecture with an inter-

face designed to transfer two data words per clock cycle at the I/O pins. A single read or

write access for the DDR SDRAM effectively consists of a single 2n-bit wide, one-clock-

cycle data transfer at the internal DRAM core and two corresponding

n-bit

wide, one-

half-clock-cycle data transfers at the I/O pins.

A bidirectional data strobe (DQS) is transmitted externally, along with data, for use in

data capture at the receiver. DQS is a strobe transmitted by the DDR SDRAM during

READs and by the memory controller during WRITEs. DQS is edge-aligned with data for

READs and center-aligned with data for WRITEs. The x16 offering has two data strobes,

one for the lower byte and one for the upper byte.

The DDR SDRAM operates from a differential clock (CK and CK#); the crossing of CK

going HIGH and CK# going LOW will be referred to as the positive edge of CK.

Commands (address and control signals) are registered at every positive edge of CK.

Input data is registered on both edges of DQS, and output data is referenced to both

edges of DQS, as well as to both edges of CK.

Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a

selected location and continue for a programmed number of locations in a programmed

sequence. Accesses begin with the registration of an ACTIVE command, which may then

be followed by a READ or WRITE command. The address bits registered coincident with

the ACTIVE command are used to select the bank and row to be accessed. The address

bits registered coincident with the READ or WRITE command are used to select the bank

and the starting column location for the burst access.

The DDR SDRAM provides for programmable READ or WRITE burst lengths of 2, 4, or 8

locations. An AUTO PRECHARGE function may be enabled to provide a self-timed row

precharge that is initiated at the end of the burst access.

As with standard SDR SDRAMs, the pipelined, multibank architecture of DDR SDRAMs

allows for concurrent operation, thereby providing high effective bandwidth by hiding

row precharge and activation time.

An auto refresh mode is provided, along with a power-saving power-down mode. All

inputs are compatible with the JEDEC standard for SSTL_2. All full-drive option outputs

are SSTL_2, Class II compatible.

General Notes

• The functionality and the timing specifications discussed in this data sheet are for the

DLL-enabled mode of operation.

• Throughout the data sheet, the various figures and text refer to DQs as “DQ.” The DQ

term is to be interpreted as any and all DQ collectively, unless specifically stated

otherwise. Additionally, the x16 is divided into two bytes, the lower byte and upper

byte. For the lower byte (DQ0–DQ7) DM refers to LDM and DQS refers to LDQS. For

the upper byte (DQ8–DQ15) DM refers to UDM and DQS refers to UDQS.

• Complete functionality is described throughout the document and any page or

diagram may have been simplified to convey a topic and may not be inclusive of all

requirements.

• Any specific requirement takes precedence over a general statement.

PDF: 09005aef816fd013/Source: 09005aef82a95a3a

DDR_x4x8x16_Core1.fm - 128Mb DDR: Rev. F; Core DDR: Rev. A 4/07 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

Recommended Resources

Circuit diagram of a thermocouple cold junction temperature compensation

DC and DC converter circuit diagram using thyristor a

4-quadrant 8-bit multiplier

Anti-theft remote control doorbell

Driver circuit with gate-off clamp circuit

6-channel input mixer

Application of I2C bus interface clock chip DS1307 in tank semi-active suspension electronic control unit: Application of I2C bus interface clock chip DS1307 in tank semi-active suspension electronic control unit...; feifei Test/Measurement

Design of Virtual FPGA Logic Verification Analyzer: Design of Virtual FPGA Logic Verification Analyzer With the widespread use of FPGA technology, there is an increasing need for an instrument that can test and verify whether the logic timing of the ci...; aimyself FPGA/CPLD

Share a CC430-5137 document: ...; fengzhang2002 RF/Wirelessly

430 first experience: launchpad learning--spi: It's been a month since I received the board, but there has been no progress:~o. Laziness is indeed the enemy of greed:faint:.Now turn the board out and start tinkering.I have a nokia5110 LCD and want...; wl1336412 Microcontroller MCU

CTL_CODE(,,,): 1. // show Camera // dwLenIn = 1 : Normal overlay // dwLenIn = 4 : Alphablending // dwLenIn = 5 : Colorkey overlay #define IOCTL_CAM_SHOW CTL_CODE( FILE_DEVICE_VIDEO, 1, METHOD_NEITHER,FILE_ANY_ACCESS...; benson Embedded System

How to do image processing with ARM microcontroller: rt, I'm a newbie who has just learned a little bit about microcontrollers. Now my teacher wants me to find a board that can capture images, burn the system, install opencv and vs. Please recommend and...; 高半仙 ARM Technology

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components