The UT54ACS138 and the UT54ACTS138 3-line to 8-line de-
coders/demultiplexers are designed to be used in high-perfor-
mance memory-decoding or data-routing applications requiring
very short propagation delay times.
The conditions at the binary select inputs and the three enable
inputs select one of eight output lines. Two active-low and one
active-high enable inputs reduce the need for external gates of
inverters when expanding. A 24-line decoder can be implement-
ed without external inverters and a 32-line decoder requires only
one inverter. An enable input can be used as a data input for
demultiplexing applications.
The devices are characterized over full military temperature
range of -55°C to +125°C.
FUNCTION TABLE
ENABLE INPUTS
G1
X
L
X
H
H
H
H
H
H
H
H
G2A
X
X
H
L
L
L
L
L
L
L
L
G2B
H
X
X
L
L
L
L
L
L
L
L
C
X
X
X
L
L
L
L
H
H
H
H
SELECT INPUTS
B
X
X
X
L
L
H
H
L
L
H
H
A
X
X
X
L
H
L
H
L
H
L
H
Y0
H
H
H
L
H
H
H
H
H
H
H
PINOUTS
16-Pin DIP
Top View
A
B
C
G2A
G2B
G1
Y7
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
Y0
Y1
Y2
Y3
Y4
Y5
Y6
16-Lead Flatpack
Top View
A
B
C
G2A
G2B
G1
Y7
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
Y0
Y1
Y2
Y3
Y4
Y5
Y6
OUTPUT
Y1
H
H
H
H
L
H
H
H
H
Y2
H
H
H
H
H
L
H
H
H
H
H
Y3
H
H
H
H
H
H
L
H
H
H
H
Y4
H
H
H
H
H
H
H
L
H
H
H
Y5
H
H
H
H
H
H
H
H
L
H
H
Y6
H
H
H
H
H
H
H
H
H
L
H
Y7
H
H
H
H
H
H
H
H
H
H
L
1
H
H
LOGIC SYMBOL
(1)
BIN/OCT
1
2
4
0
1
2
3
4
G1
G2A
G2B
(6)
(4)
(5)
&
EN
5
6
7
(15)
(14)
(13)
(12)
(11)
(10)
(9)
(7)
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
G2B
G1
G2A
(6)
(4)
(5)
&
EN
A
B
C
(1)
(2)
(3)
DMUX
1
2
4
A
B (2)
(3)
C
0
G
---
7
0
1
2
3
4
5
6
7
(15)
(14)
(13)
(12)
(11)
(10)
(9)
(7)
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Note:
1. Logic symbols in accordance with ANSI/IEEE standard 91-1984 and IEC Publication 617-12.
LOGIC DIAGRAM
(15)
(14)
G1
ENABLE
(6)
Y0
Y1
G2A (4)
G2B (5)
(13) Y2
(12)
(11)
(10)
Y3
DATA
Y4
Y5
Y6
Y7
A
SELECT
B
(1)
(2)
(9)
(7)
C (3)
2
OPERATIONAL ENVIRONMENT
1
PARAMETER
Total Dose
SEU Threshold
2
SEL Threshold
Neutron Fluence
LIMIT
1.0E6
80
120
1.0E14
UNITS
rads(Si)
MeV-cm
2
/mg
MeV-cm
2
/mg
n/cm
2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
DD
V
I/O
T
STG
T
J
T
LS
Θ
JC
I
I
P
D
PARAMETER
Supply voltage
Voltage any pin
Storage Temperature range
Maximum junction temperature
Lead temperature (soldering 5 seconds)
Thermal resistance junction to case
DC input current
Maximum power dissipation
LIMIT
-0.3 to 7.0
-.3 to V
DD
+.3
-65 to +150
+175
+300
20
±10
1
UNITS
V
V
°C
°C
°C
°C/W
mA
W
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at
these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
V
IN
T
C
PARAMETER
Supply voltage
Input voltage any pin
Temperature range
LIMIT
4.5 to 5.5
0 to V
DD
-55 to + 125
UNITS
V
V
°C
3
DC ELECTRICAL CHARACTERISTICS
7
(V
DD
= 5.0V
±
10%; V
SS
= 0V
6
, -55°C < T
C
< +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
SYMBOL
V
IL
PARAMETER
Low-level input voltage
1
ACTS
ACS
High-level input voltage
1
ACTS
ACS
Input leakage current
ACTS/ACS
Low-level output voltage
3
ACTS
ACS
High-level output voltage
3
ACTS
ACS
Short-circuit output current
2 ,4
ACTS/ACS
Output current
10
(Sink)
I
OH
Output current
10
(Source)
P
total
I
DDQ
ΔI
DDQ
Power dissipation
2, 8, 9
Quiescent Supply Current
Quiescent Supply Current Delta
ACTS
V
IN
= V
DD
or V
SS
I
OL
= 8.0mA
I
OL
= 100μA
I
OH
= -8.0mA
I
OH
= -100μA
V
O
= V
DD
and V
SS
V
IN
= V
DD
or V
SS
V
OL
= 0.4V
V
IN
= V
DD
or V
SS
V
OH
= V
DD
- 0.4V
C
L
= 50pF
V
DD
= 5.5V
For input under test
V
IN
= V
DD
- 2.1V
For all other inputs
V
IN
= V
DD
or V
SS
V
DD
= 5.5V
C
IN
C
OUT
Input capacitance
5
Output capacitance
5
ƒ
= 1MHz @ 0V
ƒ
= 1MHz @ 0V
15
15
pF
pF
1.9
10
1.6
mW/
MHz
μA
mA
-8
mA
.7V
DD
V
DD
- 0.25
-200
8
200
.5V
DD
.7V
DD
-1
1
CONDITION
MIN
MAX
0.8
.3V
DD
UNIT
V
V
IH
V
I
IN
V
OL
μA
0.40
0.25
V
V
OH
V
I
OS
I
OL
mA
mA
4
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: V
IH
= V
IH
(min) + 20%, - 0%; V
IL
= V
IL
(max) + 0%, -
50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are
guaranteed to V
IH
(min) and V
IL
(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density
≤
5.0E5 amps/cm
2
, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765
pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and V
SS
at
frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose
≤
1E6 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
I am a newbie. Can you tell me where to implement the functions defined in public/common/DDK/int under wince? I have posted this question on the Tony Embedded Forum for a long time, but no one has hel...
Windows CE is a compact, efficient and scalable operating system. It is widely used in various embedded products and can meet the needs of 32-bit embedded program development. In order to support appl...
Ning, the dream lover, has been having the same dream recently. In the dream, a man said to her, "Come on, come find me, I'll wait for you..." Finally, Ning couldn't help it, so she asked him, "Who ar...
[b][size=5][color=#0000ff]1. Choose different types and models of diodes according to the specific circuit[/color][/size][/b][align=left][color=rgb(34, 34, 34)][font="]There are many types of diodes, ...
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
As more and more consumers purchase new energy vehicles, the safety of electric vehicles has become a major concern. This has been particularly prominent following a series of electric vehicle fire...[Details]
On August 25th, SK Hynix announced that it has completed development and entered mass production of its 321-layer, 2Tb QLC NAND flash memory product. This achievement marks the world's first applic...[Details]
Overview
As handheld voice communication devices become more and more popular, they are increasingly used in noisy environments, such as airports, busy roads, crowded bars, etc. In such noisy ...[Details]
There are basically three causes of spontaneous combustion of electric vehicles: The first is that the battery components are punctured or suffer fatal damage due to a collision accident, and part ...[Details]
A multilevel inverter converts a DC signal into a multilevel staircase waveform. Instead of a straight positive-negative output waveform, the output waveform of a multilevel inverter alternates in ...[Details]
Coal mines typically contain gas and coal dust. When gas and coal dust reach a certain concentration, they can cause explosions. Electrical equipment generates arcs during normal operation or durin...[Details]
Bosch has released a new SoC series to support L2+ advanced driver assistance functions. The chip integrates high resolution and long-range detection capabilities, and has built-in support for neur...[Details]
My career has been closely tied to the semiconductor industry. From product management to content marketing, I've provided countless forecasts and predictions across a variety of roles. Whethe...[Details]
Intel®
Xeon®
6
-
core processors now support the new Amazon EC2 R8i and R8i-flex instances on Amazon Web Services (AWS).
These new instances offer superior performance and fast...[Details]
From time to time, I see some audiophiles spending a lot of money or a lot of time to DIY speakers, but the results are not what they want. Below I list some of the small experiences I summarized b...[Details]
At present, the most troubling thing about pure electric vehicles as new energy sources is not only the range anxiety, but also the disadvantage of long charging time. At present, ternary lithium b...[Details]
Which is better, copper braided wire flexible connector or copper stranded wire flexible connector? When choosing copper wire flexible connector, people always struggle with whether to use copper b...[Details]
The assisted driving industry in 2025 stands at the dual crossroads of "large-scale implementation" and "safety upgrades." Cities like Beijing and Wuhan have already issued regulations de...[Details]
A graphics processor (GPU), also known as a display core, visual processor, or display chip, is a microprocessor specialized for image processing on personal computers, workstations, game consoles,...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
