EEWORLDEEWORLDEEWORLD

Part Number

Search

RK73B1JXTDD124G

Description
Fixed Resistor, Metal Glaze/thick Film, 0.1W, 120000ohm, 50V, 2% +/-Tol, 200ppm/Cel, Surface Mount, 0603, CHIP
CategoryPassive components    The resistor   
File Size387KB,2 Pages
ManufacturerKOA
Environmental Compliance
Download Datasheet Parametric View All

RK73B1JXTDD124G Overview

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 120000ohm, 50V, 2% +/-Tol, 200ppm/Cel, Surface Mount, 0603, CHIP

RK73B1JXTDD124G Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1991112143
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginJapan, Mainland China, Malaysia
ECCN codeEAR99
YTEOL7.7
structureChip
Manufacturer's serial numberRK73B
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.45 mm
Package length1.6 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width0.8 mm
method of packingTR, PAPER, 10 INCH
Rated power dissipation(P)0.1 W
Rated temperature70 °C
GuidelineAEC-Q200
resistance120000 Ω
Resistor typeFIXED RESISTOR
seriesRK73B
size code0603
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient200 ppm/°C
Terminal shapeWRAPAROUND
Tolerance2%
Operating Voltage50 V
general purpose 2%, 5% tolerance
thick film chip resistor
EU
features
Marking: No marking on 1F, 1H & 1E
sizes, black protective coat.
White, three-digit marking on
1J ~ 3A on black protective coat.
Products with lead-free terminations meet EU RoHS
requirements. EU RoHS regulation is not intended
for Pb-glass contained in electrode, resistor element
and glass.
AEC-Q200 Qualified: 0201 (1H), 0402 (1E), 0603 (1J), 0805
(2A), 1206 (2B), 1210 (2E), 2010 (2H/W2H), 2512 (3A/W3A)
dimensions and construction
c
L
c
(Inch Size Code)
W
Solder
Plating
t
d
Protective
Coating
Resistive Inner
Film
Electrode
Ni
Plating
1F
(01005)
1E
(0402)
1H
(0201)
Type*
.015±.001 .007±.001 .004±.001 .004±.001 .005±.001
(0.4±0.02) (0.2±0.02) (0.10±0.03) (0.11±0.03) (0.13±0.02)
.024±.001 .012±.001 .004±.002 .006±.002 .009±.001
(0.6±0.03) (0.3±0.03) (0.1±0.05) (0.15±0.05) (0.23±0.03)
.039
(1.0
+.004
-.002
+0.1
-0.05
)
+.002
.02±.002 .008±.004 .01
-.004
.014±.002
(0.5±0.05) (0.2±0.1) (0.25
+0.05
) (0.35±0.05)
-0.1
L
Dimensions
inches
(mm)
W
c
d
t
Derating Curve
100
80
60
40
20
0
Ceramic
Substrate
100
1E, 1J, 2A, 2B, 2E, W2H,
W3A, 2H/W2H, 3A/W3A
80
% Rated Power
60
40
20
0
-60 -40
-55
2B
(1206)
2H
(2010)
3A
(2512)
2A
(0805)
1J
(0603)
.063±.008 .031±.004 .012±.004 .012±.004 .018±.004
(1.6±0.2)
(0.8±0.1)
(0.3±0.1) (0.45±0.1)
(0.3±0.1)
.079±.008 .049±.004 .016±.008
(2.0±0.2) (1.25±0.1) (0.4±0.2)
.063±.008
.126±.008
(1.6±0.2)
(3.2±0.2)
.102±.008
(2.6±0.2)
.197±.008 .098±.008
(5.0±0.2)
(2.5±0.2)
.012
(0.3
+.008
-.004
+0.2
-0.1
)
.02±.004
(0.5±0.1)
1F
1E, 1H, 1J, 2A, 2B, 2E, 2H,
3A, W2H, W3A
3A, W2H, W3A
2E
(1210)
W2H
(2010)
.016
(0.4
+.008
-.004
+0.2
-0.1
)
0
20
40
100 120
140
160 180
70
125
155
Ambient Temperature
(°C)
60
80
-20
0
100 120
140 160
125
155
Terminal Part Temperature
(°C)
20
40
60
80
For resistors operated at an ambient
temperature of 70°C or above, a power
rating shall be derated in accordance
with the above derating curve.
For resistors operated at a terminal part
temperature of described for each size or
above, a power rating shall be derated in
accordance with the above derating curve.
Please refer to “Introduction of the derating
curve based on the terminal part temperature”
on the beginning of our catalog before use.
.02±.012
(0.5±0.3)
.026±.006 .024±.004
(0.65±0.15) (0.6±0.1)
.016
(0.4
+.008
-.004
+0.2
)
-0.1
New Part #
ordering information
RK73B
Type
2B
Size
1F
1H
1E
1J
2A
2B
2E
W2H
W3A
2H
3A
* Parentheses indicate EIA package size codes.
T
TD
Packaging
TX: 01005 only: 4mm width - 1mm pitch plastic embossed
TBL: 01005 only: 2mm pitch pressed paper
TA: 0201 only: 1mm pitch pressed paper
TC: 0201 only: 7" 2mm pitch pressed paper
(TC: 10,000 pcs/reel, TCM: 15,000 pcs/reel)
TCD: 0201 only: 10" 2mm pitch pressed paper
TPD: 0402 only: 10" plastic embossed
TPL: 0402 only: 2mm pitch punched paper
TP: 0402, 0603 & 0805: 7" 2mm pitch punched paper
TD: 0603, 0805, 1206 &1210: 7" 4mm pitch punched paper
TDD: 0603, 0805, 1206 &1210: 10" paper tape
TE: 0805, 1206, 1210, 2010 & 2512: 7" plastic embossed
TED: 0805, 1206, 1210, 2010 & 2512: 10" plastic embossed
For further information on packaging, please refer to Appendix A
W3A
(2512)
.248±.008 .122±.008
(6.3±0.2)
(3.1±0.2)
.026±.006
(0.65±0.15)
102
J
Tolerance
G: ±2%
J: ±5%
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
Termination
Material
T: Sn
(1F ~ 3A)
Contact factory
for below options:
L: SnPb
(1E, 1J, 2A, 2B,
2E, 2H, 3A)
G: Au
(1E ~ 2A:
10Ω ~ 1MΩ)
X: Bondable
(1J ~ 2E:
10Ω ~ 1MΩ)
Nominal
Resistance
2 significant
figures + 1
multiplier
“R” indicates
decimal on
value <10Ω
KOA Speer Electronics, Inc.
• 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
11/27/14
13
resistors
RK73B
VS2005 error message!
When I open any solution with VS2005 and then close it directly, the following error message appears: if you had files open that contained unsaved changes,these changes might be lost. As shown in the ...
chenxc0820 Embedded System
【LAUNCHXL-CC1350-4】- 4: Things are not that simple
[i=s]This post was last edited by MianQi on 2021-7-22 19:24[/i]In the previous post, I talked about building a software environment on the Windows platform. In fact, the environment built in this way ...
MianQi RF/Wirelessly
Which arm fpga has a better future?
From EEWORLD cooperation group: arm linux fpga embedded 0 (49900581)...
hz电子 FPGA/CPLD
Questions about AD9361
When the AD9361 local oscillator is set to 2400M, assuming that a 2402M signal is collected at this time, then through [/font][/color][color=#4183c4][font=微软雅黑][url=http://bbs.elecfans.com/zhuti_fpga_...
dreamandactual Analog electronics
Chip dedicated heat sink
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 20:00[/i] MAP series high thermal conductivity soft silicone thermal insulation pads are widely used in electronic equipment industries su...
warxp990 Mobile and portable
I made a board and found it can't start using Jun Yixing's u-boot
I made a board and used Junyixing SD card burning method to burn uboot, kernel, and file system into nand flash. But after switching to nand flash to start, I found that uboot did not print any inform...
bailyzheng Embedded System

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 787  335  1611  2137  699  16  7  33  44  15 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号