The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
0.2 mm Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors
FH43B Series
Space saving
2.
7
17.
7
8m
m
(81
pos
.
sho
wn)
0.9
Can be mounted over conductive traces.
■Features
1. Low-profile, small PCB mounting area
Board footprint: Reduced approximately 45%
Weight: Reduced approximately 55%
(As compared with Hirose Electric's FH26 Series connectors
51 positions)
No exposed contacts on the
bottom of the connector
2. Easy solderability on the PC board
The soldering leads are on 0.4 mm pitch, exiting on front and
back of the connector.
Simple FPC insertion
actuator
3. Conducive traces on the PCB can run under
the connector
No exposed contacts on the bottom of the connector.
4. Easy FPC insertion and reliable electrical connection
Proven Flip Lock actuator allows easy insertion of FPC and
provides a tactile sensation when fully closed, confirming
complete electrical and mechanical connection.
FPC
5. Easy FPC/FFC insertion
FPC/FFC is self-guided in the connector assuring correct and
reliable electrical and mechanical connection.
Lock
6. Accepts standard FPC thickness
0.2mm thick standard Flexible Printed Circuit (FPC) can be
used. This is the only ultra-low profile ZIF connector using
standard FPC.
7. Board placement with automatic equipment
Flat upper surface and tape and reel packaging facilitate
vacuum pick-up and placement. Standard reel packaging
contains 5000 connectors.
Temporary hold of FPC
2010.9
1
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
FH43B Series●0.2 mm Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors
■Specifications
Current rating
Ratings
Voltage rating
30 Vrms AC
0.2 A
Operating
temperature range
Operating
humidity range
-55 to +85°C (Note 1)
Relative humidity 90% max.
(No condensation)
Storage
temperature range
Storage
humidity range
-10 to +50°C (Note 2)
Relative humidity 90%
max. (No condensation)
Recommended FPC Thickness
Item
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
4. Durability
50 Mø min.
Specification
0.2 ± 0.02 mm, Gold plated contact pads
Conditions
100 V DC
90 Vrms AC / one minute
1 mA, AC max (AC: 1kHz)
10 cycles
Frequency: 10 to 55 Hz, single amplitude of 0.75mm,
10 cycles in each of the 3 axis
Acceleration of 981m/s , 6 ms duration, sine halfwave,
3 cycles in each of the 3 axis
2
No flashover or insulation breakdown
100 mø max.
* Including FPC conductor resistance
Contact resistance: 100 mø max.
No damage, cracks, or parts dislocation
5. Vibration
No electrical discontinuity of 1μs or longer
Contact resistance: 100 m
ø
max.
No damage, cracks, or parts dislocation
No electrical discontinuity of 1μs or longer
Contact resistance: 100 mø max.
No damage, cracks, or parts dislocation
Contact resistance: 100 mø max.
Insulation resistance: 50 Mø min.
No damage, cracks, or parts dislocation
Contact resistance: 100 mø max.
Insulation resistance: 50 Mø min.
No damage, cracks, or parts dislocation
No deformation of components affecting performance
6. Shock
7. Humidity
(Steady state)
96 hours at 40°C and humidity of 90 to 95%
Temperature : -55°C
→
+15°C to +35°C
→
+85°C→ +15°C to +35°C
Time: 30
→
2 to 3
→
30
→
2 to 3 minutes
5 cycles
Reflow: At the recommended temperature profile
Manual soldering: 350°C ±10°C for 5 seconds
8. Temperature cycle
9. Resistance to
soldering heat
Note 1. Includes temperature rise caused by current flow.
Note 2. The term "storage" refers to products stored for a long period prior to mounting and use.
The operating temperature and humidity range covers the non-conducting condition of installed connectors in storage, shipment or
during transportation after board mounting.
Note 3. Information contained in this catalog represents general requirements for this Series.
Contact us for the drawings and specifications for a specific part number shown.
■Materials
Part
Insulator
Contacts
Metalfittings
Material
LCP
PA
Phosphor bronze
Finish
Color:Beige
Color:Black
Gold plated
Pure tin reflow plated
Remarks
UL94V-0
---------
---------
■Ordering
information
FH 43B − 51S − 0.2 SHW (10)
1
2
3
4
5
6
1
Series name : FH
2
Series No.: 43B
3
Number of positions : 21to81
4
Contact pitch : 0.2mm
5
Termination type :
SHW…SMT horizontal staggered row mount type
6
Plating specifications
(10)…Gold plating with nickel barrier
2
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
FH43B Series●0.2 mm Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors
■Connector
Dimensions
A
0.2
0.4
B
(00.08)
A * *
Number of contacts
0.4
C
(00.08)
(0.95)
(2.85)
R
(0.12)
D
E
(0.45)
(2.5)
R
(12
5°)
(1.75)
0.47
0.4
1
(0.53)
(1.2)
(1.6)
2.17
1
0.1
0.1
Note 1
2.
3.
4.
The coplanarity of each terminal lead within specified dimension is 0.1 mm Max.
Packaged on tape and reel only. Check packaging specification.
Slight variations in color of the plastic compounds do not affect form, fit or function of the connector.
After reflow, the terminal plating may change color, however this does not represent a quality issue.
Unit : mm
Part Number
FH43B-21S-0.2SHW(10)
FH43B-25S-0.2SHW(10)
FH43B-31S-0.2SHW(10)
FH43B-35S-0.2SHW(10)
FH43B-41S-0.2SHW(10)
FH43B-45S-0.2SHW(10)
FH43B-51S-0.2SHW(10)
FH43B-61S-0.2SHW(10)
FH43B-71S-0.2SHW(10)
FH43B-81S-0.2SHW(10)
CL No.
-----
-----
-----
0580-2803-5-10
-----
-----
0580-2806-3-10
0580-2805-0-10
0580-2807-6-10
---
--
Number of contacts
21
25
31
35
41
45
51
61
71
81
0.9
0.3
0.2
A
5.8
6.6
7.8
8.6
9.8
10.6
11.8
13.8
15.8
17.8
B
3.6
4.4
5.6
6.4
7.6
8.4
9.6
11.6
13.6
15.6
C
4
4.8
6
6.8
8
8.8
10
12
14
16
D
4.53
5.33
6.53
7.33
8.53
9.33
10.53
12.53
14.53
16.53
E
5.29
6.09
7.29
8.09
9.29
10.09
11.29
13.29
15.29
17.29
Note1. Tape and reel packaging (5,000 pieces/reel).
Order by number of reels.
3
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
FH43B Series●0.2 mm Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors
■Recommended
PCB mounting pattern and metal mask dimensions
0.65±0.03
(0.55±0.03:Metal Mask)
Recommended meal mask thickness : t=0.1
(0.2)
B
×(n-1)/2
0.04
S
0.04
0.4
(0.58±0.03:Metal Mask)
S
0.2±0.02
(0.18±0.01:Metal Mask)
0.02±0.05
3.17±0.05
1.7±0.05
0.2
0.82±0.03
(0.68±0.03:Metal Mask)
0.2±0.02
(0.18±0.01:Metal Mask)
S
×(n+1)/2
0.04
C
S
0.4
(0.3±0.03:Metal Mask)
0.4±0.05
0.485±0.05
■Recommended
FPC Dimensions
0.25±0.05
A±0.1
(F)
G±0.05
C±0.02
0.2
+0.03
− 0.02
0.25±0.05
0.05±0.15
0.74±0.1(Even pattern)
0.75±0.1(Odd pattern)
0.84±0.1(Even pattern)
0.85±0.1(Odd pattern)
1.45±0.1
M
AX
0.4±0.02
0.2±0.02
R0
.2
0.8±0.05
M
1.6±0.05
1.1±0.05
0.2±0.02
1.8MIN
0.055±0.02
(0.13:Odd pattern)
(0.1:Even pattern)
0.2
+0.03
− 0.02
0.67±0.05(Mating area)
B±0.02
H±0.05(Mating area)
0.67±0.05(Mating area)
■Recommended
FPC construction
Part Number
FH43B-21S-0.2SHW(10)
FH43B-25S-0.2SHW(10)
FH43B-31S-0.2SHW(10)
FH43B-35S-0.2SHW(10)
FH43B-41S-0.2SHW(10)
FH43B-45S-0.2SHW(10)
FH43B-51S-0.2SHW(10)
FH43B-61S-0.2SHW(10)
FH43B-71S-0.2SHW(10)
FH43B-81S-0.2SHW(10)
1MIN
2
0.1
0.
.2±
X R
R0
MA
(2.8:Stiffeuer)
AX
R0
.2
R0
.2±
0.1
Unit : mm
CL No.
-----
-
----
-
----
0580-2803-5-10
-
----
-
----
0580-2806-3-10
0580-2805-0-10
0580-2807-6-10
-----
Number of contacts
21
25
31
35
41
45
51
61
71
81
B
3.6
4.4
5.6
6.4
7.6
8.4
9.6
11.6
13.6
15.6
C
4
4.8
6
6.8
8
8.8
10
12
14
16
F
5.3
6.1
7.3
8.1
9.3
10.1
11.3
13.3
15.3
17.3
G
4.5
5.3
6.5
7.3
8.5
9.3
10.5
12.5
14.5
16.5
H
4.94
5.74
6.94
7.74
8.94
9.74
10.94
12.94
14.94
16.94
4
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
FH43B Series●0.2 mm Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors
■FHB
Series FPC
1. Using Single-sided FPC
Material Name
Covering film layer
Cover adhesive
Surface treatment
Copper foil
Base adhesive
Base film
Reinforcement material adhesive
Stiffener
0.2μm thick gold plated over
1 to 6μm nickel underplating
Cu 1/3oz
Thermosetting adhesive
Polyimide 1/2mil thick
Thermosetting adhesive
Polyimide 5 mil thick
Total
Material
Polyimide 1 mil thick.
Material
Thickness (μm)
(25)
(25)
4
12
10
15
30
125
194
2. Using Double-sided FPC
Material Name
Covering film layer
Cover adhesive
Surface treatment
Through-hole copper
Copper foil
Base adhesive
Base film
Base adhesive
Copper foil
Cover adhesive
Covering film layer
Reinforcement material adhesive
Stiffener
Material
Polyimide 1 mil thick.
Material
Thickness (μm)
(25)
(25)
0.2μm thick gold plated over
1 to 6μm nickel underplating
Cu
Cu 1/3oz
Thermosetting adhesive
Polyimide 1/2mil thick
Thermosetting adhesive
Cu 1/3oz
Thermosetting adhesive
Polyimide 1/2 mil thick
Thermosetting adhesive
Polyimide 4 mil thick
Total
4
12
12
—
13
—
(12)
25
13
25
100
204
* To prevent release of the FPC due to its bending, use of the double sided FPC with copper foil on the back side is NOT RECOMMENDED.
3. Precautions
1. This specification is a recommendation for the construction of the FH43B Series FPC and FFC (t=0.2 ±0.02).
2. For details about the construction, please contact the FPC/FFC manufacturers.
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