5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Standard & High Temperature Open Frame DIP Sockets
Features:
• Multiple finger contact on all sockets
assures maximum reliability.
• Tapered entry for ease of insertion.
• Closed bottom sleeve for 100% anti-
wicking of solder.
• To fit .100” (2.54 mm) pitch.
• Easily customized to fit your application.
• For surface mount applications use HLS
only.
Standard Sockets
LS -
Insulator Material:
Glass Filled Thermoplastic Polyester (P.B.T.)
U.L. Rated 94V-O, -60˚C to 140˚C (-76˚F to 284˚F)
How To Order
LS
Body Type
Standard Open Frame DIP
DIP Spacing
3 - .300" (7.62 mm)
4 - .400" (10.16 mm)
6 - .600" (15.24 mm)
9 - .900" (22.86 mm)
3
16
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types.
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
63% Tin, 37% Lead
Number of Pins
(8 to 64)
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
High Temperature Sockets
HLS -
Insulator Material:
High Temp. Glass Filled Thermoplastic
U.L. Rated 94V-O, -60˚C to 260˚C (-76˚F to 500˚F)
How To Order
HLS
Body Type
High Temp. Open Frame DIP
DIP Spacing
3 - .300" (7.62 mm)
4 - .400" (10.16 mm)
6 - .600" (15.24 mm)
9 - .900" (22.86 mm)
3
16
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types.
Number of Pins
(8 to 64)
Page 82
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Open Frame
Dual In-Line Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Standard & High Temperature Open Frame DIP Sockets
Terminal Information
Low Profile Solder Tail
Type -01
Low Profile Solder Tail
Type -29
Low Profile Solder Tail
Type -30
A
C
B
.165
(4.19)
.050*
(1.27)
.125
(3.18)
.020 Dia.
(.51)
.020 Dia.
(.51)
.165
(4.19)
.170
(4.32)
.020 Dia.
(.51)
.165
(4.19)
.275
(6.99)
Dimensional Information
# of
Pins
8
14
16
18
20
22
24
28
22
24
24
28
32
40
48*
64*
A
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.400
(10.16)
.400
(10.16)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.900
(22.86)
B
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.500
(12.70)
.500
(12.70)
.700
(17.78)
.700
(17.78)
.700
(17.78)
.700
(17.78)
.700
(17.78)
1.000
(25.40)
C
.400
(10.16)
.700
(17.78)
.800
(20.32)
.900
(22.86)
1.000
(25.40)
1.100
(27.94)
1.200
(30.48)
1.400
(35.56)
1.100
(27.54)
1.200
(30.48)
1.200
(30.48)
1.400
(35.56)
1.600
(40.64)
2.000
(50.80)
2.400
(60.96)
3.200
(81.28)
DIP
Low Profile Solder Tail
Type -51
Super Low Profile
Type -04
Super Low Profile
Type -38
.130
(3.30)
.110
(2.79)
.020 Dia.
(.51)
.028 Dia.
(.71)
.120
(3.05)
.110
(2.79)
.028 Dia.
(.71)
.120
(3.05)
.140
(3.56)
Ultra Low Profile
Type -49
Ultra Low Profile
Type -299
Surface Mount
Type -237
HLS Only
.095
(2.41)
.095
(2.41)
.028 Dia.
(.71)
.025 Dia.
(.64)
.083
(2.11)
.082
(2.08)
.155
(3.94)
.052 Dia.
(1.32)
Quick turn delivery available on standard terminal types.
Additional terminal types available.
See terminal section for detailed terminal information.
*Socket body thickness is .100/(2.54)
for 48 and 64 positions
Solder Preform Terminals
Available on HLS Body Type
Type -150
.072 Dia.
(1.83)
Type -151
.072 Dia.
(1.83)
.072 Dia.
(1.83)
.165
.165
(4.19)
(4.19)
Solder
Preform
.125
.125
(3.18)
(3.18)
.020 Dia.
(.51)
.130
(3.30)
Solder
Preform
.110
(2.79)
.020 Dia.
(.51)
.020 Dia.
(.51)
See page 81 for complete details.
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 83
Search by:
Keyword
Part Number
LS324-48TG
search
1. Enter any word or words that describe what your are looking for.
2. Select Search by: Keyword.
3. Click the SEARCH button.
You will be presented with a list of products that match your criteria. Click on the product name to get technical specs and access product-
specific features such as Data Sheets in PDF format, our Build-A-Part online product configurator, Related Documents and more.
For a quick product description and link to the product family page:
1. Enter an exact part number (not case sensitive, but dashes must be included in the proper place, ex. MGSB357-636GG or 1KS068-
85TG).
2. Select Search by: Part Number.
3. Click the SEARCH button.
To find a local Distributor or Representative, please click on
Global Sales Directory.
4-digit part numbers for custom products and terminal part numbers are not included in the database. Please contact
customer service
with your
name and company contact information for product information and CAD drawings for any products not listed.
For detailed product information (data sheet, etc.), click on the Product Family link and use the description below to select the product-specific
category from the next screen. To check if a CAD Drawing is available on-line, use the CAD Drawing Lookup link in the bar at the bottom of the
[b]Multi Media Card (MMC card for short),[/b]The MMCA Association established in 1998 promoted the MMC specification. MMC card is a small memory card designed for mobile phones, digital audio and vide...
This is my first time to develop a control program for a frequency converter. As a project manager, if anyone has information, solutions or programs in this area, please give me points if they can hel...
The sizeof of all types of ADI sharc DSP is 1. If the data structure is designed for communication with ARM, the sizeof structure will be different from what the other party receives....
In the program, the semTake(sem,WAIT_FOREVER) function is generally used to implement semaphore waiting. What I want to ask is: in addition to the semGive function releasing the semaphore, what other ...
In the early 1990s, portable phones were all the rage. With the rapid development of electronic technology, today's mobile phones can not only send emails and text messages, but also take photos, ch...[Details]
In some applications, such as data loggers, it is desirable to have multiplexed analog outputs. When only a single output is active at a time, a voltage-output DAC">digital-to-analog converter (DAC) a...[Details]
Introduction
The market for wireless telemetry products is developing rapidly. Recently, the industry has also set off a revolution in wireless applications. Wireless telemetry technol...[Details]
Basic principles of simulation
Simulation is a technology used in the field of embedded system development. It can bring system developers the controllability and visibility needed to integra...[Details]
Third generation (3G) mobile phones offer a variety of features with more functionality. As consumers enjoy the latest and better features of these communication devices, they continue to demand lo...[Details]
Today's mobile phone production testing faces an increasingly complex environment, with challenges of multiple frequency bands and multiple standards, pressure on production test speed, and pressur...[Details]
Lithium-ion batteries have a high energy-to-weight and energy-to-volume ratio, no memory effect, can be recharged many times, have a long service life, and are becoming increasingly cheaper. A good...[Details]
introduction
The most common flight state of a fixed-wing aircraft is horizontal flight. If it is allowed to fly at a large angle, the action cannot be maintained all the time. If it is al...[Details]
Overview
In recent years, the vigorous development of integrated circuits has created a huge space for the research and application of digital circuits. FPGA has low power consumption, high re...[Details]
Introduction
The MAX2116 P1db data is measured at specific combinations of RF and baseband gain over the adjustable range of these two gains. These data can be used to select gain control se...[Details]
Power Integrations (PI) has introduced three charger/adapter reference designs using its new LinkSwitch-II series of AC-DC switching power conversion ICs. The new LinkSwitch-II devices use high-pre...[Details]
Abstract:
An amplifier solution for ceramic speaker systems is presented.
Keywords:
audio; ceramic speaker; amplifier; Class G
Today's portable devices require smaller, thinne...[Details]
1 Introduction to suction laminating machine
Suction laminating machine is a kind of woodworking machinery, which can realize the laminating function of wood boards and other materials. It i...[Details]
Abstract:
Aiming at the performance requirements of the control system for micro-sized walking robots, a control system that can be used for multi-joint driving of walking robots is introduce...[Details]
In the process of RF transceiver application, adjusting the processing gain (PG) of the direct sequence spread spectrum communication system (DSSS) can obtain excellent anti-noise performance, whic...[Details]
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
