Revision 3
Accelerator Series FPGAs – ACT 3 Family
Features
• Up to 10,000 Gate Array Equivalent Gates (up to 25,000
equivalent PLD Gates)
• Highly Predictable Performance with 100% Automatic Place-
and-Route
• As Low as 9.0 ns Clock-to-Output Times (–1 Speed Grade)
• Up to 186 MHz On-Chip Performance (–1 Speed Grade)
• Up to 228 User-Programmable I/O Pins
• Four Fast, Low-Skew Clock Networks
Table 1 • ACT 3 Family Product Information
Device
Capacity
Gate Array Equivalent Gates
PLD Equivalent Gates
TTL Equivalent Package (40 gates)
20-Pin PAL Equivalent Packages (100 gates)
Logic Modules
S-Module
C-Module
Dedicated Flip-Flops
1
User I/Os (maximum)
Chip-to-Chip
3
(MHz)
Accumulators (16-bit, MHz)
Loadable Counter (16-bit, MHz)
Prescaled Loadable Counters (16-bit, MHz)
Datapath, Shift Registers (MHz)
Clock-to-Output (pad-to-pad, ns)
Packages
4
(by pin count)
CPGA
PLCC
PQFP
RQFP
VQFP
TQFP
BGA
CQFP
PG100
5
PL84
PQ100
–
VQ100
–
–
–
PG133
5
PL84
PQ100, PQ160
–
VQ100
–
–
CQ132
PG175
5
PL84
PQ160
–
VQ100
TQ176
–
–
PG207
–
PQ160, PQ208
–
–
TQ176
BG225
5
CQ196
PG257
–
–
RQ208
–
–
BG313
CQ256
1,500
3,750
40
15
200
104
96
264
80
80
47
82
186
186
9.0
2,500
6,250
60
25
310
160
150
360
100
80
47
82
186
186
9.0
4,000
10,000
100
40
564
288
276
568
140
80
47
82
186
186
9.5
6,000
15,000
150
60
848
432
416
768
168
78
47
82
150
150
10.0
10,000
25,000
250
100
1,377
697
680
1,153
228
76
47
78
150
150
10.5
A1415
A1425
A1440
A1460
A14100
•
•
•
•
•
•
•
•
•
•
More than 500 Macro Functions
Replaces up to Twenty 32 Macro-Cell CPLDs
Replaces up to One Hundred 20-Pin PAL
®
Packages
Up to 1,153 Dedicated Flip-Flops
VQFP, TQFP, BGA, and PQFP Packages
Nonvolatile, User Programmable
Fully Tested Prior to Shipment
5.0 V and 3.3 V Versions
Optimized for Logic Synthesis Methodologies
Low Power CMOS Technology
Maximum Performance
2
(worst-case commercial, –1 speed grade)
Notes:
1. One flip-flop per S0Module, two flip-flops per I/O Module.
2. Based on A1415A-1, A1425A-1, A1440A-1, A1460A-1, and A14100A-1.
3. Clock-to-Output (pad-to-pad) + assumed trace delay + setup time. Refer to the
"System Performance Model" on page 1-1
and
Table 1-1 on page 1-2.
4. See the
"Product Plan" table on page III
for package availability.
5. Discontinued device and package combination.
6. –2 and –3 speed grades have been discontinued. For more information about discontinued devices, refer to the Product
Discontinuation Notices (PDNs) listed below, available on the Microsemi SoC Products Group website:
PDN March 2001, PDN 0104, PDN 0203, PDN 0604, PDN 1004
January 2012
© 2012 Microsemi Corporation
I
Accelerator Series FPGAs – ACT 3 Family
Ordering Information
A14100
A
_
1
RQ
G
208
C
Application (Temperature Range)
C = Commercial (0 to +70°C)
I = Industrial (–40 to +85°C)
M = Military (–55 to +125°C)
B = MIL-STD-883
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS Compliant Packaging
Package Type
PG = Ceramic Pin Grid Array
PL = Plastic Leaded Chip Carrier
PQ = Plastic Quad Flatpack
RQ = Plastic Power Quad Flatpack
VQ = Very Thin (1.0 mm) Quad Flatpack
TQ = Thin (1.4 mm) Quad Flatpack
CQ = Ceramic Quad Flatpack
BG = Plastic Ball Grid Array
Speed Grade
Std = Standard Speed
–1 = Approximately 15% faster than Standard
–2 = Approximately 25% faster than Standard
–3 = Approximately 35% faster than Standard
Die Revision
A = 1.0 mm CMOS Process
Part Number
A1415A = 1,500 Gates
A14V15A = 1,500 Gates (3.3 V)
A1425A = 2,500 Gates
A14V25A = 2,500 Gates (3.3 V)
A1440A = 4,000 Gates
A14V40A = 4,000 Gates (3.3 V)
A1460A = 6,000 Gates
A14V60A = 6,000 Gates (3.3 V)
A14100A = 10,000 Gates
A14V100A = 10,000 Gates (3.3 V)
Notes:
1. The –2 and –3 speed grades have been discontinued.
2. The Ceramic Pin Grid Array packages PG100, PG133, and PG175 have been discontinued in all device densities, speed
grades, and temperature grades.
3. The Plastic Ball Grid Array package BG225 has been discontinued in all device densities (specifically for A1460A), all speed
grades, and all temperature grades.
4. Military Grade devices are no longer available for the A1440A device.
5. For more information about discontinued devices, refer to the Product Discontinuation Notices (PDNs) listed below, available on
the Microsemi SoC Products Group website:
PDN March 2001
PDN 0104
PDN 0203
PDN 0604
PDN 1004
II
R ev i si o n 3
Accelerator Series FPGAs – ACT 3 Family
Product Plan
Speed Grade
1
Device/Package
A1415A Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Plastic Quad Flatpack (PQFP)
100-Pin Very Thin Quad Flatpack (VQFP)
100-Pin Ceramic Pin Grid Array (CPGA)
A14V15A Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Very Thin Quad Flatpack (VQFP)
A1425A Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Plastic Quad Flatpack (PQFP)
100-Pin Very Thin Quad Flatpack (VQFP)
132-Pin Ceramic Quad Flatpack (CQFP)
133-Pin Ceramic Pin Grid Array (CPGA)
160-Pin Plastic Quad Flatpack (PQFP)
A14V25A Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Very Thin Quad Flatpack (VQFP)
160-Pin Plastic Quad Flatpack (PQFP)
A1440A Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Very Thin Quad Flatpack (VQFP)
160-Pin Plastic Quad Flatpack (PQFP)
175-Pin Ceramic Pin Grid Array (CPGA)
176-Pin Thin Quad Flatpack (TQFP)
Notes:
1. Applications:
C = Commercial
I = Industrial
M = Military
2. Commercial only
Std.
–1
–2
–3
C
Application
1
I
M
B
✓
✓
✓
D
✓
✓
✓
D
D
D
D
D
D
D
D
D
✓
✓
✓
D
✓
✓
✓
–
✓
✓
✓
–
–
–
–
–
✓
✓
✓
✓
✓
✓
D
–
–
–
–
–
–
✓
✓
✓
✓
✓
✓
D
–
–
–
–
–
–
✓
✓
✓
✓
D
D
D
D
–
D
D
D
D
D
–
D
D
✓
✓
✓
–
–
–
–
–
–
✓
D
–
✓
D
–
✓
✓
✓
✓
✓
✓
✓
D
✓
–
–
–
✓
✓
✓
✓
✓
✓
✓
D
✓
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
✓
✓
✓
D
D
D
D
D
D
D
D
D
D
D
✓
✓
✓
–
–
–
–
–
–
–
–
–
–
–
✓
✓
✓
✓
Availability:
✓
= Available
P = Planned
– = Not planned
D = Discontinued
Speed Grade:
–1 = Approx. 15% faster than Std.
–2 = Approx. 25% faster than Std.
–3 = Approx. 35% faster than Std.
(–2 and –3 speed grades have
been discontinued.)
R e visi on 3
III
Accelerator Series FPGAs – ACT 3 Family
Speed Grade
1
Device/Package
A14V40A Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Very Thin Quad Flatpack (VQFP)
160-Pin Plastic Quad Flatpack (PQFP)
176-Pin Thin Quad Flatpack (TQFP)
A1460A Device
160-Pin Plastic Quad Flatpack (PQFP)
176-Pin Thin Quad Flatpack (TQFP)
196-Pin Ceramic Quad Flatpack (CQFP)
207-Pin Ceramic Pin Grid Array (CPGA)
208-Pin Plastic Quad Flatpack (PQFP)
225-Pin Plastic Ball Grid Array (BGA)
A14V60A Device
160-Pin Plastic Quad Flatpack (PQFP)
176-Pin Thin Quad Flatpack (TQFP)
208-Pin Plastic Quad Flatpack (PQFP)
A14100A Device
208-Pin Power Quad Flatpack (RQFP)
257-Pin Ceramic Pin Grid Array (CPGA)
313-Pin Plastic Ball Grid Array (BGA)
256-Pin Ceramic Quad Flatpack (CQFP)
A14V100A Device
208-Pin Power Quad Flatpack (RQFP)
313-Pin Plastic Ball Grid Array (BGA)
Notes:
1. Applications:
C = Commercial
I = Industrial
M = Military
2. Commercial only
Std.
–1
–2
–3
C
Application
1
I
M
B
✓
✓
✓
✓
✓
✓
✓
✓
✓
D
–
–
–
–
–
–
–
–
–
–
–
–
✓
✓
✓
✓
✓
✓
✓
✓
✓
D
–
–
–
–
–
–
–
–
–
–
–
–
✓
✓
✓
✓
✓
D
D
D
–
D
D
D
D
D
–
D
D
D
✓
✓
–
–
–
–
–
–
✓
✓
–
–
✓
✓
–
–
✓
–
✓
✓
✓
✓
✓
✓
✓
✓
✓
–
–
–
–
–
–
–
–
–
✓
✓
✓
✓
✓
✓
✓
✓
✓
–
–
–
–
–
–
–
–
–
✓
✓
✓
✓
–
–
D
D
D
–
D
D
D
–
✓
–
–
–
–
–
✓
–
✓
–
✓
–
–
✓
–
–
–
–
–
–
–
–
Availability:
✓
= Available
P = Planned
– = Not planned
D = Discontinued
Speed Grade:
–1 = Approx. 15% faster than Std.
–2 = Approx. 25% faster than Std.
–3 = Approx. 35% faster than Std.
(–2 and –3 speed grades have
been discontinued.)
IV
R ev i si o n 3
Accelerator Series FPGAs – ACT 3 Family
Plastic Device Resources
Device
Series
A1415
A1425
A1440
A1460
A14100
Logic
Modules
200
310
564
848
1377
User I/Os
Gates
1500
2500
4000
6000
10000
PL84
70
70
70
–
–
PQ100
80
80
–
–
–
PQ160
–
100
131
131
–
PQ/RQ208
–
–
–
167
175
VQ100
80
83
83
–
–
TQ176
–
–
140
151
–
BG225*
–
–
–
168
–
BG313
–
–
–
–
228
Note:
*Discontinued
Hermetic Device Resources
Device
Series
A1415
A1425
A1440
A1460
A14100
Logic
Modules
200
310
564
848
1377
User I/Os
Gates
1500
2500
4000
6000
10000
PG100*
80
–
–
–
–
PG133*
–
100
–
–
–
PG175*
–
–
140
–
–
PG207
–
–
–
168
–
PG257
–
–
–
–
228
CQ132
–
100
–
–
–
CQ196
–
–
–
168
–
CQ256
–
–
–
–
228
Note:
*Discontinued
Contact your local Microsemi SoC Products Group (formerly Actel) representative for device availability:
http://www.microsemi.com/soc/contact/default.aspx.
R e visi on 3
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