EEWORLDEEWORLDEEWORLD

Part Number

Search

5962-8606318QYA

Description
OTP ROM, 32KX8, 70ns, CMOS, CQCC32, WINDOWED, HERMETIC SEALED, LCC-32
Categorystorage    storage   
File Size111KB,19 Pages
Manufacturere2v technologies
Download Datasheet Parametric View All

5962-8606318QYA Overview

OTP ROM, 32KX8, 70ns, CMOS, CQCC32, WINDOWED, HERMETIC SEALED, LCC-32

5962-8606318QYA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Makere2v technologies
Parts packaging codeQFJ
package instructionQCCN, LCC32,.45X.55
Contacts32
Reach Compliance Codecompliant
ECCN codeEAR99
Base Number Matches1
REVISIONS
LTR
A
DESCRIPTION
Add three vendors, 18324, 1FN41, and 66579. Add device types 04, 05,
06, and 07. Add margin test method C. Update vendor's PIN. Change
code indent. no. to 67268. Editorial changes throughout.
Add device type 08 with vendors CAGE 1FN41 and CAGE 66579.
Added time temperature regression equation for unbiased bake.
Removed vendor CAGE 66302. Made technical changes to table I, 4.2
back end margin test method step 3, 4.3.1 step C, table II, and table III.
Editorial changes throughout. Added vendor's PIN from XMB/883 to
either LM/883 for appropriate device types. Deleted the top CE waveform
on figure 6. This was incorrect for this device.
Added vendor CAGE 34335 to the drawing as a source of supply for
device types 01 through 07. Add vendor CAGE number 66579 to device
types 01 through 04, also add vendor CAGE number 01295 to devices
04XX and 05XX. Add test condition A to 4.2 and 4.3.2. Add margin test
method E for vendor CAGE number 34335. Change to vendor similar
PIN for vendor CAGE numbers 1FN41 and 66579. Change to figure 3,
margin test method C for vendor CAGE 01295 and change to
programming waveforms. Change to 4.5. Editorial changes throughout.
Add case outline Z for vendor CAGE number 1FN41.
Changes in accordance with NOR 5962-R130-92.
Add case outline U. Add device types 09 and 10. Remove vendor
27014 from drawing. Editorial changes throughout.
Changes in accordance with NOR 5962-R118-94.
Updated boilerplate. Added device types 11-21. Removed vendors
1FN41, 18324, 34335, and 61394 from drawing. Added vendor 65786
to drawing. Removed margin test methods from drawing.
DATE
(YR-MO-DA)
87-12-17
APPROVED
M. A. Frye
B
89-01-01
M. A. Frye
C
90-12-05
M. A. Frye
D
E
F
G
92-01-30
93-10-15
94-02-16
97-06-11
M. A. Frye
M. A. Frye
M. A. Frye
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
CURRENT CAGE CODE 67268
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
G
15
G
16
REV
SHEET
G
1
G
2
G
3
G
4
G
5
G
6
G
7
G
8
G
9
G
10
G
11
G
12
G
13
G
14
PMIC N/A
PREPARED BY
James E. Jamison
CHECKED BY
Charles Reusing
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
87-02-12
REVISION LEVEL
G
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 262,144-BIT
UV ERASABLE PROM, MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
14933
1
OF
16
5962-86063
AMSC N/A
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E112-97
Intelligent electronic device (IED) system solution based on IEC61850
[color=#000000][size=14px][b]Smart Grid and IED[/b][/size][/color] [align=left]A smart grid is a power grid that uses information and communication technologies to collect information within the grid ...
苏莎莎 ADI Reference Circuit
Does anyone know what the long distance lock on the back of a landline phone is?
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 19:59[/i] Hi everyone, it's like the long-distance lock on the back of a landline phone. If you turn it to the left, you can make long-dis...
dreamprosper Mobile and portable
A funny joke and a sad story.
ver1.01: "Xiao x, I heard that you majored in communication engineering in college?" "Yes, leader." "Well, could you please fix this phone?" "Leader, please respect this major, communication engineeri...
ljj3166 Talking
I have a low current product powered by 5V. I want to connect a diode with a voltage drop of 0.7V. Which one should I use?
The voltage drop of 1N5819 is only about 0.3V, which does not meet my requirements....
satany2k Analog electronics
Several packaging forms of LED production
1. Pin-type (Lamp) LED package Pin-type package is a commonly used 3-5mm package structure. It is generally used for LED packages with low current (20-30mA) and low power (less than 0.1W). It is mainl...
探路者 LED Zone
LeCroy Releases Industry's Most Comprehensive MIPI Test Solution
LeCroy Releases Industry's Most Comprehensive MIPI Test Solution...
安_然 Test/Measurement

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 521  831  2525  89  686  11  17  51  2  14 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号