F-214 (Rev 08APR14)
ZA8–10–2–01.00–Z–10–S–A
ZA8–40–2–01.00–Z–10–S–A
TM
HIGH SPEED
LOW PROFILE INTERPOSER
ZA1–20–2–01.00–Z–10–S–A
(1,00 mm) .0394"
(ZA1)
(0,80 mm) .0315"
(ZA8)
ZA1, ZA8 SERIES
ULTRA LOW PROFILE MICRO ARRAYS
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?ZA1
or www.samtec.com?ZA8
Insulator Material:
FR4
Contact Material:
BeCu
Plating:
Au over 50µ" (1,27 µm) Ni
Operating Temp Range:
-55°C to +125°C
Current Rating:
Testing Now!
RoHS Compliant:
Yes
ZA8 = up to 1,024
contacts/square inch
Choice of (0,80 mm) .0315"
or (1,00 mm) .0394" grid
ZA1 = up to 625
contacts/square inch
APPLICATION
Processing:
Lead Coplanarity:
Dual Compression system
Dual
compression
or single
compression
with solder balls
BeCu
contacts
(1,00 mm) .040"
board spacing
IN DESIGN
• Micro coax cable System
Contact Samtec.
TYPE
POSITIONS
PER ROW
STYLE
BOARD
SPACING
PLATING
NO. OF
ROWS
S
A
ZA1
= (1,00 mm)
.0394"
pitch grid
–10, –20,
–30, –40
–1
= Single
Compression
with Solder Ball
–01.00
= (1,00 mm)
.040"
Board
Space
–Z
= 6µ"
(0,15 µm)
Gold in
contact area
–10
= Ten
Rows
–S
= Screw
Down
–A
= Alignment
Holes
ZA8
= (0,80) mm
.0315"
pitch grid
–2
= Double
Compression
(1,00)
.040
DESIGN FLEXIBILITY
Z-Ray
™
is highly-customizable:
PITCH
STACK HEIGHT
TOTAL I/Os
≥
0,65 mm
0,50 mm to
m
7,00 mm
7,
00 0
1,000+
Lat hes, Thermal
Latches, hermal
Spreaders,
eader
Quick-Re e
Quick-Release
Spring Constraints
Constraints
Multi-layer FR4
(e.g., Pitch Spreaders)
(0,254) .010 TYP
54
Y
BOTH SIDES
TH
40 X 10
0
GGE
NG
RUGGEDIZING
CONSTRUCTION
STRUCTION
Contact Samtec.
Note:
Some lengths,
styles and options are
non-standard, non-returnable.
COMPRESSION + SOLDER BALL
10 X 10 , 20 X 10 & 30 X 10
DUAL COMPRESSION
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