Part Number: XZM2DG45S
3.5x2.8mm PLCC2 SMD LED
Features
●
Ideal for indication light on hand held products
●
Long life and robust package
●
Standard Package: 2000pcs/ Reel
●
MSL (Moisture Sensitivity Level): 3
●
RoHS compliant
Package Schematics
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
ATTENTION
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
Absolute Maximum Ratings
(T
A
=25°C)
Reverse Voltage
Forward Current
Forward Current (Peak)
1/10 Duty Cycle
0.1ms Pulse Width
Power Dissipation
Operating Temperature
Storage Temperature
Electrostatic Discharge Threshold
(HBM)
V
R
I
F
i
FS
P
D
T
A
Tstg
M2DG
(InGaN)
5
30
100
120
-40 ~ +85
-40 ~ +85
450
Operating Characteristics
(T
A
=25°C)
Forward Voltage (Typ.)
(I
F
=20mA)
Forward Voltage (Max.)
(I
F
=20mA)
Reverse Current (Max.)
(V
R
=5V)
Wavelength of Peak
Emission CIE127-2007*(Typ.)
(I
F
=20mA)
Wavelength of Dominant
EmissionCIE127-2007*(Typ.)
(I
F
=20mA)
Spectral Line Full Width
At Half-Maximum (Typ.)
(I
F
=20mA)
Capacitance (Typ.)
(V
F
=0V, f=1MHz)
V
F
V
F
I
R
M2DG
(InGaN)
3.2
4
50
Unit
V
mA
mA
mW
°C
Unit
V
V
uA
λP
520*
nm
V
λD
525*
nm
△λ
35
nm
C
100
Wavelength
CIE127-2007*
nm
λP
pF
Part
Number
Emitting
Color
Emitting
Material
Lens-color
Luminous Intensity
CIE127-2007*
(I
F
=20mA)
mcd
min.
typ.
1395*
Viewing
Angle
2θ 1/2
XZM2DG45S
Green
InGaN
Water Clear
1000*
520*
120°
*Luminous intensity value and wavelength are in accordance with CIE127-2007 standards.
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Part Number: XZM2DG45S
3.5x2.8mm PLCC2 SMD LED
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise
pickup and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H
2
S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
Feb 22,2014
XDSB4876
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Part Number: XZM2DG45S
3.5x2.8mm PLCC2 SMD LED
M2DG
LED is recommended for reflow soldering and
soldering profile is shown below.
Feb 22,2014
XDSB4876
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Part Number: XZM2DG45S
3.5x2.8mm PLCC2 SMD LED
The device has a single mounting surface.
The device must be mounted according to
the specifications.
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
Reel Dimension
Tape Specification (Units : mm)
Remarks:
If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength),
the typical accuracy of the sorting process is as follows:
1. Wavelength: +/-1nm
2. Luminous intensity / luminous flux: +/-15%
3. Forward Voltage: +/-0.1V
Note: Accuracy may depend on the sorting parameters.
Feb 22,2014
XDSB4876
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Part Number: XZM2DG45S
3.5x2.8mm PLCC2 SMD LED
PACKING & LABEL SPECIFICATIONS
XZxxx45x
TERMS OF USE
1. Data presented in this document reflect statistical figures and should be treated as technical reference only.
2. Contents within this document are subject to improvement and enhancement changes without notice.
3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet.
User accepts full risk and responsibility when operating the product(s) beyond their intended specifications.
4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please
consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life.
5. The contents within this document may not be altered without prior consent by SunLED.
6. Additional technical notes are available at
http://www.SunLEDusa.com/TechnicalNotes.asp
Feb 22,2014
XDSB4876
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