• Distributes one clock input to one bank of five and one bank of
four outputs
• Separate output enable for each output bank
• Output Skew < 250ps
• Low jitter <200 ps cycle-to-cycle
• IDT2309A-1 for Standard Drive
• IDT2309A-1H for High Drive
• No external RC network required
• Operates at 3.3V V
DD
• Available in SOIC and TSSOP packages
The IDT2309A is a high-speed phase-lock loop (PLL) clock buffer,
designed to address high-speed clock distribution applications. The zero
delay is achieved by aligning the phase between the incoming clock and
the output clock, operable within the range of 10 to 133MHz.
The IDT2309A is a 16-pin version of the IDT2305A. The IDT2309A
accepts one reference input, and drives two banks of four low skew clocks.
The -1H version of this device operates up to 133MHz frequency and has
higher drive than the -1 device. All parts have on-chip PLLs which lock
to an input clock on the REF pin. The PLL feedback is on-chip and is
obtained from the CLKOUT pad. In the absence of an input clock, the
IDT2309A enters power down. In this mode, the device will draw less than
12µA for Commercial Temperature range and less than 25µA for Industrial
temperature range, and the outputs are tri-stated.
The IDT2309A is characterized for both Industrial and Commercial
operation.
FUNCTIONAL BLOCK DIAGRAM
16
CLKOUT
1
REF
PLL
2
CLKA1
3
CLKA2
14
CLKA3
15
CLKA4
S2
S1
8
9
Control
Logic
6
CLKB1
7
CLKB2
10
CLKB3
11
CLKB4
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
c
2004 Integrated Device Technology, Inc.
JULY 2004
DSC - 6588/5
IDT2309A
3.3V ZERO DELAY CLOCK BUFFER
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
PIN CONFIGURATION
REF
CLKA1
CLKA2
V
DD
GND
CLKB1
CLKB2
S2
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
SOIC/ TSSOP
TOP VIEW
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
Rating
Supply Voltage Range
Input Voltage Range (REF)
Input Voltage Range
(except REF)
I
IK
(V
I
< 0)
I
O
(V
O
= 0 to V
DD
)
V
DD
or GND
T
A
= 55°C
(in still air)
(3)
T
STG
Operating
Temperature
Operating
Temperature
Storage Temperature Range
Commercial Temperature
Range
Industrial Temperature
Range
-40 to +85
°C
–65 to +150
0 to +70
°C
°C
Input Clamp Current
Continuous Output Current
Continuous Current
Maximum Power Dissipation
Max.
–0.5 to +4.6
–0.5 to +5.5
–0.5 to
V
DD
+0.5
–50
±50
±100
0.7
mA
mA
mA
W
Unit
V
V
V
CLKOUT
CLKA4
CLKA3
V
DD
GND
CLKB4
CLKB3
S1
V
DD
V
I (2)
V
I
APPLICATIONS:
•
•
•
•
•
SDRAM
Telecom
Datacom
PC Motherboards/Workstations
Critical Path Delay Designs
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. The input and output negative-voltage ratings may be exceeded if the input and output
clamp-current ratings are observed.
3. The maximum package power dissipation is calculated using a junction temperature
of 150°C and a board trace length of 750 mils.
PIN DESCRIPTION
Pin Name
REF
(1)
CLKA1
(2)
CLKA2
V
DD
GND
CLKB1
(2)
CLKB2
(2)
S2
(3)
S1
(3)
CLKB3
(2)
CLKB4
(2)
(2)
Pin Number
1
2
3
4, 13
5, 12
6
7
8
9
10
11
14
15
16
Type
IN
Out
Out
PWR
GND
Out
Out
IN
IN
Out
Out
Out
Out
Out
Functional Description
Input reference clock, 5 Volt tolerant input
Output clock for bank A
Output clock for bank A
3.3V Supply
Ground
Output clock for bank B
Output clock for bank B
Select input Bit 2
Select input Bit 1
Output clock for bank B
Output clock for bank B
Output clock for bank A
Output clock for bank A
Output clock, internal feedback on this pin
CLKA3
(2)
CLKA4
(2)
CLKOUT
(2)
NOTES:
1. Weak pull down.
2. Weak pull down on all outputs.
3. Weak pull ups on these inputs.
2
IDT2309A
3.3V ZERO DELAY CLOCK BUFFER
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
FUNCTION TABLE
(1)
S2
L
L
H
H
S1
L
H
L
H
CLKA
Tri-State
Driven
Driven
Driven
CLKB
Tri-State
Tri-State
Driven
Driven
CLKOUT
(2)
Driven
Driven
Driven
Driven
Output Source
PLL
PLL
REF
PLL
PLL Shut Down
N
N
Y
N
NOTES:
1. H = HIGH Voltage Level.
L = LOW Voltage Level
2. This output is driven and has an internal feedback for the PLL. The load on this ouput can be adjusted to change the skew between the REF and the output.
DC ELECTRICAL CHARACTERISTICS - COMMERCIAL
Symbol
V
IL
V
IH
I
IL
I
IH
V
OL
V
OH
I
DD_PD
I
DD
Parameter
Input LOW Voltage Level
Input HIGH Voltage Level
Input LOW Current
Input HIGH Current
Output LOW Voltage
Output HIGH Voltage
Power Down Current
Supply Current
V
IN
= 0V
V
IN
= V
DD
Standard Drive
High Drive
Standard Drive
High Drive
REF = 0MHz (S2 = S1 = H)
Unloaded Outputs at 66.66MHz, SEL inputs at V
DD
or GND
I
OL
= 8mA
I
OL
= 12mA (-1H)
I
OH
= -8mA
I
OH
= -12mA (-1H)
—
—
12
32
µA
mA
2.4
—
V
Conditions
Min.
—
2
—
—
—
Max.
0.8
—
50
100
0.4
Unit
V
V
µA
µA
V
OPERATING CONDITIONS - COMMERCIAL
Symbol
V
DD
T
A
C
L
C
IN
Supply Voltage
Operating Temperature (Ambient Temperature)
Load Capacitance < 100MHz
Load Capacitance 100MHz - 133MHz
Input Capacitance
Parameter
Min.
3
0
—
—
—
Max.
3.6
70
30
10
7
pF
Unit
V
°
C
pF
SWITCHING CHARACTERISTICS (2309A-1) - COMMERCIAL
(1,2)
Symbol
t
1
Output Frequency
Duty Cycle = t
2
÷
t
1
t
3
t
4
t
5
t
6A
t
6B
t
7
t
J
t
LOCK
Rise Time
Fall Time
Output to Output Skew
Delay, REF Rising Edge to CLKOUT Rising Edge
(2)
Delay, REF Rising Edge to CLKOUT Rising Edge
(2)
Device-to-Device Skew
Cycle-to-Cycle Jitter
PLL Lock Time
Parameter
10pF Load
30pF Load
Measured at 1.4V, F
OUT
= 66.66MHz
Measured between 0.8V and 2V
Measured between 0.8V and 2V
All outputs equally loaded
Measured at V
DD
/2
Measured at V
DD
/2 in PLL bypass mode (IDT2309A only)
Measured at V
DD
/2 on the CLKOUT pins of devices
Measured at 66.66MHz, loaded outputs
Stable power supply, valid clock presented on REF pin
Conditions
Min.
10
10
40
—
—
—
—
1
—
—
—
Typ.
—
—
50
—
—
—
0
5
0
—
—
Max.
133
100
60
2.5
2.5
250
±350
8.7
700
200
1
%
ns
ns
ps
ps
ns
ps
ps
ms
Unit
MHz
NOTES:
1. REF Input has a threshold voltage of V
DD
/2.
2. All parameters specified with loaded outputs.
3
IDT2309A
3.3V ZERO DELAY CLOCK BUFFER
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
SWITCHING CHARACTERISTICS (2309A-1H) - COMMERCIAL
(1,2)
Symbol
t
1
Output Frequency
Duty Cycle = t
2
÷
t
1
Duty Cycle = t
2
÷
t
1
t
3
t
4
t
5
t
6A
t
6B
t
7
t
8
t
J
t
LOCK
Rise Time
Fall Time
Output to Output Skew
Delay, REF Rising Edge to CLKOUT Rising Edge
Delay, REF Rising Edge to CLKOUT Rising Edge
Device-to-Device Skew
Output Slew Rate
Cycle-to-Cycle Jitter
PLL Lock Time
Parameter
10pF Load
30pF Load
Measured at 1.4V, F
OUT
= 66.66MHz
Measured at 1.4V, F
OUT
<50MHz
Measured between 0.8V and 2V
Measured between 0.8V and 2V
All outputs equally loaded
Measured at V
DD
/2
Measured at V
DD
/2 in PLL bypass mode (IDT2309A only)
Measured at V
DD
/2 on the CLKOUT pins of devices
Measured between 0.8V and 2V using Test Circuit 2
Measured at 66.66MHz, loaded outputs
Stable power supply, valid clock presented on REF pin
Conditions
Min.
10
10
40
45
—
—
—
—
1
—
1
—
—
Typ.
—
—
50
50
—
—
—
0
5
0
—
—
—
Max.
133
100
60
55
1.5
1.5
250
±350
8.7
700
—
200
1
Unit
MHz
%
%
ns
ns
ps
ps
ns
ps
V/ns
ps
ms
NOTES:
1. REF Input has a threshold voltage of V
DD
/2.
2. All parameters specified with loaded outputs.
DC ELECTRICAL CHARACTERISTICS - INDUSTRIAL
Symbol
V
IL
V
IH
I
IL
I
IH
V
OL
V
OH
I
DD_PD
I
DD
Parameter
Input LOW Voltage Level
Input HIGH Voltage Level
Input LOW Current
Input HIGH Current
Output LOW Voltage
Output HIGH Voltage
Power Down Current
Supply Current
V
IN
= 0V
V
IN
= V
DD
Standard Drive
High Drive
Standard Drive
High Drive
REF = 0MHz (S2 = S1 = H)
Unloaded Outputs at 66.66MHz, SEL inputs at V
DD
or GND
I
OL
= 8mA
I
OL
= 12mA (-1H)
I
OH
= -8mA
I
OH
= -12mA (-1H)
—
—
25
35
µA
mA
2.4
—
V
Conditions
Min.
—
2
—
—
—
Max.
0.8
—
50
100
0.4
Unit
V
V
µA
µA
V
OPERATING CONDITIONS - INDUSTRIAL
Symbol
V
DD
T
A
C
L
C
IN
Supply Voltage
Operating Temperature (Ambient Temperature)
Load Capacitance < 100MHz
Load Capacitance 100MHz - 133MHz
Input Capacitance
Parameter
Min.
3
-40
—
—
—
Max.
3.6
+85
30
10
7
pF
Unit
V
°
C
pF
4
IDT2309A
3.3V ZERO DELAY CLOCK BUFFER
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
SWITCHING CHARACTERISTICS (2309A-1) - INDUSTRIAL
(1,2)
Symbol
t
1
Output Frequency
Duty Cycle = t
2
÷
t
1
t
3
t
4
t
5
t
6A
t
6B
t
7
t
J
t
LOCK
Rise Time
Fall Time
Output to Output Skew
Delay, REF Rising Edge to CLKOUT Rising Edge
Delay, REF Rising Edge to CLKOUT Rising Edge
Device-to-Device Skew
Cycle-to-Cycle Jitter
PLL Lock Time
Parameter
10pF Load
30pF Load
Measured at 1.4V, F
OUT
= 66.66MHz
Measured between 0.8V and 2V
Measured between 0.8V and 2V
All outputs equally loaded
Measured at V
DD
/2
Measured at V
DD
/2 in PLL bypass mode (IDT2309A only)
Measured at V
DD
/2 on the CLKOUT pins of devices
Measured at 66.66MHz, loaded outputs
Stable power supply, valid clock presented on REF pin
Conditions
Min.
10
10
40
—
—
—
—
1
—
—
—
Typ.
—
—
50
—
—
—
0
5
0
—
—
Max.
133
100
60
2.5
2.5
250
±350
8.7
700
200
1
%
ns
ns
ps
ps
ns
ps
ps
ms
Unit
MHz
NOTES:
1. REF Input has a threshold voltage of V
DD
/2.
2. All parameters specified with loaded outputs.
SWITCHING CHARACTERISTICS (2309A-1H) - INDUSTRIAL
(1,2)
Symbol
t
1
Output Frequency
Duty Cycle = t
2
÷
t
1
Duty Cycle = t
2
÷
t
1
t
3
t
4
t
5
t
6A
t
6B
t
7
t
8
t
J
t
LOCK
Rise Time
Fall Time
Output to Output Skew
Delay, REF Rising Edge to CLKOUT Rising Edge
Delay, REF Rising Edge to CLKOUT Rising Edge
Device-to-Device Skew
Output Slew Rate
Cycle-to-Cycle Jitter
PLL Lock Time
Parameter
10pF Load
30pF Load
Measured at 1.4V, F
OUT
= 66.66MHz
Measured at 1.4V, F
OUT
<50MHz
Measured between 0.8V and 2V
Measured between 0.8V and 2V
All outputs equally loaded
Measured at V
DD
/2
Measured at V
DD
/2 in PLL bypass mode (IDT2309A only)
Measured at V
DD
/2 on the CLKOUT pins of devices
Measured between 0.8V and 2V using Test Circuit 2
Measured at 66.66MHz, loaded outputs
Stable power supply, valid clock presented on REF pin
I just got the MSP430FR5969 LaunchPad today and found the color pages inside. Following the above method, I implemented the unboxing test procedure. The following are the experimental steps and experi...
Hello everyone: When I was performing image acquisition, I found that after using I2C to switch channels, the image would appear to be off-screen (that is, the image would move up or down). Has anyone...
[b][font=黑体][size=22.0pt]Using[/size][/font][size=22.0pt]DDS[/size][font=黑体][size=22.0pt] to make a numerical control signal synthesizer[/size][/font][/b]...
On August 23rd, Geely's subsidiary, Jiyao Tongxing, announced it has the industry's largest advanced production capacity for tandao
batteries
, with eight production bases across China. Jiy...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
When you are happily watching NBA or football, your wife asks you to turn off the lights in the bedroom. Would you be depressed? Of course, unless you are not afraid of your wife.
Now you are ...[Details]
As more and more consumers purchase new energy vehicles, the safety of electric vehicles has become a major concern. This has been particularly prominent following a series of electric vehicle fire...[Details]
As the number of cars increases, environmental pressures are also increasing. At this time, some people are saying that new energy vehicles are energy-efficient and environmentally friendly, and ar...[Details]
The structure of an LCD TV primarily consists of the LCD display module, power module, driver module (primarily including the main driver board and tuner board), and keypad module. LCD display modu...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
1 Source of creativity
With the further development of electronic technology, electronic pets have gradually entered people's family life. At present, there are two main categories of relative...[Details]
Smartphones have become essential digital devices, and the growing number of smartphone-centric applications is enriching people's lives. As users, they desire a better app experience and a wider r...[Details]
With the development of science, the use of variable frequency technology is becoming more and more widespread, and it is used in both industrial equipment and household appliances. Inverter air co...[Details]
The fracture mechanism is stress concentration, which typically occurs at the capacitor lead pins or pad connection points, as shown in the figure. Under vibration, the capacitor lead pins and pad ...[Details]
Batteries are a core component of new energy vehicles, accounting for over 40% of the total cost. This is also the area where automakers are most willing to tamper with costs. Since 2021, domestic ...[Details]
The Waveshare ESP32-P4-ETH is a compact ESP32-P4 development board with Ethernet and PoE support. It looks very similar to the Olimex ESP32-P4-DevKit, minus the pUEXT connector. However, we've also...[Details]
For the average person, an electricity meter is a monthly bill. For beginners, it's a collection of components and parts. For experienced meter engineers, however, it's a complex and complex proces...[Details]
When we pick up an unfamiliar object, the first thing we want to know is what it actually does. A drive shaft, as the name suggests, is a shaft that transmits power. It's the transmission medium th...[Details]
Analog electronics
京公网安备 11010802033920号
EEWORLD
