500 G’s 1ms, Halfsine, 3 shocks per direction, per MIL-STD 202G, Method 213B Test Condition D.
Sinusoidal Vibration
0.06” D.A. or 10G’s Peak, 10 to 500 Hz, per MIL-STD-202G, Method 204D, Test Condition A.
Random Vibration
5.35 G’s rms. 20 to 2000 Hz per MIL-STD-202G, Method 214,Test Condition 1A, 15 minutes each axis.
Moisture
10 cycles, 95% RH, Per MIL-STD-202G, Method 112.
Marking Permanency
Per MIL-STD-202G, Method 215J.
Solder Process Recommendations:
RoHS compliant, lead free. See solder profile on page 3.
In-line reflow:
Refer to recommended reflow pre-heat and reflow temperatures on page 6. Package material
consist of Ryton R-4 high temperature cover with FR4 substrate. Component solder is Pb free
high temperature eutectic alloy with a melting point of 221°C.|
In-line oven profile:
We recommend using KIC profiler or similar device placing one of the thermocouples on the
device to insure that the internal package temperature does not exceed 221°C.
Removal of device:
If for any reason the device needs to be removed from the board, use a temperature controlled
repair station with profile monitoring capabilities. Following a monitored profile will insure the
device is properly pre-heated prior to relow. Refer to IPC 610E for inspection guidelines.
Recommended Cleaning Process:
(If required)
Device is non-hermetic, water resistance with four weep holes, one in each corner to allow
moisture to be removed during the drying cycle. We recommend in-line warm water wash
with air knife and drying capabilities. If cleaner does not have drying capability, then use hot air
circulated oven. Boards should be placed in the oven vertically for good water runoff
Device must be dried properly prior to use!
Note: If saponifier is used make sure the device is rinsed properly to insure all residues are removed. PH of saponifier should not exceed 10.
Drying Temperature:
Between 85 to 100°C.
Drying Time:
Time will vary depending on the board size.
Caution: Do not submerge the device!
Notes:
1. Initial calibration @ 25°C.
2. Frequency stability vs. change in temperature. [±(Fmax - Fmin)/(2*Fo)].
3. After 30 days of operation.
4. Peak to peak frequency stability vs. change in temperature, frequency stability vs. change in voltage, frequency stability vs. change in load and aging
over a 24 hour period.
5. 0.16 seconds < Observed time < 64 seconds at a constant temperature with 1 hour warm-up.
6. Inclusive of calibration @ 25°C, frequency vs. change in temperature, change in supply voltage (±5%), load change (±10%), shock and vibration and
20 years aging
7. Attention: To achieve optimal frequency stability, and in some cases to meet the specification stated on this data sheet, it is required that the circuit
connected to this OCXO output must have the equivalent input capacitance that is specified by the nominal load capacitance. Deviations from the
nominal load capacitance will have a graduated effect on the stability of approximately 20 ppb per pF load difference.
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