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XH6L-24M-0.500MHZ

Description
HCMOS Output Clock Oscillator,
CategoryPassive components    oscillator   
File Size268KB,6 Pages
ManufacturerXsis Electronics Inc.
Environmental Compliance
Download Datasheet Parametric View All

XH6L-24M-0.500MHZ Overview

HCMOS Output Clock Oscillator,

XH6L-24M-0.500MHZ Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid7141237563
Reach Compliance Codecompliant
Other featuresTR
maximum descent time6 ns
Frequency Adjustment - MechanicalNO
frequency stability40%
JESD-609 codee4
Installation featuresSURFACE MOUNT
Nominal operating frequency0.5 MHz
Maximum operating temperature180 °C
Minimum operating temperature-20 °C
Oscillator typeHCMOS
Output load10 KOHM, 15 pF
physical size7.0mm x 5.0mm x 2.0mm
longest rise time6 ns
Maximum supply voltage2.75 V
Minimum supply voltage2.25 V
Nominal supply voltage2.5 V
surface mountYES
maximum symmetry40/60 %
Terminal surfaceGold (Au) - with Nickel (Ni) barrier
“XH6” Series, 5 x 7 mm
High Temperature Hybrid Microcircuit Crystal Oscillators
( 1.8 VDC, 2.5 VDC, 3.3 VDC 5.0 VDC
500 KHz to 40 MHz )
Description
Xsis Electronics “XH6” Series High Temperature
crystal oscillators are designed and processed to
operate over an extended temperature range of
-55
o
C to 230
o
C. These oscillators are offered in a
low profile, hermetically sealed resistance welded
5x7mm ceramic package.
High temperature materials and proven processes are
utilized to provide high reliability and long life at
extreme temperatures.
In addition, the quartz crystal is mounted at four
points to provide excellent shock and vibration
resistance.
4
3
Marking
1
2
.275 + .008
(7.0 + .015)
.197 + .008
(5.0 + .15)
LEAD#
1
2
.079 Max.
(2.0)
3
4
FUNCTION
E/D (Optional)
GND/CASE
OUTPUT
VDD
.071
(1.8)
.200 + .005
(5.08 + .13)
Features
Crystal Mounted at 4 Points
> 20KG ( 0.3 mS) Shock Resistance
1.8V, 2.5V, 3.3V & 5.0V operation options
100% testing over operating temperature range
Tristate Output Option
Low Phase Noise
Hermetically Sealed, Ceramic Package
Tape & Reel packaging
Made in USA, ECCN: EAR99
1
2
.103
(2.62)
Bypass
Cap.
.079
(2.0)
.071
(1.8)
4
3
.055
(1.4)
.047
(1.2)
Typical
PCB
Layout
.200 + .005
(5.0 + .13)
Dimensions: Inches (mm).
Applications
Downhole Drilling Operations
High Shock & Vibration
High Temperature Avionics
Gun Launched Munitions
Jet Engine Sensors
An External 0.01uF Bypass Capacitor
is required between VDD and GND.
E/D ( Enable/Disable ) Input:
A “Low”
level at the input disables the Output
into a high impedance state.
E/D
Input has internal pull-up. It can
be left floating or connected to Vdd.
Package Specifications & Outline:
Package: Ceramic 90% AL
2
O
3,
Seal: Hermetic – Resistance Welded
Weight: 0.15 Gms Typical, 0.2 Gms
Thermal Resistance, Junction to Case ( θ
JC
): 38
o
C / Watt
Solder Reflow, Temp./Time: 260
o
C Max for 10 Seconds Max.
Pad Finish: 1.27 to 2.2
μm
gold over 1.27 to 8.9
μm
nickel
Hot Solder Tinning per MIL-PRF-55310 is optional at additional cost.
Contact Xsis Electronics
at xsis@xsis.com for any special requirements.
Rev 06 /17
Page 1 of 6
Xsis Electronics, Inc.,
12620 W. 63rd St., Shawnee, KS 66216 Tel. 913-631-0448 Fax. 913-631-1170, www.xsis.com, email xsis@xsis.com
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