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5962-9458506H4X

Description
EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66
Categorystorage    storage   
File Size172KB,12 Pages
ManufacturerMicross
Websitehttps://www.micross.com
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5962-9458506H4X Overview

EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66

5962-9458506H4X Parametric

Parameter NameAttribute value
Parts packaging codePGA
package instructionCERAMIC, PGA-66
Contacts66
Reach Compliance Codecompli
ECCN code3A001.A.2.C
Maximum access time120 ns
Other featuresUSER CONFIGURABLE AS 512K X 8
Spare memory width16
JESD-30 codeS-CPGA-P66
memory density4194304 bi
Memory IC TypeEEPROM MODULE
memory width32
Number of functions1
Number of terminals66
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height4.699 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum write cycle time (tWC)10 ms
Base Number Matches1
ACT–E128K32 High Speed
4 Megabit EEPROM Multichip Module
Features
Package
Organized as 128K x 32
User
CIRCUIT TECHNOLOGY
www.aeroflex.com
4 Low Power 128K x 8 EEPROM Die in One MCM
Packaging – Hermetic Ceramic
Configurable to 256K x 16 or 512K x 8
CMOS and TTL Compatible Inputs and Outputs
Access Times of 120,140,150, 200, 250& 300ns
+5V ±10% Supply
Automatic Page Write Operation
Page Write Cycle Time: 10ms Max
Data Retention Ten Years Minimum
Low Power CMOS
Data Polling for End of Write Detection
Industry Standard Pinouts
66 Pin, 1.08" x 1.08" x .160" PGA Type, No Shoulder,
Aeroflex code# "P3"
66 Pin, 1.08" x 1.08" x .185" PGA Type, With
Shoulder, Aeroflex code# "P7"
68 Lead, .88" x .88" x .200" Dual-Cavity Small
Outline Gull Wing, Aeroflex code# "F2"
(Drops into
the 68 Lead JEDEC .99"SQ CQFJ footprint)
MIL-PRF-38534 Compliant MCMs Available
Hardware and Software Data Protection
Internal Decoupling Capacitors for Low Noise
Operation
Commercial, Industrial and Military Temperature
Ranges
SMD# 5962–94585 Released (P7 & F2)
General Description
Block Diagram – PGA Type Package (P3,P7) & CQFP (F2)
The ACT–E128K32 is a high
speed, 4 megabit, CMOS
EEPROM multichip module
(MCM) designed for full
temperature range military,
space, or high reliability
applications. The MCM can be
organized as a 256K x 16 bits
or 512K x 8 bits device and is
input and output CMOS and
TTL compatible. Writing is
executed when the write enable
(WE) and chip enable (CE)
inputs are low and output
enable (OE) is high. Reading is
accomplished when WE is high
and CE and OE are both low.
Access
times
grades
of
120, 140, 150, 200, 250 & 300ns
are standard.
The
ACT–E128K32
is
packaged in a choice of
hermetically sealed co-fired
ceramic packages, a 66 pin,
1.08" sq PGA or a 68 lead, .88"
sq gullwing CQFP. The device
operates over the temperature
range of -55°C to +125°C and
military environment.
WE
1
CE
1
WE
2
CE
2
WE
3
CE
3
WE
4
CE
4
A
0
– A
16
OE
128Kx8
128Kx8
128Kx8
128Kx8
8
8
8
8
I/O
0-7
I/O
8-15
I/O
16
-
23
I/O
24-31
Pin Description
I/O
0-31
Data I/O
A
0–16
Address Inputs
WE
1-4
Write Enables
OE
CE
1-4
V
CC
GND
Output Enable
Chip Enables
Power Supply
Ground
eroflex Circuit Technology - Advanced Multichip Modules © SCD1662 REV B 9/5/01

5962-9458506H4X Related Products

5962-9458506H4X 5962-9458506H5X 5962-9458506HMX
Description EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66 EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66 EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CQMA68, DUAL CAVITY, CERAMIC, QFP-68
Parts packaging code PGA PGA QMA
package instruction CERAMIC, PGA-66 CERAMIC, PGA-66 DUAL CAVITY, CERAMIC, QFP-68
Contacts 66 66 68
Reach Compliance Code compli compliant compliant
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Maximum access time 120 ns 120 ns 120 ns
Other features USER CONFIGURABLE AS 512K X 8 USER CONFIGURABLE AS 512K X 8 USER CONFIGURABLE AS 512K X 8
Spare memory width 16 16 16
JESD-30 code S-CPGA-P66 S-CPGA-P66 S-CQMA-G68
memory density 4194304 bi 4194304 bit 4194304 bit
Memory IC Type EEPROM MODULE EEPROM MODULE EEPROM MODULE
memory width 32 32 32
Number of functions 1 1 1
Number of terminals 66 66 68
word count 131072 words 131072 words 131072 words
character code 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
organize 128KX32 128KX32 128KX32
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL PARALLEL
Programming voltage 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Filter level MIL-STD-883 MIL-STD-883 MIL-STD-883
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO YES
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY
Terminal form PIN/PEG PIN/PEG GULL WING
Terminal location PERPENDICULAR PERPENDICULAR QUAD
Maximum write cycle time (tWC) 10 ms 10 ms 10 ms
Base Number Matches 1 1 1
encapsulated code PGA PGA -
Maximum seat height 4.699 mm 4.699 mm -
Terminal pitch 2.54 mm 2.54 mm -
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