5962-8761001DX datasheet, PDF - EEWORLD Datasheet

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5962-8761001DX: DescriptionAC SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERPACK-14; Categorylogic logic; File Size148KB，8 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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5962-8761001DX Overview

AC SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERPACK-14

5962-8761001DX Parametric

Parameter Name	Attribute value
Parts packaging code	DFP
package instruction	QFF,
Contacts	14
Reach Compliance Code	compliant
series	AC
JESD-30 code	R-GDFP-F14
length	9.21 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	NAND GATE
MaximumI(ol)	0.024 A
Number of functions	3
Number of entries	3
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	QFF
Package shape	RECTANGULAR
Package form	FLATPACK
Maximum supply current (ICC)	0.08 mA
Prop。Delay @ Nom-Sup	11 ns
propagation delay (tpd)	11 ns
Certification status	Qualified
Schmitt trigger	NO
Filter level	MIL-STD-883
Maximum seat height	2.03 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	6.29 mm
Base Number Matches	1

5962-8761001DX Related Products

	5962-8761001DX	5962-87610012X	5962-8761001CX	SN54AC10FK	M38510/75002BDX
Description	AC SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERPACK-14	AC SERIES, TRIPLE 3-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20	AC SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14	AC SERIES, TRIPLE 3-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20	AC SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERAMIC, DFP-14
Parts packaging code	DFP	QLCC	DIP	QLCC	DFP
package instruction	QFF,	QCCN,	DIP,	CERAMIC, LCC-20	DFP,
Contacts	14	20	14	20	14
Reach Compliance Code	compliant	compliant	compliant	not_compliant	compliant
series	AC	AC	AC	AC	AC
JESD-30 code	R-GDFP-F14	S-CQCC-N20	R-GDIP-T14	S-CQCC-N20	R-XDFP-F14
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE
MaximumI(ol)	0.024 A	0.024 A	0.024 A	0.012 A	0.012 A
Number of functions	3	3	3	3	3
Number of entries	3	3	3	3	3
Number of terminals	14	20	14	20	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED
encapsulated code	QFF	QCCN	DIP	QCCN	DFP
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	IN-LINE	CHIP CARRIER	FLATPACK
Prop。Delay @ Nom-Sup	11 ns	11 ns	11 ns	11 ns	12 ns
propagation delay (tpd)	11 ns	11 ns	11 ns	7 ns	12 ns
Certification status	Qualified	Qualified	Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO
Maximum supply voltage (Vsup)	6 V	6 V	6 V	6 V	5.5 V
Minimum supply voltage (Vsup)	2 V	2 V	2 V	2 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	5 V	4.5 V
surface mount	YES	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	NO LEAD	THROUGH-HOLE	NO LEAD	FLAT
Terminal location	DUAL	QUAD	DUAL	QUAD	DUAL
length	9.21 mm	8.89 mm	19.56 mm	8.89 mm	-
Maximum supply current (ICC)	0.08 mA	0.08 mA	0.08 mA	-	0.02 mA
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883	-	MIL-M-38510 Class B
Maximum seat height	2.03 mm	2.03 mm	5.08 mm	2.03 mm	-
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	1.27 mm	-
width	6.29 mm	8.89 mm	7.62 mm	8.89 mm	-
Base Number Matches	1	1	1	1	-

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