Fixed-Point Digital Signal Processor 532-FC/CSP 0 to 90
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | BGA |
| package instruction | HFBGA, BGA532,26X26,32 |
| Contacts | 532 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.A.2 |
| Factory Lead Time | 6 weeks |
| Other features | ALSO REQUIRES 3.3V SUPPLY |
| Address bus width | 23 |
| barrel shifter | NO |
| bit size | 32 |
| boundary scan | YES |
| maximum clock frequency | 75.18 MHz |
| External data bus width | 64 |
| Format | FIXED POINT |
| Integrated cache | YES |
| Internal bus architecture | MULTIPLE |
| JESD-30 code | S-PBGA-B532 |
| JESD-609 code | e1 |
| length | 23 mm |
| low power mode | YES |
| Humidity sensitivity level | 4 |
| Number of DMA channels | 64 |
| Number of external interrupt devices | 4 |
| Number of terminals | 532 |
| Number of timers | 3 |
| On-chip program ROM width | 8 |
| Maximum operating temperature | 90 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HFBGA |
| Encapsulate equivalent code | BGA532,26X26,32 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 1.2,3.3 V |
| Certification status | Not Qualified |
| RAM (number of words) | 16384 |
| ROM programmability | FLASH |
| Maximum seat height | 3.3 mm |
| Maximum supply voltage | 1.16 V |
| Minimum supply voltage | 1.05 V |
| Nominal supply voltage | 1.1 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 23 mm |
| uPs/uCs/peripheral integrated circuit type | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
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