C0805Q122J1XAG datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> C0805Q122J1XAG

C0805Q122J1XAG: DescriptionCeramic Capacitor, Ceramic, 100V, 5% +Tol, 5% -Tol, X7R, -/+15ppm/Cel TC, 0.0012uF, 0805,; CategoryPassive components capacitor; File Size1MB，8 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

Download Datasheet Parametric View All

C0805Q122J1XAG Overview

Ceramic Capacitor, Ceramic, 100V, 5% +Tol, 5% -Tol, X7R, -/+15ppm/Cel TC, 0.0012uF, 0805,

C0805Q122J1XAG Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	926465747
package instruction	, 0805
Reach Compliance Code	not_compliant
ECCN code	EAR99
YTEOL	8
capacitance	0.0012 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	1.4 mm
JESD-609 code	e4
length	2.03 mm
negative tolerance	5%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package form	SMT
method of packing	Bulk
positive tolerance	5%
Rated (DC) voltage (URdc)	100 V
series	C(SIZE)Q
size code	0805
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	Gold (Au)
width	1.27 mm

Preview

Download Datasheet

View All

CERAMIC HIGH RELIABILITY

GENERAL INFORMATION GR900 SERIES

HIGH RELIABILITY — GR900

/ Q-SPEC

GR900 capacitors are intended for use in any application where the

chance of failure must be reduced to the lowest possible level. While

any well-made multilayer ceramic capacitor is an inherently reliable

device, GR900 capacitors receive special attention in all phases of

manufacture including:

•

Raw Materials Selection

•

Clean Room Production

•

Individual Batch Testing

•

C-SAM (when applicable)

•

Singular Batch Identity is Maintained

•

Destructive Physical Analysis

•

These parts are well worth the added investment in comparison to the

cost of a device or system failure.

Typical applications include: Medical, Aerospace, Communication

Satellites, Radar and Guidance Systems.

SCREENING AND SAMPLE TESTS

Each batch receives the following testing/inspections:

In Process Inspection (Per MIL-PRF-123):

100% Visual Inspection.

Destructive Physical Analysis: (DPA) - A sample is pulled from

each lot and examined per EIA-469 and KEMET’s strict internal

void and delamination criteria. Sampling plan is per MIL-PRF-123.

C-SAM (GR900 / “A” in the fifth character position of the ordering

code): May be performed on batches failing to meet the DPA

criteria for removal of marginal product. Not required on each lot.

C-SAM (Q-SPEC / “Q” in the fifth character position of the ordering

code): Receive 100% C-SAM of lot prior to application of end

metallization.

Group A

1. Thermal Shock:

Materials used in the construction of multilayer

ceramic capacitors possess various thermal coefficients of expansion.

To assure maximum uniformity, each part is temperature cycled in

accordance to MIL-STD-202, Method 107, Condition A with Step 3

being 125°C. Number of cycles shall be 20 (100% of lot).

2. Voltage Conditioning:

One of the most strenuous environments for

any capacitor is the high temperature/high voltage test. All units are

subject to twice-rated voltage to the units at the maximum rated

temperature of 125°C for a minimum of 168 hours and a maximum of

264 hours. The voltage conditioning may be terminated at any time

during 168 hours to 264 hours time interval that confirmed failures meet

the requirements of the PDA during the last 48 hours of 1 unit or .4%

(100% of lot).

Optional Voltage Conditioning (Accelerated Voltage

Conditioning):

All conditions of the standard voltage conditioning

apply with the exception of increased voltage and decreased test time.

Refer to MIL-PRF-123 for the proper formula.

*Step 5 is performed on chips at this point (100% of lot).

3. Dielectric Withstanding Voltage:

250% of the DC rated voltage at

25°C (100% of lot).

9. Percent Defective Allowable (PDA):

The overall PDA is 8% for

parts outside the MIL-PRF-123 values. The PDA is per MIL-PRF-

123 for all parts that are valid MIL-PRF-123 values. The PD

includes steps 1 through 8 above with the following exceptions.

Capacitance exclusion - capacitance values no more than 5% or

.5pF, whichever is greater for BX characteristic or 1% or .3pF,

whichever is greater for BP characteristic beyond specified

tolerance limit, shall be removed from the lot but shall not be

considered defective for determination of the PD.

Insulation Resistance at 25°C — Product which is not acceptable

for twice the military limit but is acceptable per the military limit, is

removed from the lot but shall not be considered defective for

determination of the PD.

10. Visual and Mechanical Examination:

Performed per MIL-

PRF-123 criteria.

11. Radiographic Examination (Leaded Devices Only):

Radial

devices receive a one-plane X-ray.

12. Destructive Physical Analysis (DPA):

A sample is examined

on each lot per EIA-469. Sampling Plan is per MIL-PRF-123.

STANDARD PACKAGING

All products are packaged in trays except C512 capacitors which

are packaged 1 piece per bag.

*Note: All packaging is ESD protected.

DATA PACKAGE

A data package is sent with each shipment which contains:

1. Final Destructive Physical Analysis (DPA) report.

2. Certificate of Compliance stating that the parts meet all

applicable requirements of the appropriate military specification to

the best failure level to which KEMET is approved.

3. Summary of Group A Testing.

Group B

MIL-PRF-123 Group B testing is available with special order.

Please contact KEMET for additional information and ordering

details.

4. Insulation Resistance:

The 25°C measurement with rated

voltage applied shall be the lesser of 100 GΩ or 1000 Megohm -

Microfarads (100% of lot).

*5. Insulation Resistance:

The 125°C measurement with rated

voltage applied shall be the lesser of 10 GΩ or 100 Megohm -

Microfarads (100% of lot). For chips, 125°C IR is performed prior to

Step 3 above.

6. Storage

at 150°C for 2 hours minimum without voltage applied

followed by a 12-hour minimum stabilization period (temperature

characteristic BX only).

7. Capacitance:

Shall be within specified tolerance at 25°C (100%

of lot). (Aging phenomenon is taken into account for BX dielectric

to obtain capacitance.)

8. Dissipation Factor:

Shall not exceed 2.5% for X7R (BX)

dielectric, 0.15% for C0G (BP) dielectric at 25°C. (100% of lot.)

Recommended Resources

DW16M-630 type demagnetization switch AC control circuit

Module data experimental circuit diagram

Multi-channel signal centralized monitoring circuit

Handheld voice changing megaphone circuit

LM2879--12W bridge audio power amplifier circuit

875p computer motherboard circuit diagram_100

Share the learning experience of LM3S8962 system clock setting function: LM3S8962 DATASHEET introduces various LM3S8962 system clock sources. The clock sources of LM3S8962 are as follows: 1. On-chip clock source, 12M+-30%, as the main clock, it needs to be set by software ...; eeleader Microcontroller MCU

DDS information~: [i=s] This post was last edited by paulhyde on 2014-9-15 04:18 [/i] This is the information I collected about DDS~ [[i] This post was last edited by Er Yuer on 2011-8-30 17:11 [/i]]...; 贰雨儿 Electronics Design Contest

Find the clock cycle of the main statement in 430: I would like to ask what is the clock cycle of the main statements in 430? (+, -, *, and while statements) I used to think that they were all single-cycle instructions in 430, but today I found that t...; 守月 Microcontroller MCU

Help: Infrared tube application circuit: [i=s] This post was last edited by paulhyde on 2014-9-15 03:38 [/i] I want to design a detection circuit using a reflective infrared tube, but I have never used an infrared tube before. Does anyone ha...; 熟悉的陌生人 Electronics Design Contest

How to fix the grayed-out functions in the function drop-down list in VS2005?: When I was using VS2005, sometimes I found that some functions in the drop-down list of a function in the upper right area were grayed out. They should have been all black, and I could jump to the cor...; longyiquan Embedded System

Work requires the use of fpga: Request a Trial...; chenfeng420 FPGA/CPLD

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components