True BGA Socket™
Ball Grid Array Sockets
5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com
PATENTED
How It Works
Step 1
• Solder True BGA Socket™ to PCB
Step 2
• Align and place BGA device on top
of True BGA Socket mating con-
tacts. Place Chip Support Plate
over BGA device.
Step 3
• Slide Clamp over assembly. Allow
space on PCB for sliding clamp
[approximately 33% of device
package size on one side only with
new Short Slide Clamp]. Refer to
Clamp Sliding Directions for pin 1
location (see page 4).
Step 4
• Tighten Coin Screw or Finned Heat
Sink to engage compression stroke.
Guide Box
Polyimide
Wafer
Support Plate
BGA Device
Compression
Stroke (Step 4)
ADVANCED®
P.C.B.
Solder Ball
Reflowed
Heat Sink Clamp
Coin Screw
or Finned
Heat Sink
Support Plate
Not Shown
True BGA Socket™ Features
• No soldering of BGA device required.
• AIC exclusive eutectic solder ball
terminals offer superior processing.
• Uses same footprint as BGA device.
• Designed for production, develop-
ment, programming and test applica-
tions.
• Compact design maximizes PCB real
estate:
TSG = Device Pkg. Size + 0.216/(5.5mm)
TSH = Device Pkg. Size + 0.374/(9.5mm)
BGA
ADVANCED®
P.C.B.
1.27mm Pitch Terminal Options
Standard Terminals
for Test, Development and Production Applications
Terminals for LGA or
De-balled BGA Device Applications
Type -690
Surface Mount
Type -708
Thru-Hole
.183
(4.65)
Type -712
.193
(4.90)
Type -713
• Available with integral, finned heat
sink or coin screw clamp assembly.
• Currently available in 1.0 and
1.27mm pitch.
• New Short Slide Clamp reduces
required installation space on PCB.
.030 Dia.
(0.76)
.183
(4.65)
.193
(4.90)
.018 Dia.
(0.46)
.125
(3.18)
.018 Dia.
(0.46)
.125
(3.18)
.030 Dia.
(0.76)
Terminals for BGA Device Test Applications
(Consult Factory for Availability)
1.0mm Pitch Terminals
for Test, Development and Production Applications
Type -657
Type -659
Type -709
.183
(4.65)
Type -752
Surface Mount
.162
(4.11)
Type -754
Thru-Hole
.162
(4.11)
Specifications
Terminals:
Brass; Copper Alloy
(C36000)
Terminal Support:
Polyimide Film
Contacts:
Beryllium Copper (C17200)
Plating:
G – Gold over Nickel
Spring Material:
Beryllium Copper
Clamp Assembly:
Aluminum
(Heat Sink/Coin Screw, Clamp, Support Plate)
.018 Dia.
(0.46)
.183
(4.65)
.183
(4.65)
.125
(3.18)
.030 Dia.
(0.76)
.016 Dia.
(0.41)
.125
(3.18)
.024/(0.61) Dia.
.011 Dia.
(0.28)
.125
(3.18)
How To Order
Footprint Dash #
If Applicable*
True BGA Socket™
X
TS G XXXX - 690 G G XX
Clamp Options
YH - Heat Sink (3 Fins Std.)
YC - Coin Screw
Contact Plating
G - Gold
Terminal Type
See options above
Terminal Plating
G - Gold
Insulator Material:
Molded PPS (High Temp. Glass Filled
Thermoplastic), U.L. Rated 94V-O,
-60°C to 260°C (-76°F to 500°F)
Solder Ball:
Eutectic, 63Sn/37Pb,183°C (361°F)
Pitch
G = .050/(1.27mm) pitch
H = .039/(1.0mm) pitch
Number of Positions
*See BGA Footprint Booklet
or web site
Mechanical specifications for BGA device package required for quoting/ordering.
REV. 8/01
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown:
inch/(mm).
5
Pop-Top
®
BGA
Socket Adapter System
5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com
How It Works
Step 1
• Solder BGA Socket to PCB.
Step 2
• Solder BGA device to
Adapter.
Step 3
• Align and insert device/
Adapter assembly into BGA
Socket.
Step 4
• Slide Retention Clamp over
entire assembly.
BGA
Adapter
Solder
Joint
Finned
Heat Sink
(3 Fins Std.
Consult
Factory
for Options)
Socket
Solder Ball
.050
(1.27)
Pop-Top
®
System Features
• Designed for large I/O BGA devices.
• Patented limited-stroke terminal
design allows ultra low insertion and
extraction.
• AIC patented eutectic solder ball
terminals offer superior processing.
• Compact design maximizes PCB real
estate – only 0.139/(3.52mm) nomi-
nal wider than BGA device body size
on clip side.
• Uses same footprint as BGA device.
• Currently available in .050/(1.27mm)
pitch.
• Available with integral, finned heat
sink or coin screw.
• Turn Coin Screw (CS) or
Finned Heat Sink (HS) to engage Adapter into Socket and lock down
NEW Short Slide Clamp
For High Density PC Boards
(Also Standard On True BGA Socket™)
Retention Clamp Sliding
Direction For Pop-Top
®
and True BGA Socket™
• Reduces required installation
space (clearance for sliding
clamp) by 50 to 75%
ADVANCED
®
ADVANCED
®
Retention Clamp
slides to mechanical
stop on socket.
SLIDE ON
Clearance needed approx.
33% of device package size
on one side only
SLIDE OFF
Specifications
Terminals:
Brass; Copper Alloy
(C36000), ASTM-B-16
Contacts:
Beryllium Copper; Copper
Alloy (C17200), ASTM-B-194
Plating
:
G – Gold over Nickel
Body Material:
Molded PPS (High Temp. Glass Filled
Thermoplastic), U.L. Rated 94V-O,
-60°C to 260°C (-76°F to 500°F)
ADVANCED
®
Pin 1 indicator always
shown in lower left
corner on Advanced
footprint drawings.*
*Refer to BGA Footprints Booklet
or AIC Web Site for drawings
How To Order
X PTS XXXX - 636 G
Footprint Dash #
If Applicable*
Model Type
PTS
= Pop-Top
®
w/ Short Slide clamp
Number of Positions
*See BGA Footprint Booklet or web site
Solder Ball:
Eutectic, 63Sn/37Pb, 183°C (361.4°F)
G
HS
Clamp Options
HS - Heat Sink (3 Fins Std.)
CS - Coin Screw
QH - Heat Sink w/ Support Plate
QS - Coin Screw w/ Support Plate
Contact Plating
G - Gold
Terminal Plating
G - Gold
Patented Pop-Top Action
Travel
®
A
B
1.27mm Pitch Terminal Type
1. "Zero" Insertion
to point A
2. After travel & lock down with
screw or heat sink to point B
Mechanical specifications for BGA device package required for quoting/ordering.
4
REV. 8/01
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown:
inch/(mm).
NXP MCU
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