Product Guide
D_1111C Series, Ultra Compact InGaN/SiC SMT LED
s
Features
• High brightness (InGaN/SiC) die material
• Available in green (525nm), bluish-green (505nm)
•
and blue (470nm) colors
• Wide 130 degree viewing angle
• Reflow and dip soldering compatible
• 1000V minimum ESD protection
s
Applications
• Portable phone key pad backlight
• Various other backlight uses
s
Outline Dimensions
Epoxy
PCB
PCB Warpage direction
Unit: mm
Tolerances + 0.1
s
Electro-Optical Characteristics
Part No.
Material Emitted Lens
Color Color
InGaN/SiC
Green
(Ta=25°C)
Wavelength
Peak
λ
p
TYP.
Spectral Line
Dominant Half Width
λ
d
λ
∆λ
TYP.
TYP.
I
F
Luminous
Intensity
IV
MIN.
TYP.
I
F
Forward
Voltage
V
TYP.
MAX.
F
Reverse Viewing
Current
IR
Angle
I
F
MAX.
V
R
(2
θ
1/2)
DG1111C
DC1111C
DB1111C
24
Milky
24
White
8.5
40
34
14
10
10
10
mA
522
502
467
525
505
470
nm
30
30
26
10
10
10
mA
3.3
3.3
3.3
V
3.8
3.8
3.8
10
10
10
mA
100
100
100
µA
5
5
5
V
Deg.
130°
InGaN/SiC
Bluish-Green
InGaN/SiC
Blue
Units
mcd
s
Absolute Maximum Ratings
Green
Bluish-Green
DC
76
20
48
5
-40 to +85
-40 to +100
0.28 (DC) 0.69 (Pulse)
Blue
(Ta=25°C)
Item
Symbol
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Pd
I
F
I
FM
V
R
Topr
Tstg
∆I
F
DG
76
20
48
5
DB
76
20
48
5
Units
mW
mA
mA
V
°C
°C
mA/°C
* Ta=25°C,
I
FM
applies for the pulse width
≤
1msec. and duty cycle
≤1/20.
s
Taping Specifications
φ
1.5
+0.1
0
1.75+0.1
s
Operation Current Derating Chart (DC)
4+0.1
(1)
(0.2)
Center Hole
8+0.2
Quantity on tape:
4000 pieces
per reel
(φ 0.5)
Center Hole
2+0.05
4+0.1
3.5+0.05
(1.85)
(0.9)
Direction to pull
φ
21+0.8
2+0.5
+1
φ
60 -0
φ
13+0.2
DG, DC, DB,
φ
13+0.2
9+0.3
11.4+1
+0
φ
180 3
s
Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
LED Surface Temperature
°C
Operation Heating
240
Temperature
rise: 5°C/sec.
Cooling:
—5°C/sec.
s
Spatial Distribution
150
120
Pre-heating
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PGD1111C-0301
~
0
60 to 120 sec.
5 sec. max
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555
Website: www.stanley-electric.com
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