A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
Competition details: [url=https://www.eeworld.com.cn/huodong/Gigadevice_GD32F350Contest_201808/]Click here to learn more[/url] First of all, thank all the engineers, students, and electronics enthusia...
Hello, teachers. I would like to ask you a question. I bought two cc1310-tc-008 433MHZ modules and want to order the cc1310 launch pad development version for study. After checking the information, I ...
Is it necessary to create a device to filter the callee? Or can I directly construct an IRP and send it to the callee? When I use App to call the IOCTL of driver B, it returns quickly. However, when I...
I want to make a 10GE network transmission module and use the VSC8486 chip from VITESSE. However, the data sheet and reference design of this chip are locked and cannot be viewed on the official websi...
1. Introduction
Since the 1980s, with the continuous development of automotive electronic technology, there are more and more electronic control units in automobiles, such as electronic fuel i...[Details]
This paper designs a dot matrix LED text display screen that is easy to update, expandable, and low-cost. The way to reduce costs is
① Use the Bluetooth data transmission function of mobile ph...[Details]
0 Introduction
With the development of society, people pay more and more attention to security work. Monitoring products have been used in various fields instead of being used only in importan...[Details]
Editor's note: In order to help technicians or engineers who have knowledge of PIC microcontroller assembly language quickly master the method of using C language to program PIC microcontrollers, t...[Details]
A standard cell
is an electrochemical
cell
used as a voltage reference standard in many electrical standards laboratories
. If properly maintained, standard cells are very stable. The ...[Details]
PV inverter manufacturer SMA has launched its first DC arc fault circuit interrupter (AFCI) PV inverter and has received UL certification.
The new SunnyBoy AFCI inverter models include 3000-US...[Details]
At very low temperatures, certain metals and alloys lose their resistance to electric
current
and become
superconductors
. Two parameters that are often measured are the transition ...[Details]
Spatial Division Multiplexing (SDM) MIMO processing can significantly improve spectrum efficiency and thus greatly increase the capacity of wireless communication systems. Spatial Division Multip...[Details]
LED light sources have many environmental advantages, but early products still have certain technical bottlenecks in heat dissipation and high brightness design that cannot be broken through....[Details]
0 Introduction
There are many types of sensors, and the working principles, measurement targets and measurement environments of different types of sensors vary greatly. The corresponding detection s...[Details]
The demand for improved healthcare environments is endless, so medical imaging equipment with higher resolution is needed to better observe the human body. High resolution brings problems with sign...[Details]
Battery clamps, commonly known as battery connectors, come in two sizes depending on the thickness of the battery terminals. One is the battery clamp used on thick terminals, with a positive termin...[Details]
Electrostatic coupling and interference occur when a charged object is close to the input of the circuit being measured. At low impedance, the effects of interference are not noticeable because th...[Details]
Designing low power circuits while achieving acceptable performance is a difficult task. Doing so in
the RF
bands increases the challenge dramatically. Today, nearly everything has wireless...[Details]
0 Introduction
In the design and construction of communication systems,
communication power supply
is called the heart of the communication system. The power supply system will dire...[Details]
GD32 MCU
京公网安备 11010802033920号
EEWORLD
