datasheet
EEWORLDEEWORLDEEWORLD
Datasheet
Part Number

Keyword

Search
Keyword

Part Number

Search
Datasheet> All Categories > Passive components> The resistor> HCHP2208K30R9FG151
PDF
Preview

HCHP2208K30R9FG151

Description
Fixed Resistor, Metal Glaze/thick Film, 0.75W, 30.9ohm, 200V, 1% +/-Tol, -100,100ppm/Cel, 2208,
CategoryPassive components    The resistor   
File Size136KB，9 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

HCHP2208K30R9FG151 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.75W, 30.9ohm, 200V, 1% +/-Tol, -100,100ppm/Cel, 2208,

HCHP2208K30R9FG151 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid228059045
Reach Compliance Codecompliant
Country Of OriginFrance
ECCN codeEAR99
YTEOL6.65
structureChip
JESD-609 codee4
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.5 mm
Package length5.58 mm
Package formSMT
Package width2 mm
method of packingWaffle Pack
Rated power dissipation(P)0.75 W
GuidelineMIL-R-55342D
resistance30.9 Ω
Resistor typeFIXED RESISTOR
seriesHCHP
size code2208
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceGold (Au) - with Nickel (Ni) barrier
Tolerance1%
Operating Voltage200 V

HCHP2208K30R9FG151 Preview

CHP, HCHP
www.vishay.com
Vishay Sfernice
High Stability Resistor Chips
(< 0.25 % at Pn at 70 °C during 1000 h) Thick Film Technology
FEATURES
• Robust terminations
• Large ohmic value range 0.1
to 100 M
• Tight tolerance to 0.5 %
• CHP: Standard passivated version for
industrial, professional and military applications
• HCHP: For high frequency applications
• ESCC approved see CHPHR
• High temperature (245 °C) see CHPHT
Vishay Sfernice thick film resistor chips are specially
designed to meet very stringent specifications in terms
of reliability, stability < 0.25 % at Pn at + 70 °C during
1000 h, homogeneity, reproducibility and quality.
They conform to specifications NFC 83-240 and
MIL-R-55342 D.
Evaluated to ESCC 4001/026 (see CHPHR datasheet).
Sputtered Thin Film terminations, with nickel barrier, are
very convenient for high operating conditions. They can
withstand thousands of very severe thermal shocks.
B (W/A), N (W/A), and F (one face) types are for solder reflow
assembly.
G (W/A) and W (one face) types are for wire bonding, gluing
and even high temperature solder reflow.
• SMD wraparound chip resistor
• Halogen-free according to IEC 61249-2-21 definition
• Withstand moisture resistance test of AEC-Q200
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
Lead (Pb)-containing terminations are not RoHS-compliant.
Exemptions may apply.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
CHP0502
HCHP0502
CHP0505
HCHP0505
CHP0603
HCHP0603
CHP0805
HCHP0805
CHP1005
HCHP1005
CHP1206
HCHP1206
CHP1505
HCHP1505
CHP2010
HCHP2010
CHP1020
HCHP1020
CHP2208
HCHP2208
CHP2512
CHP2512
CHP1010
CHP1010
(1)
SIZE
0502
0505
0603
0805
1005
1206
1505
2010
1020
2208
2512
1010
RATED POWER
Pn
W
0.050
0.125
0.125
0.200
0.250
0.250
0.500
1.000
(2)
1.000
(2)
0.750
2.000
(2)
0.500
LIMITING ELEMENT
VOLTAGE
V
50
50
50
150
150
200
200
200
200
200
250
200
MAX. OVERLOAD
VOLTAGE
V
100
100
100
300
300
400
400
400
400
400
500
400
MAX.
RESISTANCE
(1)
M
25
10
25
25
50
50
75
100
10
100
100
25
UNIT WEIGHT
mg
1
3
2
4
5
8
8
26
25
21
42
12
Notes
Shall be read in conjunction with other tables
(2)
With special assembly care
Revision: 30-May-12
Document Number: 52023
1
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
Vishay Sfernice
DIMENSIONS
in millimeters (inches)
A
D
D
C
D
A
D
C
E
E
B
CASE
SIZE
0502
0505
0603
0805
1005
1206
1505
2010
1020
2208
2512
1010
A
VALUE
1.27 (0.050)
1.27 (0.050)
1.52 (0.060)
1.91 (0.075)
2.54 (0.100)
3.05 (0.120)
3.81 (0.150)
5.08 (0.200)
2.54 (0.100)
5.58 (0.220)
6.35 (0.250)
2.54 (0.100)
TOL.
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
VALUE
0.60 (0.024)
1.27 (0.050)
0.85 (0.033)
1.27 (0.050)
1.27 (0.050)
1.70(0.067)
1.32 (0.052)
2.54 (0.100)
5.08 (0.200)
2.00 (0.079)
3.30 (0.130)
2.54 (0.100)
B
TOL.
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
VALUE
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
C
TOL.
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
VALUE
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
D/E
TOL.
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
SUGGESTED LAND PATTERN
(to IPC-7351A)
G
min.
X
max.
Z
max.
CASE SIZE
0502
0505
0603
0805
1005
1206
1505
2010
1020
2208
2512
1010
DIMENSION IN MM (INCHES)
ZMAX.
1.82 (0.072)
1.82 (0.072)
2.37 (0.093)
2.76 (0.109)
3.39 (0.134)
3.90 (0.154)
4.66 (0.184)
5.93 (0.234)
3.39 (0.134)
6.43 (0.253)
7.20 (0.284)
3.39 (0.134)
GMIN.
0.10 (0.004)
0.10 (0.004)
0.35 (0.014)
0.74 (0.029)
1.37 (0.054)
1.88 (0.074)
2.64 (0.104)
3.91 (0.154)
1.37 (0.054)
4.41 (0.174)
5.18 (0.204)
1.37 (0.054)
XMAX.
0.73 (0.029)
1.40 (0.055)
0.98 (0.038)
1.40 (0.055)
1.40 (0.055)
1.73 (0.068)
1.45 (0.057)
2.67 (0.105)
5.21 (0.205)
2.04 (0.080)
3.19 (0.125)
2.67 (0.105)
Revision: 30-May-12
Document Number: 52023
2
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
POWER DERATING CURVE
Rated Power (%)
100
80
60
40
20
0
Vishay Sfernice
MECHANICAL SPECIFICATIONS
Substrate
Technology
Protection
Alumina
Thick film (ruthenium oxyde)
Epoxy coating
B (W/A):
SnPb over nickel barrier
for solder reflow
N (W/A):
SnAg over nickel barrier
for solder reflow
F (Flip Chip):
SnAg over nickel barrier
for solder reflow
W (one face) and G (W/A) type:
Gold over nickel barrier
for other applications
Terminations
0
20
40
60 70 80
100
120
140 155
Ambient Temperature in °C
Note
• Refer to Application Note “Guidelines for Vishay Sfernice
Resistive and Inductive Components” (document number:
52029) for recommended reflow profile. Profile #3 applies.
PACKAGING
ESD packaging available: Waffle pack and plastic tape and
reel (low conductivity). Paper tapes available on request
(ESD only).
NUMBER OF PIECES PER PACKAGE
WAFFLE
TAPE AND REEL
PACK
MIN.
MAX.
CLIMATIC SPECIFICATIONS
Operating temperature
range
- 55 °C; + 155 °C
SIZE
0502
0505
0603
0805
1005
1206
1505
2010
1010
2208
1020
2512
TAPE
WIDTH
Note
• For temperature up to 215 °C please consult Vishay Sfernice
100
4000
140
100
60
100
60
60
45
1000
4000
1000
2000
8 mm
8 mm
8 mm
8 mm
8 mm
8 mm
BEST TOL. AND TCR VS. OHMIC VALUE
OHMIC VALUE
RANGE in
10
<
R
< 5M
5
<
R
< 10M
1
<
R
<
R
max.
0.1
<
R
<
R
max.
TIGHTEST
TOLERANCE
(%)
0.5 % (D)
1 % (F)
2 % (G)
5 % (J)
(1)
BEST
TCR
(ppm/°C)
100 (K)
100 (K)
200 (L)
200 (L)
Note
(1)
Improved performance on request
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay Sfernice for specific ordering
code
Tape and Reel
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered is between the MOQ and the
maximum reel capacity, only one reel is provided.
When several reels are needed for ordered quantity
within MOQ and maximum reel capacity: Please consult
Vishay Sfernice for specific ordering code
CHIPS FOR HIGH FREQUENCY APPLICATIONS
The HF performance of flip chip and W/A types can be
improved on request.
Please ask for HCHP
Revision: 30-May-12
Document Number: 52023
3
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
TYPICAL HF PERFORMANCE OF HCHP
2.0
1.8
1.6
1.4
1.2
2.0
1
Ω
10
Ω
1.8
1.6
1.4
1.2
1
Ω
10
Ω
Vishay Sfernice
|Z|/R
|Z|/R
1.0
0.8
0.6
0.4
0.2
0
1
10
100
1000
1 MΩ
100 kΩ
10 kΩ
100
Ω
200
Ω
1.0
0.8
0.6
100
Ω
1 kΩ
200
Ω
1 kΩ
0.4
0.2
0
10 000
1
10
100
1000
1 MΩ
100 kΩ
10 kΩ
10 000
Size 0603 (W/A)
f (MHz)
Size 0603 (Flip chip)
f (MHz)
POPULAR OPTIONS
For any option it is recommended to consult Vishay Sfernice for availability first.
Option: Enlarged terminations:
0063
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat
sinks (see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film,
PRA Arrays, CHP Thick Film)
www.vishay.com/doc?53048.
Option to order: 0063 (applies to size 1206/1505/1020/2010/2512).
DIMENSIONS
(Option 0063) in millimeters
Bottom view for mounting
Uncoated
ceramic
Enlarged
termination
C
E
B
D
A
CASE
SIZE
1206
1505
2010
1020
2208
2512
A
± 0.152
3.00
3.70
5.03
2.49
5.53
6.30
B
± 0.127
1.73
1.25
2.64
5.18
2.05
3.30
C
± 0.127
0.38
0.50
0.50
0.50
0.50
0.50
D
± 0.127
0.40
0.50
0.50
0.31
0.50
0.50
E
± 0.127
1.19
1.54
2.20
0.93
2.45
2.84
Revision: 30-May-12
Document Number: 52023
4
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
Vishay Sfernice
SUGGESTED LAND PATTERN
(Option 0063)
G
min.
X
max.
Z
max.
CASE SIZE
1206
1505
2010
1020
2208
2512
DIMENSIONS (IN MILLIMETERS)
Z
max.
3.85
4.55
5.88
3.34
6.38
7.15
G
min.
0.50
0.50
0.50
0.50
0.50
0.50
X
max.
1.86
1.38
2.77
5.31
2.18
3.43
OPTION: MARKING
Option to order 0013:
Marking of ohmic value and tolerance:
Sizes: 0805 to 1005: 3 digits marking (according to EIA-96)
Sizes: 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)
Tolerance indicated by a color dot.
Option to order 0014:
Marking of ohmic value:
Sizes 0805 to 1005: 3 digits marking (according to EIA-96)
Sizes 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)
No standard marking available for smaller sizes.
A price adder will apply to the unit price of the parts for options 0013 and 0014.
PERFORMANCE
TESTS
Termination adhesion
Resistance to solder heat
CONDITIONS
5N for 10 s
Immersion 10 s
in Sn/Pb 60/40
at + 260 °C
5 cycles
- 55 °C
+ 155 °C
Phase A dry heat
Phase B damp heat
Phase C cold - 55 °C
Phase D damp heat 5 cycles
56 days
AEC-Q200
85 °C/85 % RH/Pn/10
1000 h
6.25 Pr
for 2 s
1000 h at rated power
90’/30’ at + 70 °C
REQUIREMENTS
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
TYPICAL VALUES
AND DRIFTS
< ± 0.1 %
< ± 0.1 %
Rapid temperature change
< ± 0.1 %
Climatic sequence
Humidity (steady state)
Moisture resistance
Short time overload
Load life
± (1 % + 0.05
)
± (1 % + 0.05
)
0.5 % + 0.05
± (0.25 % + 0.05
)
1000 h
± (1 % + 0.05
)
1000 h
< 0.25 %
< ± 0.2 %
< ± 0.2 %
Max. < 3 % + 0.05
< ± 0.1 %
2000 h
< 0.5 %
10 000 h
<1%
Revision: 30-May-12
Document Number: 52023
5
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

Remote temperature measurement circuit with external buffer

A single-section transistor performance test circuit

Crystal diode three-phase bridge resistive load rectifier circuit

Basic application circuit diagram

Basic application circuit for VF conversion using LM311

Multi-channel wireless remote control circuit (F36-F／F36-J)

vectors_exint.s55
Does anyone know where this vectors_exint.s55 file comes from? Is it written by the user or given by TI? ? ? ?...
YXQWXN DSP and ARM Processors
Boring post. Can you tell me if I can get a free mobile phone from China Telecom?
My original broadband was ADSL, so the landline phone could be used even when there was a power outage. After the phone was moved, a fiber optic modem was installed for me, and the phone was connected...
wangfuchong Talking
EEWorld’s 15th Anniversary, Thanks to All of You! A Review of Those Unforgettable Little Happinesses~
In a blink of an eye, EEWorld is 15 years old. There are so many wonderful memories along the way. Let us recall those unforgettable little happiness, those wonderful things that were made possible by...
EEWORLD社区 Talking
Please help me answer some questions about C6678 multi-core startup
I haven't got the board yet, and now I want to understand some questions. I hope you can give me some advice. 1. Regarding the order of c6678 multi-core startup, I have read some information. After po...
guzl86 DSP and ARM Processors
Beacon navigation sound positioning and recognition - analysis of sound source positioning algorithm
1. Analysis of TDOA (Time Difference Algorithm) Principle A commonly used method for sound localization ( time difference method ): the position of an unknown node ( sound module ) is calculated by me...
bqgup Creative Market
AVR chip locked, help needed
Today I used ISp to download atmega16, and the chip seemed to be locked. I used progisp software. After I bought a new chip, I soldered an Atmega16 and 51 on the same board, using the same power suppl...
jialaolian Microchip MCU
Shortcut:   00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components

  1. APL5320-32QB
  2. ACT24ME08HA [V001]
  3. FSLT09P101G3
  4. TX-3090-AEJ-11RX-FREQ
  5. SD-14596F2-262Q
  6. GP70ER-2670-BT25Q
  7. 9T12103A83R5BAPF3
  8. M55342E08B13B2T-W
  9. BAW56W-AU_L0_10001
  10. 3.0SMCJ70C_R1_00001
  11. 5KP45A
  12. SLR0364CRA1BD

Popular Articles

  1. Infineon Technologies: Layered design and trusted security ensure the safety of intelligent connected cars
  2. Reliable and high-precision fully automatic closed cup flash point tester
  3. Blaize and LeiShen Intelligent Technology have reached a strategic cooperation agreement to integrate LiDAR and AI functions
  4. LeddarTech to Participate in Three Major International Events in September 2021
  5. 3C certification shows that Xiaomi 12 Pro may support 120W fast charging
  6. ArcherMind Technology received government subsidies of approximately RMB 11.19 million, accounting for more than 10% of its net profit last year.
  7. Exynos4412 kernel porting (V) - driver porting
  8. Tektronix Delivers Industry-First PCIe 6.0 Test Solution
  9. 51 MCU Introduction - Study Notes
  10. How to test the ripple of switching power supply_How to test the ripple of switching power supply with oscilloscope

Technical ResourceMore

  1. Car audio principles and practical modification techniques
  2. CDMA technical information
  3. Motor load calculation tool software
  4. Multimedia Solutions Based on OMAP2 and OMAP3
  5. Thermal imaging camera for security monitoring
  6. Decoder Data Distributor
  7. Pitch Angular Velocity Estimation Based on Kalman Filter
  8. Information on current balancing when using module power supplies in parallel
  9. LDO Terms and Definitions
  10. proe5.0 Wildfire version download (Chinese version free download)

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Index Files: 1271  2696  1411  522  1363  26  55  29  11  28 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号