HSM123TL-E datasheet, PDF - EEWORLD Datasheet

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HSM123TL-E: Description0.1A, 2 ELEMENT, SILICON, SIGNAL DIODE, SC-59A, MPAK-3; CategoryDiscrete semiconductor diode; File Size80KB，5 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/; Environmental Compliance

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HSM123TL-E Overview

0.1A, 2 ELEMENT, SILICON, SIGNAL DIODE, SC-59A, MPAK-3

HSM123TL-E Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Renesas Electronics Corporation
Parts packaging code	SC-59A
package instruction	SC-59A, MPAK-3
Contacts	3
Reach Compliance Code	unknown
ECCN code	EAR99
Configuration	SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode component materials	SILICON
Diode type	RECTIFIER DIODE
JESD-30 code	R-PDSO-G3
JESD-609 code	e6
Humidity sensitivity level	1
Number of components	2
Number of terminals	3
Maximum operating temperature	150 °C
Maximum output current	0.1 A
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum reverse recovery time	0.003 µs
surface mount	YES
Terminal surface	TIN BISMUTH
Terminal form	GULL WING
Terminal location	DUAL
Maximum time at peak reflow temperature	20
Base Number Matches	1

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HSM123

Silicon Epitaxial Planar Diode for High Speed Switching

REJ03G0550-0800

Rev.8.00

Dec 12, 2008

Features

•

Low capacitance, proof against high voltage.

•

Fast recovery time. (trr = 3.0ns max)

•

MPAK package is suitable for high density surface mounting and high speed assembly.

Ordering Information

Part No

HSM123TL

HSM123TR

Laser Mark

Package Name

MPAK

Package Code

PLSP0003ZC-A

Taping Abbreviation

(Quantity)

TL (3,000 pcs / reel)

TR (3,000 pcs / reel)

Pin Arrangement

1. Cathode2

2. Anode1

3. Cathode1

Anode2

(Top View)

REJ03G0550-0800 Rev.8.00 Dec 12, 2008

Page 1 of 4

Sales Strategic Planning Div.

Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan

Notes:

1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes

warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property

rights or any other rights of Renesas or any third party with respect to the information in this document.

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but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.

3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass

destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws

and regulations, and procedures required by such laws and regulations.

4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this

document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,

please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be

disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com )

5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a

result of errors or omissions in the information included in this document.

6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability

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7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications

or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality

and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or

undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall

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8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:

(1) artificial life support devices or systems

(2) surgical implantations

(3) healthcare intervention (e.g., excision, administration of medication, etc.)

(4) any other purposes that pose a direct threat to human life

Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing

applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all

damages arising out of such applications.

9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range,

movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages

arising out of the use of Renesas products beyond such specified ranges.

10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain

rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage

caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and

malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software

alone is very difficult, please evaluate the safety of the final products or system manufactured by you.

11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as

swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products.

Renesas shall have no liability for damages arising out of such detachment.

12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas.

13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have

any other inquiries.

RENESAS SALES OFFICES

Refer to "http://www.renesas.com/en/network" for the latest and detailed information.

Renesas Technology America, Inc.

450 Holger Way, San Jose, CA 95134-1368, U.S.A

Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501

Renesas Technology Europe Limited

Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.

Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900

Renesas Technology (Shanghai) Co.,

Ltd.

Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120

Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7858/7898

Renesas Technology Hong Kong Ltd.

7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong

Tel: <852> 2265-6688, Fax: <852> 2377-3473

Renesas Technology Taiwan Co.,

Ltd.

10th Floor, No.99, Fushing North Road, Taipei, Taiwan

Tel: <886> (2) 2715-2888, Fax: <886> (2) 3518-3399

Renesas Technology Singapore Pte. Ltd.

1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632

Tel: <65> 6213-0200, Fax: <65> 6278-8001

Renesas Technology Korea Co., Ltd.

Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea

Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145

http://www.renesas.com

Renesas Technology Malaysia Sdn. Bhd

Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia

Tel: <603> 7955-9390, Fax: <603> 7955-9510

Colophon .7.2

HSM123TL-E Related Products

	HSM123TL-E	HSM123TR-E
Description	0.1A, 2 ELEMENT, SILICON, SIGNAL DIODE, SC-59A, MPAK-3	0.1A, 2 ELEMENT, SILICON, SIGNAL DIODE, SC-59A, MPAK-3
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation
Parts packaging code	SC-59A	SC-59A
package instruction	SC-59A, MPAK-3	SC-59A, MPAK-3
Contacts	3	3
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Configuration	SERIES CONNECTED, CENTER TAP, 2 ELEMENTS	SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode component materials	SILICON	SILICON
Diode type	RECTIFIER DIODE	RECTIFIER DIODE
JESD-30 code	R-PDSO-G3	R-PDSO-G3
JESD-609 code	e6	e6
Humidity sensitivity level	1	1
Number of components	2	2
Number of terminals	3	3
Maximum operating temperature	150 °C	150 °C
Maximum output current	0.1 A	0.1 A
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260	260
Certification status	Not Qualified	Not Qualified
Maximum reverse recovery time	0.003 µs	0.003 µs
surface mount	YES	YES
Terminal surface	TIN BISMUTH	TIN BISMUTH
Terminal form	GULL WING	GULL WING
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	20	20

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