DS26C32AMW datasheet, PDF - EEWORLD Datasheet

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DS26C32AMW: DescriptionIC,LINE RECEIVER,QUAD,CMOS,DIFFERENTIAL,FP,16PIN,CERAMIC; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size211KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DS26C32AMW Overview

IC,LINE RECEIVER,QUAD,CMOS,DIFFERENTIAL,FP,16PIN,CERAMIC

DS26C32AMW Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DFP, FL16,.3
Reach Compliance Code	unknow
JESD-30 code	R-XDFP-F16
JESD-609 code	e0
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Maximum output low current	0.006 A
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL16,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Certification status	Not Qualified
Maximum receive delay	35 ns
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

DS26C32AMW Related Products

	DS26C32AMW	DS26C32CJ/A+	DS26C32CM/A+	DS26C32CN	DS26C32CJ	DS26C32CM	DS26C32CN/A+
Description	IC,LINE RECEIVER,QUAD,CMOS,DIFFERENTIAL,FP,16PIN,CERAMIC	IC,LINE RECEIVER,QUAD,CMOS,DIFFERENTIAL,DIP,16PIN,CERAMIC	IC,LINE RECEIVER,QUAD,CMOS,DIFFERENTIAL,SOP,16PIN,PLASTIC	LINE RECEIVER, PDIP16, DIP-16	LINE RECEIVER, CDIP16, DIP-16	LINE RECEIVER, PDSO16	IC,LINE RECEIVER,QUAD,CMOS,DIFFERENTIAL,DIP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DFP, FL16,.3	DIP, DIP16,.3	SOP, SOP16,.25	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.25	DIP, DIP16,.3
Reach Compliance Code	unknow	unknow	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDFP-F16	R-XDIP-T16	R-PDSO-G16	R-PDIP-T16	R-GDIP-T16	R-PDSO-G16	R-PDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Number of terminals	16	16	16	16	16	16	16
Maximum operating temperature	125 °C	85 °C	85 °C	70 °C	70 °C	70 °C	85 °C
Minimum operating temperature	-55 °C	-40 °C	-40 °C	-	-	-	-40 °C
Maximum output low current	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DFP	DIP	SOP	DIP	DIP	SOP	DIP
Encapsulate equivalent code	FL16,.3	DIP16,.3	SOP16,.25	DIP16,.3	DIP16,.3	SOP16,.25	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	-

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