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PTN2010E2701JBT

Description
Fixed Resistor, Thin Film, 0.8W, 2700ohm, 200V, 5% +/-Tol, -25,25ppm/Cel, 2110,
CategoryPassive components    The resistor   
File Size98KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

PTN2010E2701JBT Overview

Fixed Resistor, Thin Film, 0.8W, 2700ohm, 200V, 5% +/-Tol, -25,25ppm/Cel, 2110,

PTN2010E2701JBT Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid985546121
Reach Compliance Codenot_compliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL5.09
structureChip
JESD-609 codee0
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height0.609 mm
Package length5.308 mm
Package formSMT
Package width2.489 mm
method of packingTR
Rated power dissipation(P)0.8 W
resistance2700 Ω
Resistor typeFIXED RESISTOR
seriesPTN
size code2110
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Tolerance5%
Operating Voltage200 V
PTN
Vishay Thin Film
Commercial Thin Film Chip Resistors
FEATURES
Lead (Pb)-free or Sn/Pb terminations available
Moisture resistant
High purity alumina substrate
Non-standard values available
Will pass + 85 °C, 85 % relative humidity and
10 % rated power
100 % visual inspected per MIL-PRF-55342
Very low noise and voltage coefficient (< - 30 dB)
Non-inductive
Laser-trimmed tolerances to ± 0.1 %
Wraparound resistance less than 10 mΩ
Epoxy bondable termination available
Compliant to RoHS directive 2002/95/EC
Actual Size
1505
SURFACE MOUNT
CHIPS
These chip resistors are available in both “top side” and
“wraparound” termination styles in a variety of sizes. They
incorporate self passivated, enhanced Tantalum Nitride
films, to give superior performance on moisture resistance,
voltage coefficient, power handling and resistance stability.
The terminations consist of an adhesion layer, a leach
resistant nickel barrier, and solder coating. This product will
out-perform all requirements of characteristic E of
MIL-PRF-55342.
CONSTRUCTION
Passivation
Tantalum
Nitride
Resistive Film
Solder
Coating
Nickel
Barrier
High Purity
Alumina Substrate
Adhesion Layer
TYPICAL PERFORMANCE
ABS
TCR
TOL
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Material
Absolute TCR
Absolute Tolerance
Operating Temperature Range
Noise
CASE SIZE
0402
0502
0505
0603
0805
(1)
, 0705
(1)
1005
1010
1206
1505
2208
2010
2512
POWER RATING (mW)
50
100
150
150
200
250
500
400
400
750
800
1000
SPECIFICATIONS
Tantalum nitride
± 25 ppm/°C, ± 50 ppm/°C, ± 100 ppm/°C
± 1.0 %, ± 0.5 % and ± 0.1 %
- 55 °C to + 125 °C
< - 30 dB
MAX. WORKING VOLTAGE
75
75
75
75
100
100
150
200
150
150
200
200
RESISTANCE RANGE (Ω)
20 to 35K
20 to 65K
20 to 130K
10 to 80K
10 to 301K
10 to 301K
50 to 600K
10 to 1M
10 to 1M
10 to 1.75M
10 to 2M
10 to 3M
- 55 °C to + 125 °C
+ 25 °C
CONDITIONS
Note
(1)
0705 and 0805 are the same (only use 0805 when ordering)
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 60026
Revision: 02-Nov-09
For technical questions, contact:
thin-film@vishay.com
www.vishay.com
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