1KIS133-33MG datasheet, PDF - EEWORLD Datasheet

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1KIS133-33MG: DescriptionIC Socket, PGA133, 133 Contact(s),; CategoryThe connector socket; File Size175KB，2 Pages; ManufacturerAdvanced Interconnections Corp.; Environmental Compliance

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1KIS133-33MG Overview

IC Socket, PGA133, 133 Contact(s),

1KIS133-33MG Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Reach Compliance Code	compli
ECCN code	EAR99
Contact to complete cooperation	GOLD OVER NICKEL
Contact completed and terminated	Matte Tin (Sn) - with Nickel (Ni) barrie
Contact material	BERYLLIUM COPPER
Device slot type	IC SOCKET
Type of equipment used	PGA133
Shell material	POLYAMIDE
JESD-609 code	e3
Number of contacts	133
Base Number Matches	1

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Low Insertion Force

Peel-A-Way

PGA Sockets

5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

Peel-A-Way

Low Insertion Force PGA Sockets

Polyimide Film

.005

(.13)

Features:

• Disposable carriers peel away after

soldering.

• Peel-A-Way

tabs and full grid wafer

supplied on all Peel-A-Way

PGA sockets.

• Maximum air flow under PGA for greater

cooling.

• Better flux rinse and cleaning.

• Allows inspection of solder joints on both

sides of PCB.

• Lowest profile with use of type -210

terminal.

• Peel-A-Way

disposable socket terminal

carrier available in any configuration shown

or custom designed to meet your

specifications.

Footprint Dash #

If Applicable*

How To Order

068

-85

Contact Plating

G - Gold

T - Tin-Lead

Terminal Plating

G - Gold

T - Tin-Lead

Terminal Type

See next page

for terminal types

Body Type

KS - 2.5 oz.(70.85 g) avg. insertion force

KIS - 1 oz.(28.34 g) avg. insertion force

Number of Pins

004 to 484

*See pages 37 - 64

for PGA footprints

Polyimide Film

Terminals and Contacts:

Terminal: Brass - Copper Alloy (C36000)

ASTM-B-16

Contact: Beryllium Copper (C17200)

ASTM-B-194

Peel away

after soldering

to PCB.

PCB

Solder fillets visible both sides

for inspection and cleaning.

Solder Preform:

63% Tin, 37% Lead

How To Use:

1. Place socket in PCB.

2. Send PCB and socket through soldering operation.

3. Peel away polyimide film carrier.

Plating:

Terminal: Gold over Nickel or

Tin-Lead over Nickel

Contact: Gold over Nickel or

Tin-Lead over Nickel

Gold per MIL-G-45204

Tin-Lead per MIL-P-81728

Nickel per QQ-N-290

Sealant Options

RTV

Seal

Body Material:

KS/KIS -

Polyimide Film

-269˚C to 400˚C (-452˚F to 752˚F)

RTV Sealed

To order: Add RTV to end of part #

Note: RTV not available with HCS or HCIS Insulators

Peel-A-Way

covered by patent rights issued and/or pending.

Tape Sealed

To order: Add 3M to end of part #

inch/(mm)

Products shown covered by patents issued and/or pending. Specifications subject to change without notice.

Page 34

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