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5962-8868901YA

Description
Serial I/O Controller, 2 Channel(s), 0.3125MBps, CMOS, CQCC44, CERAMIC, LCC-44
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size395KB,30 Pages
Manufacturere2v technologies
Download Datasheet Parametric Compare View All

5962-8868901YA Overview

Serial I/O Controller, 2 Channel(s), 0.3125MBps, CMOS, CQCC44, CERAMIC, LCC-44

5962-8868901YA Parametric

Parameter NameAttribute value
Parts packaging codeLCC
package instructionQCCN, LCC44,.65SQ
Contacts44
Reach Compliance Codecompliant
Address bus width
boundary scanNO
letter of agreementASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC
Data encoding/decoding methodsNRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)
Maximum data transfer rate0.3125 MBps
External data bus width8
JESD-30 codeS-CQCC-N44
JESD-609 codee0
low power modeNO
Number of serial I/Os2
Number of terminals44
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Encapsulate equivalent codeLCC44,.65SQ
Package shapeSQUARE
Package formCHIP CARRIER
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum slew rate30 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches1
REVISIONS
LTR
A
DESCRIPTION
Added device types 03, 04, 05, and 06. Added electrical test limits for device
types 03, 04, 05, and 06 to table I. Added vendor CAGE code 34335. Editorial
changes throughout.
Added device types 07, 08, 09, and 10. Added electrical parameters testing to
table I for device types 07, 08, 09, and 10. Added a new package for device
type 07. Editorial changes throughout.
Added vendor CAGE code 0C7V7. Update boilerplate to MIL-PRF-38535
requirements. – LTG
Update boilerplate to current MIL-PRF-38535 requirements. – CFS
Update boilerplate to current MIL-PRF-38535 requirements. - PHN
DATE (YR-MO-DA)
90-05-09
APPROVED
William K. Heckman
B
92-03-25
Monica L. Poelking
C
D
E
02-12-18
07-12-05
13-06-06
Thomas M. Hess
Thomas M. Hess
Thomas M. Hess
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
E
15
E
16
E
17
E
18
REV
SHEET
PREPARED BY
Tim H. Noh
CHECKED BY
Tim H. Noh
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
William K. Heckman
DRAWING APPROVAL DATE
89-02-06
AMSC N/A
REVISION LEVEL
SIZE
A
CAGE CODE
E
19
E
20
E
21
E
1
E
22
E
2
E
23
E
3
E
24
E
4
E
25
E
5
E
26
E
6
E
27
E
7
E
28
E
8
E
29
E
9
E
10
E
11
E
12
E
13
E
14
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, DIGITAL, CMOS, SERIAL
COMMUNICATION CONTROLLER,
MONOLITHIC SILICON
67268
1 OF
29
5962-88689
E
DSCC FORM 2233
APR 97
SHEET
5962-E443-13

5962-8868901YA Related Products

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Description Serial I/O Controller, 2 Channel(s), 0.3125MBps, CMOS, CQCC44, CERAMIC, LCC-44 Serial I/O Controller, 2 Channel(s), CMOS, CDIP40, CERAMIC, DIP-40 Serial I/O Controller, 2 Channel(s), 0.3125MBps, CMOS, CQCC44, CERAMIC, LCC-44 Serial I/O Controller, 2 Channel(s), 0.5125MBps, CMOS, CQCC44, CERAMIC, LCC-44 Serial I/O Controller, 2 Channel(s), CMOS, CQCC44, CERAMIC, LCC-44 Serial I/O Controller, 2 Channel(s), CMOS, CQCC44, CERAMIC, LCC-44 Serial I/O Controller, 2 Channel(s), CMOS, CDIP40, CERAMIC, DIP-40 Serial I/O Controller, 2 Channel(s), CMOS, CQCC44, CERAMIC, LCC-44
Parts packaging code LCC DIP LCC LCC LCC LCC DIP LCC
package instruction QCCN, LCC44,.65SQ DIP, DIP40,.6 QCCN, LCC44,.65SQ QCCN, LCC44,.65SQ QCCN, LCC44,.65SQ QCCN, LCC44,.65SQ DIP, DIP40,.6 QCCN, LCC44,.65SQ
Contacts 44 40 44 44 44 44 40 44
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
boundary scan NO NO NO NO NO NO NO NO
letter of agreement ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC ASYNC, BIT; SYNC, BYTE; EXT SYNC ASYNC, BIT; SYNC, BYTE; EXT SYNC
Data encoding/decoding methods NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0) NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)
External data bus width 8 8 8 8 8 8 8 8
JESD-30 code S-CQCC-N44 R-GDIP-T40 S-CQCC-N44 S-CQCC-N44 S-CQCC-N44 S-CQCC-N44 R-GDIP-T40 S-CQCC-N44
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
low power mode NO NO NO NO NO NO NO NO
Number of serial I/Os 2 2 2 2 2 2 2 2
Number of terminals 44 40 44 44 44 44 40 44
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
encapsulated code QCCN DIP QCCN QCCN QCCN QCCN DIP QCCN
Encapsulate equivalent code LCC44,.65SQ DIP40,.6 LCC44,.65SQ LCC44,.65SQ LCC44,.65SQ LCC44,.65SQ DIP40,.6 LCC44,.65SQ
Package shape SQUARE RECTANGULAR SQUARE SQUARE SQUARE SQUARE RECTANGULAR SQUARE
Package form CHIP CARRIER IN-LINE CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER IN-LINE CHIP CARRIER
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883
Maximum slew rate 30 mA 18 mA 30 mA 18 mA 18 mA 22 mA 15 mA 15 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES YES YES YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form NO LEAD THROUGH-HOLE NO LEAD NO LEAD NO LEAD NO LEAD THROUGH-HOLE NO LEAD
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location QUAD DUAL QUAD QUAD QUAD QUAD DUAL QUAD
uPs/uCs/peripheral integrated circuit type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1 1 1 1 1 1 1
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