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KMM5816100-6

Description
Fast Page DRAM Module, 16MX8, 60ns, CMOS, SIMM-30
Categorystorage    storage   
File Size276KB,10 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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KMM5816100-6 Overview

Fast Page DRAM Module, 16MX8, 60ns, CMOS, SIMM-30

KMM5816100-6 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeSIMM
package instructionSIMM, SIM30
Contacts30
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE
Maximum access time60 ns
Other featuresRAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
I/O typeCOMMON
JESD-30 codeR-XSMA-N30
memory density134217728 bit
Memory IC TypeFAST PAGE DRAM MODULE
memory width8
Number of functions1
Number of ports1
Number of terminals30
word count16777216 words
character code16000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16MX8
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeSIMM
Encapsulate equivalent codeSIM30
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply5 V
Certification statusNot Qualified
refresh cycle2048
Maximum seat height22.86 mm
Maximum standby current0.008 A
Maximum slew rate0.88 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch2.54 mm
Terminal locationSINGLE
Base Number Matches1

KMM5816100-6 Related Products

KMM5816100-6 KMM5816100-7 KMM5816100-8
Description Fast Page DRAM Module, 16MX8, 60ns, CMOS, SIMM-30 Fast Page DRAM Module, 16MX8, 70ns, CMOS, SIMM-30 Fast Page DRAM Module, 16MX8, 80ns, CMOS, SIMM-30
Maker SAMSUNG SAMSUNG SAMSUNG
Parts packaging code SIMM SIMM SIMM
package instruction SIMM, SIM30 SIMM, SIM30 SIMM, SIM30
Contacts 30 30 30
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
access mode FAST PAGE FAST PAGE FAST PAGE
Maximum access time 60 ns 70 ns 80 ns
Other features RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
I/O type COMMON COMMON COMMON
JESD-30 code R-XSMA-N30 R-XSMA-N30 R-XSMA-N30
memory density 134217728 bit 134217728 bit 134217728 bit
Memory IC Type FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
memory width 8 8 8
Number of functions 1 1 1
Number of ports 1 1 1
Number of terminals 30 30 30
word count 16777216 words 16777216 words 16777216 words
character code 16000000 16000000 16000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 16MX8 16MX8 16MX8
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code SIMM SIMM SIMM
Encapsulate equivalent code SIM30 SIM30 SIM30
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
refresh cycle 2048 2048 2048
Maximum seat height 22.86 mm 22.86 mm 22.86 mm
Maximum standby current 0.008 A 0.008 A 0.008 A
Maximum slew rate 0.88 mA 0.8 mA 0.72 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO NO
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD
Terminal pitch 2.54 mm 2.54 mm 2.54 mm
Terminal location SINGLE SINGLE SINGLE
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