4310T-102-5360BCL datasheet, PDF

Datasheet> All Categories > Passive components> The resistor> 4310T-102-5360BCL

4310T-102-5360BCL: DescriptionArray/Network Resistor, Isolated, Thin Film, 1.25W, 50V, 0.1% +/-Tol, 25ppm/Cel, Through Hole Mount, SIP, ROHS COMPLIANT; CategoryPassive components The resistor; File Size198KB，2 Pages; ManufacturerBourns; Websitehttp://www.bourns.com; Environmental Compliance

Download Datasheet Parametric View All

4310T-102-5360BCL Overview

Array/Network Resistor, Isolated, Thin Film, 1.25W, 50V, 0.1% +/-Tol, 25ppm/Cel, Through Hole Mount, SIP, ROHS COMPLIANT

4310T-102-5360BCL Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Objectid	1998701456
package instruction	SIP, ROHS COMPLIANT
Reach Compliance Code	not_compliant
ECCN code	EAR99
Component power consumption	0.18 W
The first element resistor	536 Ω
JESD-609 code	e3
Manufacturer's serial number	4300T
Installation features	THROUGH HOLE MOUNT
Network Type	ISOLATED
Number of components	1
Number of functions	5
Number of terminals	10
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Rated power dissipation(P)	1.25 W
Rated temperature	70 °C
Resistor type	ARRAY/NETWORK RESISTOR
surface mount	NO
technology	THIN FILM
Temperature Coefficient	25 ppm/°C
Temperature coefficient tracking	5 ppm/°C
Terminal surface	Tin (Sn)
Terminal shape	FLAT
Tolerance	0.1%
Operating Voltage	50 V

Preview

Download Datasheet

View All

VE S CO

AV R M

AI SIO PL

LA N IA

BL S NT

Features

■

RoHS compliant* (see How to Order

“Termination” option)

Low profile provides compatibility with

DIPs

Also available in medium profile (4300S -

.250 ”) and high profile (4300K - .350 ”)

Marking on contrasting background

■

Custom circuits available per factory

4300T, S, K Series - Thin Film Molded SIP

Product Characteristics

Resistance Range

Bussed ...................49.9 to 100K ohms

Isolated ......................20 to 200K ohms

Series.........................20 to 100K ohms

Resistance Tolerance

.........................±0.1 %, ±0.5 %, ±1 %

Temperature Coefficient

..................±100 ppm/°C, ±50 ppm/°C,

±25 ppm/°C

Temperature Range ....-55 °C to +125 °C

Insulation Resistance

..................10,000 megohms minimum

TCR Tracking .........................±5 ppm/°C

Maximum Operating Voltage............50 V

Environmental Characteristics

Thermal Shock and

Power Conditioning ...................... 0.1 %

Short Time Overload ..................... 0.1 %

Terminal Strength ........................ 0.25 %

Resistance to Soldering Heat ....... 0.1 %

Moisture Resistance ..................... 0.1 %

Life .............................................. 0.50 %

Physical Characteristics

Body Material Flammability

...........................Conforms to UL94V-0

Lead Frame Material

..........................Copper, solder coated

Body Material ..................Novolac epoxy

How To Order

Package Power Temp. Derating Curve

(Low Profile, 4300T)

(

)

1.75

1.50

4311T

WATTS

1.25

1.00

.75

.50

.25

4310T

4309T

4308T

4306T

Product Dimensions

27.53

MAX.

(1.084)

22.45

MAX.

(.884)

14.83 MAX.

(.584)

24.99

MAX.

(.984)

19.92

MAX.

(.784)

PIN #1 REF.

4.95

(.195)

MAX.

.381 + .127/ - .000

(.015 + .005/ - 000)

2.54

.07

(.100

.003*)

TYP.

NON-ACCUM.

3.43 + .38/ - .25

(.135 + .015/ - .010)

1.02

.12

(.040

.005)

.483

.050

TYP.

(.020

.002)

2.16

.10

(.085

.004)

150

125

AMBIENT TEMPERATURE (

C )

Package Power Ratings at 70°C

4304 .......... ............ 0.60...... 0.80 watts

4306 ...... 0.75.......... 0.90...... 1.20 watts

4308 ...... 1.00.......... 1.20...... 1.60 watts

4309 ...... 1.13 ................................watts

4310 ...... 1.25.......... 1.50...... 2.00 watts

4311 ...... 1.38 ................................watts

1.02

.05

(.0425

.002)

.254

.050

(.010

.002)

Governing dimensions are in metric. Dimensions in parentheses

are inches and are approximate.

*Terminal centerline to centerline measurements made at point of

emergence of the lead from the body.

43 11 T - 101 - 2222 F A B __

Model

(43 = Molded SIP)

Number of Pins

Physical Config.

•T = Low Profile Thin Film

•S = Med. Profile Thin Film

•K = High Profile Thin Film

Electrical Configuration

•101 = Bussed

•102 = Isolated

•106 = Series

Resistance Code

•First 3 digits are significant

•Fourth digit represents the

number of zeros to follow.

Absolute Tolerance Code

•B = ±0.1%

•F = ±1%

•D = ±0.5%

Temperature Coefficient Code

•A = ±100ppm/°C •C = ±25ppm/°C

•B = ±50ppm/°C

Ratio Tolerance (Optional)

•A = ±0.05% to R1 •D = ±0.5% to R1

•B = ±0.1% to R1

Terminations

• L = Tin-plated (RoHS compliant version)

• Blank = Tin/Lead-plated

Consult factory for other available options.

Typical Part Marking

Represents total content. Layout may vary.

PART

NUMBER

4311T-101-

1003BB

YYWW

CIRCUIT

RESISTANCE

CODE

DATE CODE

PIN ONE

INDICATOR

MANUFACTURER'S

TRADEMARK

*RoHS Directive 2002/95/EC Jan 27 2003 including Annex

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Recommended Resources

Digital voltmeter

Music sound control level indicator circuit diagram

Portable rechargeable light circuit

DC electromagnet strong excitation fast pull-in circuit 3b

217 basic working circuit

Track and hold circuit diagram with frequency up to 4KHZ

RCLAMP0504F original RCLAMP0504P spot special price hot sale 15919752102 Liu Aiping: RCLAMP0504F, RCLAMP0504P, RCLAMP0504 Acting as SEMTECH brand IC distributor in Shenzhen, hot selling models: RCLAMP0502, RClamp0502B.TCT, RClamp0502B, RCLAMP0514, RClamp0514M.TBT, RClamp0514M, RCLAMP0...; liuaiping Mobile and portable

Analysis of the top ten hottest new microprocessor and memory products in the first quarter of 2006: Analysis of the top ten hottest new microprocessor and memory products in the first quarter of 2006TI's MSP430 MCU breaks the 500nA limit Editor's Recommendation : Texas Instruments' (TI) latest MSP43...; 1234 Energy Infrastructure?

Thank you note: I am very grateful to all the teachers in the world of electronic engineering. If you encounter a problem, you can post it here and get the answer you want quickly, or be inspired. Thank you all! ! ! ...; emily_1105 Microchip MCU

Altium Designer pad cross via direct connection, routing and copper plating spacing settings: [i=s]This post was last edited by littleshrimp on 2015-6-8 10:30[/i] The first one is to set the via to a straight connection and the pad to a cross connectionCreate two rules under Polygon Connect St...; littleshrimp PCB Design

Anyone familiar with serial port settings and communication can help me, thank you: The company used to make its own "foot switch" with a serial line. When the foot is stepped on, the serial port will receive a signal. I asked the engineering department about some parameters of the f...; mtv0312 Embedded System

MEPG Basics and Protocol Analysis Guide: ...; 逍遥 Test/Measurement

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components