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XE30-213G-0.400MHZ

Description
ACMOS Output Clock Oscillator, 0.4MHz Nom, CMOS,
CategoryPassive components    oscillator   
File Size205KB,4 Pages
ManufacturerXsis Electronics Inc.
Download Datasheet Parametric View All

XE30-213G-0.400MHZ Overview

ACMOS Output Clock Oscillator, 0.4MHz Nom, CMOS,

XE30-213G-0.400MHZ Parametric

Parameter NameAttribute value
Objectid145060421146
package instructionSMDIP4,.38,200
Reach Compliance Codecompliant
Other featuresTRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH; TRAY
maximum descent time6 ns
Frequency Adjustment - MechanicalNO
frequency stability1000%
Installation featuresSURFACE MOUNT
Number of terminals4
Nominal operating frequency0.4 MHz
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Oscillator typeACMOS
Output load10 KOHM, 15 pF
Package body materialCERAMIC
Encapsulate equivalent codeSMDIP4,.38,200
physical size14.1mm X 9.53mm X 3.56mm
longest rise time6 ns
Maximum slew rate10 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
maximum symmetry55/45 %
technologyCMOS
“ XE30-200A ” Series ( HC/ACMOS), 5.0 VDC
High Reliability Hybrid Microcircuit Crystal Oscillators
( Similar to M55310/27 )
#4
#3
Features
Ruggedized 4 Point Crystal Mount
Tristate Output Option
Radiation Tolerant to 10K Rads
Low Profile Surface Mount, 0.140” Max. Height
100% Screening Options
Low Phase Noise
Hermetically Sealed, Ceramic Package
ECCN: EAR99
Marking
#1
.200 + .005
(5.08 + .13)
#2
.040
( 1.0 )
Typ.
.140 Max
(3.56)
.018 + .003
(.46 + .08)
.557 Max
(14.1)
.300 + .006
(7.6 + .15)
.008 + .001
(.20 + .03)
.375
Max
(9.53)
Applications
High Shock & Vibration Applications
Navigation Systems
Aerospace Instrumentation
Benign Space Applications
Gun Launched Munitions
.130
(3.3)
Dimensions: Inches (mm)
.070
(1.78)
LEAD#
1
FUNCTION
E/D (Optional)
GND/CASE
OUTPUT
VDD
Package Specifications & Outline:
Package : Ceramic 90% AL
2
O
3
Seal: Hermetic – Resistance Welded
Weight: 0.8 Gms typical, 1.0 Gms Max.
o
Thermal Resistance, Junction to Case ( θ
JC
): 30 C / Watt
o
Solder Reflow, Temp./Time: 260 C, 10 Secs. Max.
Lead Material & Finish: Kovar, 50 to 80 μ inches gold
over 100 to 250 μ inches Nickel
Typical PCB
Layout
.300
(7.6)
2
3
4
.200
(5.08)
E/D ( Enable/Disable ) Input:
A “Low”
level at the input disables the Output
into a high impedance state.
E/D
Input has internal pull-up. It can
be left floating or connected to Vdd.
Hot Solder Tinning per MIL-PRF-55310 is optional at additional cost.
Contact Xsis Electronics
at xsis@xsis.com for any special requirements.
ORDERING INFORMATION
( Please build your part number from options below ) :
P/N EXAMPLE: XE30 – 243AG – 883B - 24.000 MHz =
5.0V HC/ACMOS, + 50 PPM over -55 C to +125 C,
Tristate Output, 883B Screening, 24.000 MHz
o
o
XE30
2
Model #
4
3
A
Model #
G
883B
24.000 MHz
Output Frequency
Frequency Stability
Options
1 = + 0.1%
2 = + 500 PPM
3
4
5
6
7
=
=
=
=
=
+ 100 PPM
+ 50 PPM
+ 20 PPM *
+ 10 PPM *
+ 25 PPM *
100% Screening Options
Operating Temp. Range
Options
1
2
3
4
5
6
=
=
=
=
=
=
0 C
- 40
o
C
- 55
o
C
- 55
o
C
- 40
o
C
- 20
o
C
o
to + 70 C
to + 85
o
C
to +125
o
C
to +105
o
C
to + 95
o
C
to + 70
o
C
o
Tristate Options
G
= Tristate
Blank = No Tristate
883B = Mil - Screening
H
= HI-REL Screening
Blank = No Screening
MIL Screening
is same as
MIL-PRF-55310 Class B Screening
HI-REL Screening
is similar to
MIL-PRF-55310 Class S Screening
Rev 03 /16
* Frequency Stability Options 5, 6 & 7 are not
available for all operating temperature ranges.
Page 1 of 4
Tel. 913-631-0448 Fax. 913-631-1170, www.xsis.com, email xsis@xsis.com
Xsis Electronics, Inc.,
12620 W. 63rd St., Shawnee, KS 66216
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