C1206Y563J5RAL datasheet, PDF - EEWORLD Datasheet

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C1206Y563J5RAL: DescriptionCeramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.056uF, Surface Mount, 1206, CHIP; CategoryPassive components capacitor; File Size2MB，21 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

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C1206Y563J5RAL Overview

Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.056uF, Surface Mount, 1206, CHIP

C1206Y563J5RAL Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Objectid	1890701421
package instruction	, 1206
Reach Compliance Code	not_compliant
ECCN code	EAR99
YTEOL	5.64
capacitance	0.056 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	0.78 mm
length	3.3 mm
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	5%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	BULK
positive tolerance	5%
Rated (DC) voltage (URdc)	50 V
size code	1206
surface mount	YES
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	Tin/Lead (Sn95Pb5) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
width	1.6 mm

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination

System (FF-CAP), X7R Dielectric, 6.3 – 250 VDC

(Commercial & Automotive Grade)

Overview

KEMET’s Floating Electrode with Flexible Termination

capacitor (FF-CAP) combines two existing KEMET

technologies– Floating Electrode and Flexible Termination.

The floating electrode component utilizes a cascading

internal electrode design configured to form multiple

capacitors in series within a single monolithic structure.

This unique configuration results in enhanced voltage and

ESD performance over standard capacitor designs while

allowing for a fail-open condition if mechanically damaged

(cracked). The flexible termination component utilizes a

conductive silver epoxy between the base metal and nickel

barrier layers of KEMET’s standard termination system

in order to establish pliability while maintaining terminal

strength, solderability and electrical performance. Both

technologies address the primary failure mode of MLCCs–

flex cracks, which are typically the result of excessive

tensile and shear stresses produced during board flexure

and thermal cycling.

Although neither technology can eliminate the potential for

mechanical damage that may propagate during extreme

environmental and/or handling conditions, the combination

of these two technologies provide the ultimate level of

protection against a low IR or short circuit condition.

The FF-CAP complements KEMET’s Open Mode, Floating

Electrode (FE-CAP), Flexible Termination (FT-CAP) and KEMET

Power Solutions (KPS) product lines by providing an ultimate

fail-safe design optimized for low to mid range capacitance

values. These devices exhibit a predictable change in

capacitance with respect to time and voltage and boast a

minimal change in capacitance with reference to ambient

temperature. Capacitance change is limited to ±15% from

−55°C to +125°C.

In addition to Commercial Grade, Automotive Grade devices

are available which meet the demanding Automotive

Electronics Council's AEC–Q200 qualification requirements.

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Ordering Information

Ceramic

0805

104

Capacitance

Code (pF)

Two significant

digits and

number of

zeros

Case Size Specification/

(L" x W")

Series

0603

0805

1206

1210

1812

Y = Floating

Electrode

with

Flexible

Termination

Failure Rate/

Capacitance Rated Voltage

Packaging/

Termination Finish

Dielectric

Design

Tolerance

(VDC)

Grade (C-Spec)

J = ±5%

K = ±10%

M = ±20%

9 = 6.3

8 = 10

4 = 16

3 = 25

5 = 50

1 = 100

2 = 200

A = 250

R = X7R

A = N/A

C = 100% Matte Sn

L = SnPb (5% Pb

minimum)

See

"Packaging

C-Spec

Ordering

Options

Table"

Additional termination finish options may be available. Contact KEMET for details.

SnPb termination finish option is not available on automotive grade product.

Built Into Tomorrow

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1015_X7R_FF-CAP_SMD • 9/14/2020

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Automotive C-Spec Information

KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.

Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive

Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process

warrant (PPAP).

Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”

This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade

component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a

KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are

not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited

(see details below.)

Product Change Notification (PCN)

The KEMET product change notification system is used to communicate primarily the following types of changes:

• Product/process changes that affect product form, fit, function, and/or reliability

• Changes in manufacturing site

• Product obsolescence

KEMET Automotive

C-Spec

KEMET assigned

AUTO

Customer Notification Due To:

Process/Product change

Yes (with approval and sign off)

Yes (without approval)

Obsolescence*

Yes

Days Prior To

Implementation

180 days minimum

90 days minimum

KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.

Production Part Approval Process (PPAP)

The purpose of the Production Part Approval Process is:

• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.

• To provide the evidence that all customer engineering design records and specification requirements are properly

understood and fulfilled by the manufacturing organization.

• To demonstrate that the established manufacturing process has the potential to produce the part.

KEMET Automotive

C-Spec

KEMET assigned

AUTO

PPAP (Product Part Approval Process) Level

●

○

●

KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.

●

Part number specific PPAP available

○

Product family PPAP only

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1015_X7R_FF-CAP_SMD • 9/14/2020

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