TL1L3-NW1,L
4. Absolute Maximum Ratings (Note) (Unless otherwise specified, T
a
= 25
)
Characteristics
Forward current (DC)
Forward current (pulsed)
Power dissipation
Operating temperature
Storage temperature
Junction temperature
Symbol
I
F
I
FP
P
D
T
opr
T
stg
T
j
(Note 1)
Note
Rating
1000
1200
3.4
-40 to 100
-40 to 100
130
W
Unit
mA
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width 10 ms, duty = 1/10
Fig. 4.1 I
F
- T
a
(Note)
Note:
The junction-to-ambient thermal resistance, R
th(j-a)
, should be kept below 20
/W
so that this product is not
exposed to a condition beyond the absolute maximum ratings.
R
th(j-a)
: Thermal resistance from the LED junction to ambient temperature
2
2014-09-04
Rev.2.0
TL1L3-NW1,L
5. Handling Precautions
•
This product is sensitive to electrostatic and care must be fully taken when handling products. Particularly
in the case that an overvoltage shall be applied, the overflowed energy may cause damage to or possibly
result in destruction of the product. Users shall take absolutely secure countermeasures against
electrostatic and surge when handling the product.
•
A damage to the device might create a tiny leakage path, which causes the LED lamp not to light up in the
low-current region or causes a drop in the V
F
rise voltage.
Failure criterion: I
F
≥
0.5 mA @ V
F
= 2 V
•
If multiple LEDs are connected in parallel, they will experience variations in the forward current due to
the characteristics differences in forward voltage. Ensure that the forward current of all the LEDs fall
within the intended range of the system design, for example, by inserting current-limiting resistors to each
LED string.
•
Since this product is intended to be used for display lighting, the measurement standard is based on the
spectral sensitivity of the human eye. It is not intended to be used for any applications other than display
lighting (e.g., sensors and light communications systems.)
•
Generally, GaN-based LEDs exhibit instability or significant device-to-device variations in the relative
luminous flux in the low-current region. To avoid these problems, an application system should be
designed in such a manner that the GaN-based LEDs are driven with a forward current of 10 mA or
higher.
•
•
•
This device should not be reverse-biased.
When the device is used in places that are likely to be exposed to condensation, salt or corrosive gas, the
effect on its performance and reliability must be thoroughly verified.
Please note the handling of products during evaluation.
(1) Please do not apply pressure to the upper surface of the product with finger, tweezers, and others.
Failure of product to light up may occur due to package deformation, wire deformation and/or
disconnection.
(2) Should tweezers be used in product handling, one with flat surfaces is recommended.
(3) Please handle the product widthwise.
(4) Please do not drop the product. There is a possibility for package transformation etc. to occur when the
product is dropped.
(5) Please do not stack the printed circuit boards on which the product is mounted to prevent damages to
product surface. Also, please note not to damage the surface of the product with cushioning material
etc. Surface damage to the product may influence their optical characteristics.
(6) Solder, flux, paper or heat-sensitive materials that might be deformed or discolored at
high temperatures should not be left on the surface of an LED lamp.
•
Extreme care should be exercised when using this device for high-power applications:
(1) Do not directly touch this device during active operation because it becomes hot,
depending on the operating power.
(2) Take a possible rise in ambient temperature around this device and the heat-resistant temperature of
the system components into consideration.
3
2014-09-04
Rev.2.0
TL1L3-NW1,L
6. Electrical Characteristics (Unless otherwise specified, T
a
= 25
)
Characteristics
Forward voltage
Thermal resistance
(junction-to-soldering point)
See Table 6.1.
Symbol
V
F
R
th(j-s)
(Note 1)
Note
Test Condition
I
F
= 350 mA
Min
2.7
Typ.
2.85
5
Max
3.3
Unit
V
/W
Note 1: R
th(j-s)
: Thermal resistance from the LED junction to solder point.
Table 6.1 Forward Voltage Rank (Note)
Rank
1
2
3
Test Condition
I
F
= 350 mA, T
a
= 25
,
Tolerance
±0.1
V
Forward Voltage
(Min)
2.7
2.9
3.1
Forward Voltage
(Max)
2.9
3.1
3.3
Unit
V
Note:
This LED lamp is sorted into forward voltage (V
F
) ranks shown above. Each reel includes the same rank LEDs.
Let the delivery ratio of each rank be unquestioned.
7. Optical Characteristics (Unless otherwise specified, T
a
= 25
)
Characteristics
Chromaticity
Chromaticity
Luminous flux
Color temperature
Color rendering index
Half-intensity angle
Symbol
C
x
C
y
φ
V
CCT
Ra
2θ1/2
(Note 2)
(Note 1)
Note
Test Condition
I
F
= 350 mA
Min
Typ.
Max
Unit
lm
K
°
See Fig. 7.1, Table 7.1.
See Fig. 7.1, Table 7.1.
120
80
135
5000
100
150
Note 1: See Table 7.2 for luminous flux rank.
Note 2: Tolerance:
±2
4
2014-09-04
Rev.2.0
Power technology
京公网安备 11010802033920号
EEWORLD
