EEWORLDEEWORLDEEWORLD

Part Number

Search

3035B224K500NT

Description
Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.22uF, 3035,
CategoryPassive components    capacitor   
File Size19KB,1 Pages
ManufacturerFenghua (HK) Electronics Ltd.
Download Datasheet Parametric View All

3035B224K500NT Overview

Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.22uF, 3035,

3035B224K500NT Parametric

Parameter NameAttribute value
Objectid804405509
package instruction, 3035
Reach Compliance Codeunknown
ECCN codeEAR99
YTEOL6.42
capacitance0.22 µF
Capacitor typeCERAMIC CAPACITOR
Custom functionsCustomer Specified Designs Available
dielectric materialsCERAMIC
high3 mm
length7.6 mm
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package formSMT
method of packingTape
positive tolerance10%
Rated (DC) voltage (URdc)50 V
series3035(X7R, 50V)
size code3035
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
width9 mm
¶²Æ×Ì´µÈÆ÷
à㬴ÕÉçÝ
MULTILAYER  CHIP  CERAMIC  CAPACITOR
通用型X7R多层片状陶瓷电容器    
GENERAL APPLICATION X7R MLCC
尺寸规格
S½½½ C½½½
尺寸  D½½½½½½½½½(½½)
WB
工½电压
R½½½½
V½½½½½½
6.3V
10V
16V
25V 
50V
6.3V
10V
16V
25V 
50V
6.3V
10V
16V
25V 
50V
6.3V
10V
16V
25V 
50V
6.3V
10V
16V
25V 
50V
6.3V
10V
16V
25V 
50V
6.3V
10V
16V
25V 
50V
6.3V
10V
16V
25V 
50V
6.3V
10V
16V
25V 
50V
容量范围
C½½½½½½½½½½(½F)
X7R(B)
100½100,000
100½100,000
100½33,000
100½22,000
100½10,000
100½1,000,000
100 ̄330,000
100 ̄150,000
100 ̄150,000
100 ̄100,000
100½1,000,000
100½470,000
100 ̄470,000
100½220,000
100½100,000
100½10,000,000
100½4,700,000
100½2,200,000
100½1,000,000
100½470,000
470½10,000,000
470½4,700,000
470½2,200,000
470½1,000,000
470½1,000,000
470½10,000,000
470½4,700,000
470½2,200,000
470½1,000,000
470½1,000,000
470½22,000,000
470½10,000,000
470½4,700,000
470½3,300,000
470½2,200,000
1,000½33,000,000
1,000½22,000,000
1,000½10,000,000
1,000½4,700,000
1,000½3,300,000
1,000½100,000,000
1,000½47,000,000
1,000½33,000,000
1,000½22,000,000
1,000½10,000,000
0402
1.00±0.05
0.50
±
0.05
0.50
±
0.05
0.25
±
0.10
0603
1.60
±
0.10
0.80
±
0.10
0.80
±
0.10
0.30
±
0.10
0805
2.00
±
0.20
1.25
±
0.20
0.70
±
0.20
1.00
±
0.20
1.25
±
0.20
0.50
±
0.20
1206
3.20
±
0.30
1.60
±
0.20
0.70
±
0.20
1.00
±
0.20
1.25
±
0.20
0.50
±
0.25
1210
3.20
±
0.30
2.50
±
0.30
1.25
±
0.30
1.50
±
0.30
0.75
±
0.25
1808
4.50
±
0.40
2.00
±
0.20
≤2.00
0.75
±
0.25
1812
4.50
±
0.40
3.20
±
0.30
≤2.50
0.75
±
0.25
2225
5.70
±
0.50
6.30
±
0.50
≤2.50
1.00
±
0.25
3035
7.60
±
0.50
9.00
±
0.50
≤3.00
1.00
±
0.25
备注:可根据客户的特殊要求设计符合客户需求的产品。
N½½½:W½  ½½½  ½½½½½½  ½½½½½½½½½ ½½  ½½½½½½½½  ½½½½½½½  ½½½½½½½½½½½½.
1
Inductor and capacitor knowledge points record
1. Capacitive reactance: Xc = 1/(ωC) = 1/(2πfC)ω---------angular frequency (angular velocity)π---------pi, approximately equal to 3.14f---------frequency, the power frequency of my country's national ...
小魏哥哥 Switching Power Supply Study Group
WinCE4.2 and EVC4.0 installation problem!!!
Hello everyone: I installed WinCE4.2 today, and then installed EVC4.0, EVC SP2 and STANDARD_SDK. But the following problems occurred: 1 After installing WinCE4.2, the following prompt appeared in the ...
liyiwu444 Embedded System
Help! WinSock and DSP data transmission problem
Hello everyone! I want to send the YUV422 image collected by DSP (EVMDM6437) to Windows XP through the network, but the image is distorted. 1472; //Since the picture is large, the picture is sent in b...
whbahx Embedded System
Design of data acquisition module based on FPGA
Hope you can help, I'm a newbie!...
youlipa FPGA/CPLD
Brief discussion on thermal expansion and contraction of power cable wiring and its countermeasures
As the load current changes and the ambient temperature changes, the power cable will undergo thermal expansion and contraction, in which very large thermal mechanical forces are generated due to the ...
咖啡不加糖 Power technology
[Anxinke UWB indoor positioning module NodeMCU-BU01] 03. Transplantation preparation: hardware schematic analysis
NodeMCU-BU01 Development Boardpower supply The power supply part uses Micro USB as the power supply interface of the NodeMCU-BU01 development board. PA11\PA12 are reserved for USB function expansion. ...
xld0932 RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2042  702  571  1353  1279  42  15  12  28  26 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号