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WS128K32L-55G2UM

Description
Standard SRAM, 128KX32, 55ns, CMOS, CQFP68, QFP-68
Categorystorage    storage   
File Size1MB,9 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WS128K32L-55G2UM Overview

Standard SRAM, 128KX32, 55ns, CMOS, CQFP68, QFP-68

WS128K32L-55G2UM Parametric

Parameter NameAttribute value
MakerMicrosemi
package instructionQFP, QFP68,.99SQ,50
Reach Compliance Codecompliant
Maximum access time55 ns
Other featuresUSER CONFIGURABLE AS 512K X 8
Spare memory width16
I/O typeCOMMON
JESD-30 codeS-CQFP-G68
length22.36 mm
memory density4194304 bit
Memory IC TypeSTANDARD SRAM
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Encapsulate equivalent codeQFP68,.99SQ,50
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum seat height3.51 mm
Maximum standby current0.002 A
Minimum standby current2 V
Maximum slew rate0.6 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
width22.36 mm
Base Number Matches1
WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
FEATURES

Access Times of 15, 17, 20, 25, 35, 45, 55ns

MIL-STD-883 Compliant Devices Available

Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
(Package 400)
• 68 lead, 40mm CQFP (G4T)
1
, 3.56mm (0.140") (Package
502)
• 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"),
(Package 510)
• 68 lead, 22.4mm (0.880") square, CQFP (G2L), 5.08mm
(0.200") high, (Package 528)

Organized as 128Kx32; User Configurable as 256Kx16 or
512Kx8

Commercial, Industrial and Military Temperature Ranges

5 Volt Power Supply

Low Power CMOS

TTL Compatible Inputs and Outputs

Built in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation

Weight:
WS128K32-XG2UX - 8 grams typical
WS128K32-XG2LX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX
1
- 20 grams typical

Devices are upgradeable to 512Kx32
This product is subject to change without notice.
FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X
Top View
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
NC
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
#
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
NC
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
WE
4
#
I/O
27
A
3
A
4
A
5
WE
3
#
CS
3
#
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
66
56
Pin Description
I/O
0-31
A
0-16
WE
1-4
#
CS
1-4
#
OE#
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
WE#1 CS#1
WE#2 CS#2
WE#3 CS#3
WE#4 CS#4
OE#
A0-16
128K x 8
128K x 8
128K x 8
128K x 8
8
8
8
8
I/O 0-7
I/O 8-15
I/O 16-23
I/O 24-31
Microsemi Corporation reserves the right to change products or specifications without notice.
September 2010
Rev. 18
© 2010 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
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