MX23L2000MI-15 datasheet, PDF - EEWORLD Datasheet

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MX23L2000MI-15: DescriptionMASK ROM, 256KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32; Categorystorage storage; File Size114KB，4 Pages; ManufacturerMacronix; Websitehttp://www.macronix.com/en-us/Pages/default.aspx

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MX23L2000MI-15 Overview

MASK ROM, 256KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32

MX23L2000MI-15 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Macronix
Parts packaging code	SOIC
package instruction	SOP, SOP32,.56
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	150 ns
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
length	20.447 mm
memory density	2097152 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP32,.56
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/3.3 V
Certification status	Not Qualified
Maximum seat height	2.9972 mm
Maximum standby current	0.00001 A
Maximum slew rate	0.02 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.303 mm
Base Number Matches	1

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Description	MASK ROM, 256KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	MASK ROM, 256KX8, 200ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	MASK ROM, 256KX8, 200ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32	MASK ROM, 256KX8, 150ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32	MASK ROM, 256KX8, 500ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Macronix	Macronix	Macronix	Macronix	Macronix
Parts packaging code	SOIC	SOIC	TSOP1	TSOP1	TSOP1
package instruction	SOP, SOP32,.56	SOP, SOP32,.56	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.8,20
Contacts	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	150 ns	200 ns	200 ns	150 ns	500 ns
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32
JESD-609 code	e0	e0	e0	e0	e0
length	20.447 mm	20.447 mm	18.4 mm	18.4 mm	18.4 mm
memory density	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	32	32	32	32	32
word count	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	256KX8	256KX8	256KX8	256KX8	256KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	TSOP1	TSOP1	TSOP1
Encapsulate equivalent code	SOP32,.56	SOP32,.56	TSSOP32,.8,20	TSSOP32,.8,20	TSSOP32,.8,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.9972 mm	2.9972 mm	1.2 mm	1.2 mm	1.2 mm
Maximum standby current	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00002 A
Maximum slew rate	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	11.303 mm	11.303 mm	8 mm	8 mm	8 mm
Base Number Matches	1	1	1	1	1

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