Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPC8569EEC
Rev. 2, 10/2013
MPC8569E
MPC8569E PowerQUICC III
Integrated Processor
Hardware Specifications
• High-performance, 32-bit e500 core, scaling up to
1.33 GHz, that implements the Power Architecture®
technology
– 2799 MIPS at 1.33 GHz (estimated Dhrystone 2.1)
– 36-bit physical addressing
– Double-precision embedded floating point APU using
64-bit operands
– Embedded vector and scalar single-precision
floating-point APUs using 32- or 64-bit operands
– Memory management unit (MMU)
• Integrated L1/L2 cache
– L1 cache—32-Kbyte data and 32-Kbyte instruction
– L2 cache—512-Kbyte (8-way set associative)
• Two DDR2/DDR3 SDRAM memory controllers with full
ECC support
– One 64-bit or two 32-bit data bus configuration
– Up to 400 MHz clock (800 MHz data rate)
– Supporting up to 16 Gbytes of main memory
– Using ECC, detects and corrects all single-bit errors and
detects all double-bit errors and all errors within a nibble
– Invoke a level of system power management by
asserting MCKE SDRAM signal on-the-fly to put the
memory into a low-power sleep mode
– Both hardware and software options to support
battery-backed main memory
– Initialization bypass feature that allow system designers
to prevent re-initialization of main memory during
system power on following abnormal shutdown
• Integrated security engine (SEC) optimized to process all
the algorithms associated with IPsec, IKE, SSL/TLS,
iSCSI, SRTP, IEEE Std 802.11i™, IEEE Std 802.16™
(WiMAX), IEEE 802.1ae™ (MACSec), 3GPP, A5/3 for
GSM and EDGE, and GEA3 for GPRS.
– XOR engine for parity checking in RAID storage
applications
– Four crypto-channels, each supporting multi-command
descriptor chains
– Cryptographic execution units for PKEU, DEU, AESU,
AFEU, MDEU, KEU, CRCU, RNG and SEU- SNOW
QUICC Engine technology
– Four 32-bit RISC cores
– Supports Ethernet, ATM, POS, and T1/E1 along with
associated interworking
– Four Gigabit Ethernet interfaces (up to two with
SGMII)
– Up to eight 10/100-Mbps Ethernet interfaces
– Up to 16 T1/E1 TDM links (512 × 64 channels)
– Multi-PHY UTOPIA/POS-PHY L2 interface
(16-bit)
– IEEE Std 1588™ v2 support
– SPI and Ethernet PHY management interface
– One full-/low-speed USB interface supporting USB 2.0
– General-purpose I/O signals
High-speed interfaces (multiplexed) supporting:
– Two 1× Serial RapidIO interfaces (with message unit) or
one 4x interface
– ×4/×2/×1 PCI Express interface
– Two SGMII interfaces
On-chip network switch fabric
133 MHz, 16-bit, 3.3 V I/O, enhanced local bus (eLBC)
with memory controller
Enhanced secured digital host controller (eSDHC) used for
SD/MMC card interface
Integrated four-channel DMA controller
Dual I
2
C and dual universal asynchronous
receiver/transmitter (DUART) support
Programmable interrupt controller (PIC)
IEEE Std 1149.1™ JTAG test access port
1.0-V and 1.1-V core voltages with 3.3-V, 2.5-V, 1.8-V,
1.5-V and 1.0-V I/O
783-pin FC-PBGA package, 29 mm
×
29 mm
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Freescale reserves the right to change the detail specifications as may be required
to permit improvements in the design of its products.
© 2011–2013 Freescale Semiconductor, Inc. All rights reserved.
Table of Contents
1
2
Pin Assignments and Reset States . . . . . . . . . . . . . . . . . . . . .4
1.1 Ball Layout Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . .4
1.2 Pinout List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
2.1 Overall DC Electrical Characteristics . . . . . . . . . . . . . .36
2.2 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .42
2.3 Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
2.4 DDR2 and DDR3 SDRAM Controller . . . . . . . . . . . . . .45
2.5 DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
2.6 Ethernet Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
2.7 Ethernet Management Interface . . . . . . . . . . . . . . . . . .74
2.8 HDLC, BISYNC, Transparent, and Synchronous UART
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76
2.9 High-Speed SerDes Interfaces (HSSI) . . . . . . . . . . . . .78
2.10 PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85
2.11 Serial RapidIO (SRIO) . . . . . . . . . . . . . . . . . . . . . . . . .90
2.12 I
2
C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95
2.13 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .98
2.14 JTAG Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99
2.15 Enhanced Local Bus Controller . . . . . . . . . . . . . . . . .101
2.16 Enhanced Secure Digital Host Controller (eSDHC) . .108
2.17 Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
2.18 Programmable Interrupt Controller (PIC). . . . . . . . . . 111
2.19 SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
2.20 TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
2.21 USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
2.22 UTOPIA/POS Interface . . . . . . . . . . . . . . . . . . . . . . . 117
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
3.1 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . 119
3.2 Recommended Thermal Model . . . . . . . . . . . . . . . . . 119
3.3 Thermal Management Information . . . . . . . . . . . . . . 120
Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
4.1 Package Parameters for the MPC8569E . . . . . . . . . . 122
4.2 Mechanical Dimensions of the FC-PBGA with Full Lid123
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
5.1 Part Numbers Fully Addressed by This Document . . 124
5.2 Part Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
5.3 Part Numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . 126
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MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 2
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