Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, METAL SEALED, CERAMIC, DFP-20
| Parameter Name | Attribute value |
| package instruction | DFP, |
| Reach Compliance Code | unknow |
| Other features | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY |
| series | HC/UH |
| JESD-30 code | R-CDFP-F20 |
| Logic integrated circuit type | BUS DRIVER |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| propagation delay (tpd) | 26 ns |
| Certification status | Not Qualified |
| Maximum seat height | 2.92 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| total dose | 100k Rad(Si) V |
| width | 6.92 mm |
| Base Number Matches | 1 |
| 5962R9579301VXX | 5962R9579301VRC | 5962R9579301VXC | 5962R9579301VRX | HCS374DMSH | HCS374KMSH | |
|---|---|---|---|---|---|---|
| Description | Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, METAL SEALED, CERAMIC, DFP-20 | Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, METAL SEALED, CERAMIC, DIP-20 | Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, METAL SEALED, CERAMIC, DFP-20 | Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, METAL SEALED, CERAMIC, DIP-20 | Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, METAL SEALED, CERAMIC, DIP-20 | Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, METAL SEALED, CERAMIC, DFP-20 |
| package instruction | DFP, | DIP, | DFP, | DIP, | DIP, DIP20,.3 | DFP, FL20,.3 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown |
| Other features | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY |
| series | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 code | R-CDFP-F20 | R-CDIP-T20 | R-CDFP-F20 | R-CDIP-T20 | R-CDIP-T20 | R-CDFP-F20 |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| Number of digits | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP | DIP | DFP | DIP | DIP | DFP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | FLATPACK | IN-LINE | IN-LINE | FLATPACK |
| propagation delay (tpd) | 26 ns | 26 ns | 26 ns | 26 ns | 33 ns | 33 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.92 mm | 5.08 mm | 2.92 mm | 5.08 mm | 5.08 mm | 2.92 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| total dose | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 1M Rad(Si) V | 1M Rad(Si) V |
| width | 6.92 mm | 7.62 mm | 6.92 mm | 7.62 mm | 7.62 mm | 6.92 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
| JESD-609 code | - | e4 | e4 | - | e0 | e0 |
| Load capacitance (CL) | - | 50 pF | 50 pF | - | 50 pF | 50 pF |
| Terminal surface | - | GOLD | GOLD | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |