BL-4000SERIES
White 5500K, 4.3V LED Light Engine
Lamina Light Engines
As the market leader in the development and manufacture of super-bright LED arrays,
Lamina brings solid state lighting to applications which until now were only possible with
traditional lighting sources.
Lamina’s LED arrays are manufactured by combining high brightness LEDs from industry-
leading LED manufacturers with Lamina's proprietary packaging technology, multilayer Low
Temperature Co-Fired Ceramic on Metal (LTCC-M). LTCC-M is a breakthrough in thermal
performance for LED packaging technology, a key factor in determining LED life and
reliability. Unmatched thermal performance coupled with package interconnectivity allows
Lamina to densely cluster multiple LEDs to achieve exceptionally high luminous intensity in
very small footprints. Lamina’s arrays are available in white, RGB and monochrome, from
1W to 100W, and also in custom packages up to 1000W.
Lamina LED Light sources provide:
T
YPICAL
A
PPLICATIONS
P
ORTABLE
L
IGHTING
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•
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•
F
LASHLIGHTS
C
AMPING
L
IGHTS
B
IKE
L
IGHTS
L
ANTERNS
H
EADLAMPS
•
•
•
•
•
H
IGH
L
UMINOUS
F
LUX IN
S
MALL
F
OOTPRINT
S
UPERIOR
T
HERMAL
P
ERFORMANCE FOR
I
MPROVED
R
ELIABILITY
L
ONG
L
IFE AND
H
IGH
L
UMEN
M
AINTENANCE
S
USTAINABLE
D
ESIGN
– R
O
HS C
OMPLIANT
C
USTOM
S
IZES AND
S
HAPES
A
VAILABLE
BL-4000 White 5500K, 4.3V
Lamina's newest LED light sources deliver 120 lumens in white (5500°K) from a
single point. The LED arrays are configured with a single cavity populated with
multiple LEDs. The new design incorporates many new features, including:
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Round footprint for design flexibility
Designed for portable lighting voltages – 4.3V
Compatible with many popular LED optics
Integrated ESD protection – 2,000V HBM
Large solder pads and Lamina EZConnect PCB adapter available
Lamina heat sinks available
To see how you can realize all these design benefits, to request a sample, or to speak with an engineer
about your design, contact Lamina at 800.808.5822 or 609.265.1401 or visit www.laminaceramics.com.
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Technical Data
P/N BL-42D2-0344
Color Temperature :
Voltage
1
:
Test Current :
Power
1
:
Luminous Flux
1
:
Color Rendering Index :
Thermal Resistance :
Operating Temperature
2
:
Storage Temperature :
Assembly Temperature :
ESD Sensitivity :
Symbol
Min
Typical
Max
Unit
CCT
V
F
I
F
P
Φ
V
CRI
T
R
T
J
HBM
4000
3.6
-
-
88
62
-
-40
-40
2,000
5500
4.3
1400
5.9
120
78
2.5
10000
5.0
1600
-
-
-
3.2
125
100
250ºC, < 5 sec.
ºK
V
mA
W
lm
ºC/W
ºC
ºC
ºC
V
Note 1. Optical and electrical specifications are given for the specified drive current at a 25 C junction temperature.
Note 2. Operating temperature is for LED die junction. Lower temperatures improve lumen maintenance.
Light Output Characteristics
Luminous Flux vs. Current
BL-4000 White Typical Flux vs. Forward Current
25C Junction Temp
200
180
160
140
120
100
80
60
40
20
0
0.20
1.40
Relative Luminous Flux vs. Temperature
BL-4000 5500ºK White Relative Flux vs. Tempertature
1.20
Relative Flux (Lumens)
0
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
Typical Flux (Lumens)
1.00
0.80
0.60
0.40
0.00
-20
0
20
40
60
80
100
120
140
Forward Current (mA)
Junction Temperature (C)
Luminous Flux vs. Current
When operating at drive currents higher than test currents indicated do not exceed maximum recommended junction temperature.
Higher drive currents increase luminous flux but also increase thermal load. Without proper heat sinking, lower efficacy (lumens per
watt) and lower lumen maintenance may result. For dimming significantly below test currents indicated, pulse width modulation is
recommended for maximum consistency and stability of light properties.
Luminous Flux vs. Junction Temperature
Light output from LED die will decrease with increasing junction temperature. This effect is particularly acute for die in the 580 to 750
nm range. As a result it is recommended that the LED array heat sink design be optimized to maintain the die junction temperature as
low as possible.
To see how you can realize all these design benefits, to request a sample, or to speak with an engineer
about your design, contact Lamina at 800.808.5822 or 609.265.1401 or visit www.laminaceramics.com.
2
Typical Beam Pattern
Lamina’s BL-4000 LED arrays project a 125º (2θ1/2, 50% of peak value) Lambertian radiation pattern. Narrower beam distributions can
be produced by use of selected popular LED optics. Please contact Lamina Application Engineering for support with your optical needs.
Typical Beam Pattern
Typical Beam Pattern
100
90
80
70
Relative Intensity (%)
60
50
40
30
20
10
0
-100
Spectral Power Distribution
BL-4000 White 5500K Spectral Power Distribution
1.0
Relative Spectral Power Distribution
-75
-50
-25
0
25
50
75
100
Angular Displacement (Degrees)
0.8
0.6
0.4
0.2
0.0
350
400
450
500
550
600
650
700
750
800
Wavelength (nm)
Forward Current vs. Forward Voltage
BL-4000 White Forward Current vs Forward Voltage
25C Ambient
2200
2000
1800
Forward Current (mA)
1600
1400
1200
1000
800
600
400
200
0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Forward Voltage (V)
Electrical Connections
Lamina’s BL-4000 Series is configured with solder pads compatible with Sn63 or Sn62 solder. As with many electrical devices, non-
acid RMA type solder flux should be used to prepare the solder pads before application of solder. If wire attachment is performed with
a soldering iron, care must be taken to minimize heat transfer to the die and minimize leaching of the solder pads. For more information
refer to Lamina’s Attachment application note which can be found on the website, www.LaminaCeramics.com.
Unlike the other BL-4000s, Lamina’s
BL-42D2-0344 is designed for low voltage (4.3V) portable applications and is not designed
with an isolated base. The base may be conductive with the cathode (V-) terminal
Lamina has developed EZConnect PCB adapters with connectors for BL-4000 products for ease of assembly.
To see how you can realize all these design benefits, to request a sample, or to speak with an engineer
about your design, contact Lamina at 800.808.5822 or 609.265.1401 or visit www.laminaceramics.com.
3
Assembly Recommendations
Lamina's BL Series Light Engines are designed for attachment to a heat sink with conductive epoxy, or screw down for flange mount
devices with thermal grease in the joint. For attachment using screws, a 2-56 UNC round head or metric equivalent M2 0.4 Cheese
Head screw, 18-8 SS is recommended. Maximum torque is 4 inch pounds (45 Newton-centimeter). Flatness requirement of the surface
that light engine is mounted to is 0.001 inch/inch.
Mechanical Specifications
Ø0.750 [Ø19.05]
BOLT CIRCLE
Ø0.80 [Ø20.32]
Electrical Connections
3X MOUNTING HOLE
FOR 2-56 SCREW
Apply V-
Voltage Here
3X 120°
Apply V+
Voltage Here
0.160 [4.06] MAX
Heat Sink Recommendations
Lamina LED arrays provide efficient transfer of heat from the individual LED die to a customer supplied heat sink. Lamina’s BL-4000
arrays must be operated at or below 125ºC die junction temperature. A heat sink must be attached to the array with sufficient cooling
capacity to keep the die junction below 125ºC. The temperature rise from the array base to the die junction may be determined by
calculating the product of the maximum package thermal resistance and the desired operating power level:
Junction Temperature Rise (Tj (rise)) = Operating Power (P) x (Lamina Array Thermal Resistance)
The appropriate heat sink may then be approximated
*
by:
Heat Sink Thermal Resistance (ºC/W) = (125 ºC - Tj (rise) - Maximum Ambient Temperature) / P
*Approximation assumes light engines are screwed down and thermal grease is used as thermal interface material.
Lamina has developed a selection of radial heat sinks for rapid prototyping of designs with Lamina’s LED Light Engines. Lamina’s heat
sinks are available through select distributors. More information on Lamina’s heat sinks and distributors is available on our website.
Optics
Lamina has tested and found the following Frean optics (www.Fraen.com) to perform well with Lamina’s BL-4000 light engine:
FHS series narrow (8-10 degree) beam optic – FHS-HNB1-LL01-X
FHS series medium (25-30 degree) beam optic – FHS-HMB1-LL01-X
FHS series wide beam (40-45 degree) optic – FHS-HWB1-LL01-x
An optic holder is necessary for mounting the optic. Lamina will be offering a holder in the near future. The standard Fraen FHS series
optic holder is not compatible with Lamina’s LED light source and EZConnect PCB.
Handling Precaution
Contact with the silicone based encapsulant on the surface of the light engine must be avoided to prevent damage. Do not apply
pressure to the silicone based encapsulant or allow it to come into contact with sharp objects. Lamina LED arrays must be handled
from the sides.
Lamina Ceramics • 120 Hancock Lane • Westampton, NJ 08060 • USA
Specifications subject to change without notice
•
©2005 Lamina Ceramics, Inc.
•
REV. 05.3.05
To see how you can realize all these design benefits, to request a sample, or to speak with an engineer
about your design, contact Lamina at 800.808.5822 or 609.265.1401 or visit www.laminaceramics.com.
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