EEWORLDEEWORLDEEWORLD

Part Number

Search

H1206CPC272K30

Description
Fixed Resistor, Metal Glaze/thick Film, 0.25W, 2700ohm, 100V, 10% +/-Tol, 300ppm/Cel, Surface Mount, 1206, CHIP
CategoryPassive components    The resistor   
File Size126KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance
Download Datasheet Parametric View All

H1206CPC272K30 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 2700ohm, 100V, 10% +/-Tol, 300ppm/Cel, Surface Mount, 1206, CHIP

H1206CPC272K30 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid225055639
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL7.25
structureRectangular
JESD-609 codee4
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Package height0.46 mm
Package length3.2 mm
Package formSMT
Package width1.55 mm
method of packingBULK
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance2700 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient300 ppm/°C
Terminal surfaceSilver (Ag)
Terminal shapeWRAPAROUND
Tolerance10%
Operating Voltage100 V

H1206CPC272K30 Preview

1206 Thick Film Chip Resistor
Standard Grade, Wraparound
PERFORMANCE CHARACTERISTICS
Resistance Range
Tolerances (1)
TCR
Thermal Resistance
Maximum Power
Maximum Voltage
(1)+/- 0.5% limited availability
1
W-40
M
W
0.5%,1%, 2%, 5%,10%
±100, ±200, ±300 ppm
77.1°C/W
250 mW
100 Volts
GLASS
PASSIVATION
RESISTOR
FILM
96% ALUMINA CHIP
WRAPAROUND
TERMINATIONS
CURRENT NOISE
TEMPERATURE RISE (°C)
POWER DISSIPATION
fiber epoxy board
ceramic board
ENVIRONMENTAL PERFORMANCE (2)
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Bonding Exposure
Moisture Resistance
High Temperature Exposure
Life Test
±0.03%
±0.03%
±0.03%
±0.03%
±0.05%
±0.05%
See Chart
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
(2)Typical resistance change, test methods and criteria
per MIL-PRF-55342.
PART NUMBERING
S 1206 C P X 150 J 20 - TR
PACKAGING CODE: - TR = Tape/Reel - W = Waffle Carrier (Default packaging is Bulk)
TEMPERATURE CHARACTERISTIC: 10: ±100 ppm 20: ±200 ppm 30: ±300 ppm
TOLERANCE: F: 1% G: 2% J: 5% K: 10% M: 20%
RESISTANCE VALUE:
Four digits are used for tolerances of 1% or lower, three digits are used above 1%. Leading digits are significant while the last digit
specifies the number of zeros to add. The letter "R" is used to represent the decimal for fractional ohmic values. Example: 5R6 is 5.6
ohms.
TERMINATION FINISH: X: Sn60 over Nickel (Solderable) C: Silver bearing (Epoxy bondable-RoHS) G: Gold (Epoxy bondable-RoHS)
Y: Silver over Nickel (Solderable -RoHS) Z: Gold over Nickel (Solderable-RoHS)
PRODUCT DESIGNATION: P: Thick film on alumina U: Untrimmed alumina (10% & 20% tolerance only)
TERMINATION TYPE: C: Wraparound termination
SIZE CODE
GRADE: S: Standard Production H: High Reliability (For Screening options, contact the factory)
MECHANICAL
.156
INCHES
MILLIMETERS
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.126 (.124 - .134)
.061 (.059 - .067)
.018 (.015 - .023)
.016 (.010 - .025)
.018 (.010 - .025)
.090 (.086 - .094)
.0084 grams
3.20
1.55
0.46
0.41
0.46
2.29
(3.15 - 3.40)
(1.50 - 1.70)
(0.38 - 0.58)
(0.25 - 0.64)
(0.25 - 0.64)
(2.18 - 2.39)
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
.067
.084
.036
“Specifications subject to change without notice.”
STATE OF THE ART, INC.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004
www.resistor.com
Fax (814) 355-2714
Toll Free 1-800-458-3401
02/08/08
JTAG parallel port debugging problem
The hardware is connected to the parallel port emulator, and the voltage of each pin is tested to be normal, but the device cannot be found! ! Frustrating! What experience do you have?...
hurton Microcontroller MCU
A 2.7-inch LCD screen has only 8 data PINs. How should the hardware be connected to use it on a 6410 (ARM11, 32-bit) platform?
A 2.7-inch LCD screen has only 8 data PINs. How should the hardware be connected to use it on a 6410 (ARM11, 32-bit) platform? Should the 8 data PINs of the LCD screen be connected to [7:0] [15:0] [23...
张皓翔 ARM Technology
Is there anyone who can do this project and develop software similar to FastCAM?
Is there anyone who can do this project to develop software similar to FastCAM, that is, to develop drawing (CAD) and nesting functions similar to FastCAM? If anyone can do it, please contact me immed...
1581582 Embedded System
Seeking --Senior Bluetooth Software Engineer
Employer: A world famous company Position: Senior Bluetooth software engineer Headcount: Several Job Requirements:Bachelor Degree or AboveWorking Experience: Rich experience in Bluetooth development o...
gjfzb Embedded System
【R7F0C809】AD sampling
I took a look at the AD configuration of C809 last night. It is also relatively simple. The main functions are:Peripheral enable register 0 (PER0)A/D converter mode register 0 (ADM0)A/D converter mode...
ljj3166 Renesas Electronics MCUs
MSP430 clock configuration
I just started learning MSP430 programming and looked at TI's example code. I don't quite understand the following program code, and I didn't find any useful information after checking the related hea...
sywcxx Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 595  1267  424  2839  2627  12  26  9  58  53 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号