EEWORLDEEWORLDEEWORLD

Part Number

Search

5961-01-513-4150

Description
IC,OP-AMP,SINGLE,BIPOLAR,DIP,8PIN,CERAMIC
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size688KB,12 Pages
ManufacturerIntersil ( Renesas )
Websitehttp://www.intersil.com/cda/home/
Download Datasheet Parametric View All

5961-01-513-4150 Overview

IC,OP-AMP,SINGLE,BIPOLAR,DIP,8PIN,CERAMIC

5961-01-513-4150 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1164768836
Parts packaging codeDIP
Contacts8
Reach Compliance Codenot_compliant
ECCN codeEAR99
Amplifier typeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
Maximum bias current (IIB) at 25C0.1 µA
frequency compensationYES
Maximum input offset voltage8000 µV
JESD-30 codeR-XDIP-T8
low-biasNO
low-dissonanceNO
micropowerYES
Number of functions1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
powerNO
power supply5/+-15 V
Programmable powerNO
Certification statusNot Qualified
minimum slew rate0.8 V/us
Maximum slew rate0.15 mA
Supply voltage upper limit17.5 V
surface mountNO
technologyBIPOLAR
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Minimum voltage gain15000
broadbandNO
Research and Implementation of Interleaving Coding Technology Based on FPGA
[b]Research and Implementation of Interleaving Coding Technology Based on FPGA[/b] Chinese Journal Article Author: Yang Hongxun Zhang Lin Author Institution: [1] Guizhou Aerospace Electronic Technolog...
大辉哥0614 FPGA/CPLD
360-degree panoramic photography: seeing the world through the eyes of a fly
[align=left][color=#000][color=rgb(205, 23, 31)][url=http://www.deyisupport.com/cfs-file.ashx/__key/communityserver-blogs-components-weblogfiles/00-00-00-01-15/5504.161016_2D00_TI_2D 00_in_2D00_it_2D0...
maylove Analogue and Mixed Signal
Common Errors in PCB
[size=4][b]I. Common errors in schematics[/b] (1) ERC reports that the pin is not connected to the signal: a. The I/O attributes of the pin were defined when creating the package; b. The inconsistent ...
ohahaha PCB Design
Three programs for advanced Android applications...
Interesting, please give me a thumbs up after you open it... I believe you will be surprised after you open it...It's definitely good stuff....
shilaike Linux and Android
PCB component packaging issues
I want to change the package of the component in the PCB. Is it possible? I want to change the switch to a different shape?I want to ask if it is possible to directly package the component in the PCB?...
ZNF PCB Design
Ask about the serial port registry
I don't quite understand some of the serial port registry issues, please help me with some advice. [color=#FF00FF]"DevConfig"=hex: 10,00, 00,00, 05,00,00,00, 10,01,00,00, 00,4B,00,00, 00,00, 08, 00, 0...
wu086 Embedded System

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1115  2723  1697  1745  787  23  55  35  36  16 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号