5962-3829415MXX datasheet, PDF

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5962-3829415MXX: DescriptionStandard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28; Categorystorage storage; File Size240KB，8 Pages; ManufacturerCypress Semiconductor

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5962-3829415MXX Overview

Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28

5962-3829415MXX Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	0.600 INCH, CERDIP-28
Contacts	28
Reach Compliance Code	unknow
ECCN code	3A001.A.2.C
Maximum access time	25 ns
Other features	AUTOMATIC POWER-DOWN
JESD-30 code	R-GDIP-T28
length	37.338 mm
memory density	65536 bi
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.715 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

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5962-3829415MXX Related Products

	5962-3829415MXX	5962-8969104ZX	5962-8969102ZX	5962-3829411MXX	5962-3829429MUX	5962-3829413MXX	5962-3829417MXX	5962-3829430MUX
Description	Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28	Standard SRAM, 8KX8, 20ns, CMOS, CDIP28	Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28	Standard SRAM, 8KX8, 45ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28	Standard SRAM, 8KX8, 25ns, CMOS, CQCC28, CERAMIC, QCC-28	Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28	Standard SRAM, 8KX8, 20ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28	Standard SRAM, 8KX8, 20ns, CMOS, CQCC28, CERAMIC, QCC-28
package instruction	0.600 INCH, CERDIP-28	DIP, DIP28,.3	DIP, DIP28,.3	0.600 INCH, CERDIP-28	QCCN,	0.600 INCH, CERDIP-28	0.600 INCH, CERDIP-28	QCCN,
Reach Compliance Code	unknow	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	25 ns	20 ns	25 ns	45 ns	25 ns	35 ns	20 ns	20 ns
JESD-30 code	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-CQCC-N28	R-GDIP-T28	R-GDIP-T28	R-CQCC-N28
memory density	65536 bi	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	QCCN	DIP	DIP	QCCN
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	YES	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD
Base Number Matches	1	1	1	1	1	1	1	1
Parts packaging code	DIP	-	DIP	DIP	QLCC	DIP	DIP	QLCC
Contacts	28	-	28	28	28	28	28	28
Other features	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	-	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	-
length	37.338 mm	37.0205 mm	37.0205 mm	37.338 mm	-	37.338 mm	37.338 mm	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE	3-STATE	-
Filter level	MIL-STD-883	38535Q/M;38534H;883B	38535Q/M;38534H;883B	MIL-STD-883	-	MIL-STD-883	MIL-STD-883	-
Maximum seat height	5.715 mm	5.08 mm	5.08 mm	5.715 mm	-	5.715 mm	5.715 mm	-
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	-	2.54 mm	2.54 mm	-
width	15.24 mm	7.62 mm	7.62 mm	15.24 mm	-	15.24 mm	15.24 mm	-
Maker	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	-	-

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