B0202AG-02-1780-F datasheet, PDF

Datasheet> All Categories > Passive components> The resistor> B0202AG-02-1780-F

B0202AG-02-1780-F: DescriptionFixed Resistor, Thin Film, 0.25W, 178ohm, 100V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP; CategoryPassive components The resistor; File Size381KB，3 Pages; ManufacturerTT Electronics plc; Websitehttp://www.ttelectronics.com/

Download Datasheet Parametric View All

B0202AG-02-1780-F Overview

Fixed Resistor, Thin Film, 0.25W, 178ohm, 100V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP

B0202AG-02-1780-F Parametric

Parameter Name	Attribute value
Objectid	1579360989
package instruction	CHIP
Reach Compliance Code	compliant
ECCN code	EAR99
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
method of packing	TRAY
Rated power dissipation(P)	0.25 W
Rated temperature	70 °C
resistance	178 Ω
Resistor type	FIXED RESISTOR
size code	0202
surface mount	YES
technology	THIN FILM
Temperature Coefficient	50 ppm/°C
Terminal shape	ONE SURFACE
Tolerance	1%
Operating Voltage	100 V

Preview

Download Datasheet

View All

Wire Bondable

Chip Resistors

WBC Series

•

Discrete or tapped schematics

•

MIL inspection available

•

High resistor density

IRC’s WBC series wire bondable chip resistors are ideally suited for

the most demanding hybrid application. The WBC combines IRC’s

TaNSil

tantalum nitride thin film technology with silicon substrate processing to produce an extremely small

footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil

resistor film.

Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-

tions. Custom resistance values, sizes and schematics are available on request from the factory.

Physical Data

R0202 - Discrete

(0.508mm ±0.025)

0.020˝ ±0.001

Electrical Data

Absolute Tolerance

Absolute TCR

Package Power Rating

(@ 70°C)

Rated Operating Voltage

√

(not to exceed P x R )

Operating Temperature

Back contact

Noise

Top contact

pad chamfered

0.004˝ min bond pad size

to ±0.1%

to ±25ppm/°C

250mW

100V

-55°C to +150°C

<-30dB

Oxidized Silicon

(10KÅ SiO

min)

0.010˝ ±0.001

(0.254mm ±0.025)

10KÅ minimum

15KÅ minimum

Silicon

(Al / Au optional)

3KÅ Au minimum

10KÅ Al minimum

Silicon Dioxide or

Silicon Nitride

0.004˝ min bond pad size

0.020˝ ±0.001

(0.508mm ±0.025)

B0202 - Discrete back contact

(0.508mm ±0.025)

0.020˝ ±0.001

Substrate Material

Top contact

Substrate Thickness

Aluminum

Gold

R0202 and

T0303

B0202

0.020˝ ±0.001

(0.508mm ±0.025)

T0303 - Tapped network ½R + ½R

Bond Pad

Metallization

(0.762mm ±0.025)

0.030˝ ±0.001

½R

Backside

0.030˝ ±0.001

(0.762mm ±0.025)

0.004˝ min bond pad size

Passivation

General Note

IRC reserves the right to make changes in product specification without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

• Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

A subsidiary of

TT electronics plc

WBC Series Issue January 2009 Sheet 1 of 3

Recommended Resources

Sound activation switch circuit diagram

2Y-△ connection two-speed motor contactor control circuit 2

Differentiator basic circuit

Pause warning circuit-02

CNC Bidirectional Current Source

Rain Alarm 2

MSP430 English Book Recommendation 4. Microcontrollers with the Texas Instruments MSP430: MSP430 English Book Recommendation 4. Microcontrollers with the Texas Instruments MSP430 [url=https://download.eeworld.com.cn/detail/tiankai001/524489]https://download.eeworld.com.cn/detail/tiankai001...; tiankai001 Download Centre

Enthusiastic landlord: I am also participating in the competition this year and am interested in becoming a DDS. Could you please send me a copy of your information? Thank you very much! My email address is: [email=chengron...; verarong1986 MCU

Domestic operating system COS: [i=s]This post was last edited by Jixia Mujin on 2014-1-23 14:10[/i] When I was watching TV yesterday, I saw an advertisement for the Chinese operating system COS. This is the first time I have heard ...; 季夏木槿 Embedded System

How to choose a good drive circuit: Can anyone tell me what kind of drive circuit is more suitable when 5-10 MOS tubes are used in parallel? Why?...; 孤独者 Power technology

Using LTC2380 as a data acquisition card, the data jumps greatly: Design task: The front-end signal is a current signal input in the range of positive and negative 20mA. Application: Because the purchase price of the chip is not limited, the most expensive AD uses L...; shanglaiye DIY/Open Source Hardware

USB analysis tool: I am currently developing a USB driver on CE. However, after I use the USBd function, there is no response and I cannot read the data. I also don’t know whether the data has been sent out. Is there an...; leungpokit Embedded System

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components