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CC-MX-PF58-ZM-B

Description
mod WI-imx287 256m flash 25/PK
Categorysemiconductor    The embedded processor and controller   
File Size550KB,74 Pages
ManufacturerDigi International
Environmental Compliance  
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CC-MX-PF58-ZM-B Overview

mod WI-imx287 256m flash 25/PK

Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX28CEC
Rev. 3, 07/2012
i.MX28
i.MX28 Applications
Processors for Consumer
Products
Silicon Version 1.2
Package Information
Plastic package
Case MAPBGA-289, 14 x 14 mm, 0.8 mm pitch
Ordering Information
See
Table 1 on page 3
for ordering information.
1
Introduction
1.
The i.MX28 is a low-power, high-performance
applications processor optimized for the general
embedded industrial and consumer markets. The core of
the i.MX28 is Freescale's fast, power-efficient
implementation of the ARM926EJ-S™ core, with
speeds of up to 454 MHz.
The device is suitable for a wide range of applications,
including the following:
• Human-machine interface (HMI) panels:
industrial, home
• Industrial drive, PLC, I/O control display, factory
robotics display, graphical remote controls
• Handheld scanners and printers
• Patient-monitoring, portable medical devices
• Smart energy meters, energy gateways
• Media phones, media gateways
The integrated power management unit (PMU) on the
i.MX28 is composed of a triple output DC-DC switching
converter and multiple linear regulators. These provide
power sequencing for the device and its I/O peripherals
2.
3.
4.
5.
Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Device Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Ordering Information and Functional Part Differences
3
1.3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Special Signal Considerations . . . . . . . . . . . . . . . 11
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. i.MX28 Device-Level Conditions . . . . . . . . . . . . . . 11
3.2. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 18
3.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 19
3.4. I/O AC Timing and Parameters . . . . . . . . . . . . . . 23
3.5. Module Timing and Electrical Parameters . . . . . . 27
Package Information and Contact Assignments . . . . . . 59
4.1. Case MAPBGA-289, 14 x 14 mm, 0.8 mm Pitch . 59
4.2. Ground, Power, Sense, and Reference Contact
Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.3. Signal Contact Assignments . . . . . . . . . . . . . . . . 61
4.4. i.MX280 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 63
4.5. i.MX283 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 65
4.6. i.MX286 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 67
4.7. i.MX287 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 69
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
© 2012 Freescale Semiconductor, Inc. All rights reserved.
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