54AC818LMQB datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> 54AC818LMQB

54AC818LMQB: DescriptionIC,PIPELINE REGISTER,AC-CMOS,LLCC,28PIN,CERAMIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size454KB，8 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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54AC818LMQB Overview

IC,PIPELINE REGISTER,AC-CMOS,LLCC,28PIN,CERAMIC

54AC818LMQB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Reach Compliance Code	compli
JESD-30 code	S-XQCC-N28
JESD-609 code	e0
Number of terminals	28
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC28,.45SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	3.3/5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, PIPELINE REGISTER
Base Number Matches	1

54AC818LMQB Related Products

	54AC818LMQB	54AC818DMQB	54AC818FMQB	74AC818QCQR	74AC818DCQR
Description	IC,PIPELINE REGISTER,AC-CMOS,LLCC,28PIN,CERAMIC	IC,PIPELINE REGISTER,AC-CMOS,DIP,24PIN,CERAMIC	IC,PIPELINE REGISTER,AC-CMOS,FP,24PIN,CERAMIC	IC,PIPELINE REGISTER,AC-CMOS,LDCC,28PIN,PLASTIC	IC,PIPELINE REGISTER,AC-CMOS,DIP,24PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	compli	compliant	compliant	compliant	compliant
JESD-30 code	S-XQCC-N28	R-XDIP-T24	R-XDFP-F24	S-PQCC-J28	R-XDIP-T24
JESD-609 code	e0	e0	e0	e0	e0
Number of terminals	28	24	24	28	24
Maximum operating temperature	125 °C	125 °C	125 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	QCCN	DIP	DFP	QCCJ	DIP
Encapsulate equivalent code	LCC28,.45SQ	DIP24,.6	FL24,.4	LDCC28,.5SQ	DIP24,.6
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	FLATPACK	CHIP CARRIER	IN-LINE
power supply	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V
surface mount	YES	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	THROUGH-HOLE	FLAT	J BEND	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL	QUAD	DUAL
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER
Base Number Matches	1	1	1	1	1
Certification status	Not Qualified	Not Qualified	Not Qualified	-	-
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	-	-

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Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

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