Product Guide
1112H Series Thin Type SMT LED
s
Features
• Meets industry standards for 2012 (0806) footprint
•
2.0mm (L) x 1.25mm (W) x 0.8mm (H)
• 1112H is 50% thinner than the W series.
s
Applications
• Membrane switch panels
• Backlighting
• Cellular telephones
s
Outline Dimensions
PCB Warpage direction
Unit: mm
Tolerances + 0.1
s
Electro-Optical Characteristics
Type No.
Material Emitted
Color
GaAIAs
GaAsP
GaAsP
GaP
GaP
GaP
Red
Orange
Yellow
Yellow-Green
Green
Pure Green
(Ta=25°C)
Wavelength
I
F
Peak
λ
p
TYP.
Spectral Line
Dominant Half Width
λ
d
λ
∆λ
TYP.
TYP.
I
F
Lens
Color
Luminous
Intensity
IV
MIN.
TYP.
Forward
Voltage
V
TYP
MAX.
F
Reverse Viewing
Current
IR
Angle
MAX.
V
R
I
F
(2
θ
1/2)
BR1112H
AA1112H
AY1112H
PY1112H
PG1112H
BG1112H
7.0
2.2
Milky
White
11.7 20 660
3.7
3.7
6.4
2.7
20 605
20 580
20 560
20 555
mA
647
606
590
572
567
558
nm
30
30
30
30
30
30
20
20
20
20
20
20
mA
1.7 2.3
2.2 2.8
2.2 2.8
2.1 2.8
2.1 2.8
2.1 2.8
V
20
20
20
20
20
20
mA
100
100
100
100
100
100
µA
4
4
4
4
4
4
V
150°
2.2
7.0
3.8
1.6
11.7 20 570
160°
Units
mcd
Deg.
s
Absolute Maximum Ratings
Red
Orange
AA
70
25
60
4
Yellow
AY
70
25
60
4
-30 to +85
-40 to +100
0.36 (DC) 0.86 (Pulse)
(Ta=25°C)
Yellow
Green
PY
70
25
60
4
Green
PG
70
25
60
4
Pure
Green
BG
70
25
60
4
mW
mA
mA
V
°C
°C
mA/°C
Item
Symbol
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Pd
I
F
I
FM
V
R
Topr
Tstg
∆I
F
BR
57.5
25
60
4
Units
* Ta=25°C,
I
FM
applies for the pulse width
≤
1msec. and duty cycle
≤1/20.
s
Taping Specifications
1.75 + 0.1
s
Operation Current Derating Chart (DC)
8+0.2
4+0.1
(1.45)
φ
1.5
+0.1
0
(0.2)
Quantity on tape:
4000 pieces
per reel
(2.25)
3.5 +0.05
(φ 0.5)
2+0.05
4+0.1
BR, AA, AY, PY, PG, BG
Direction to pull
+1
φ
60 -0
φ
13+0.2
Center
Hole
(1)
2+0.5
φ
21+0.8
φ
13+0.2
9+0.3
11.4+1
+0
φ
180 3
s
Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
LED Surface Temperature
°C
Operation Heating
240
Temperature
rise: 5°C/sec.
Cooling:
—5°C/sec.
s
Spatial Distribution
150
120
Pre-heating
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PG1112H-0301
~
0
60 to 120 sec.
5 sec. max
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555
Website: www.stanley-electric.com
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