Standard SRAM, 16KX4, 45ns, CMOS, CDFP28, CERPACK-28
| Parameter Name | Attribute value |
| Maker | Cypress Semiconductor |
| Parts packaging code | DFP |
| package instruction | DFP, |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 45 ns |
| Other features | AUTOMATIC POWER-DOWN |
| JESD-30 code | R-GDFP-F28 |
| JESD-609 code | e0 |
| length | 18.288 mm |
| memory density | 65536 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 28 |
| word count | 16384 words |
| character code | 16000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 16KX4 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 2.286 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 9.144 mm |
| Base Number Matches | 1 |
| 5962-8971201YA | 5962-8971201ZA | 5962-8971202YA | 5962-8971204YA | 5962-8971203YA | 5962-8971201XA | |
|---|---|---|---|---|---|---|
| Description | Standard SRAM, 16KX4, 45ns, CMOS, CDFP28, CERPACK-28 | Standard SRAM, 16KX4, 45ns, CMOS, CQCC28, CERAMIC, LCC-28 | Standard SRAM, 16KX4, 35ns, CMOS, CDFP28, CERPACK-28 | Standard SRAM, 16KX4, 20ns, CMOS, CDFP28, CERPACK-28 | Standard SRAM, 16KX4, 25ns, CMOS, CDFP28, CERPACK-28 | Standard SRAM, 16KX4, 45ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28 |
| Maker | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |
| Parts packaging code | DFP | QLCC | DFP | DFP | DFP | DIP |
| package instruction | DFP, | QCCN, | DFP, | DFP, | DFP, | DIP, |
| Contacts | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Maximum access time | 45 ns | 45 ns | 35 ns | 20 ns | 25 ns | 45 ns |
| Other features | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN |
| JESD-30 code | R-GDFP-F28 | R-CQCC-N28 | R-GDFP-F28 | R-GDFP-F28 | R-GDFP-F28 | R-GDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 18.288 mm | 13.97 mm | 18.288 mm | 18.288 mm | 18.288 mm | 37.0205 mm |
| memory density | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bi |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| character code | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES | YES | YES |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP | QCCN | DFP | DFP | DFP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | CHIP CARRIER | FLATPACK | FLATPACK | FLATPACK | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.286 mm | 1.905 mm | 2.286 mm | 2.286 mm | 2.286 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | FLAT | NO LEAD | FLAT | FLAT | FLAT | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
| width | 9.144 mm | 8.89 mm | 9.144 mm | 9.144 mm | 9.144 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |